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Note from the Editor:
ASME Electronic and
Welcome to the second issue of the official e-newsletter of The
Journal of Electronic Packaging (JEP).
Photonic Division (EPPD)
The newsletter, issued quarterly, will keep you abreast of the latest
research developments in our field. Below you will find links to free
article downloads, the most recent issue's table of contents, and a
hand-picked list of papers chosen by the editor. In addition, you will
find a link for providing feedback and suggestions for this newsletter.
Events
Thank you for taking the time to read this newsletter and please don't
hesitate to provide feedback by emailing me at my address below.
San Francisco, CA.
Mechanical Engineering
YC Lee
Congress & Exposition,
Editor, Journal of Electronic Packaging
November 13-19, 2015,
Houston, TX.
Leeyc@Colorado.edu
Send an email to us if you
would like to post your
events in future
newsletters.
JEP Review Articles!

July 6-9, 2015,
ASME 2015 International
Sincerely,

ASME InterPACK,
Overview and Outlook of 3D IC Packaging, 3D IC
Integration, and 3D Si Integration, John Lau (ASM
Pacific Technology)
Two-Phase Thermal Ground Planes: Technology
Development and Parametric Results, Avram Bar1
Announcements
A Major US $75M
Initiative in Packaging
and Manufacturing:
Cohen (DARPA), Kaiser Matin (System Planning Co.),
Nicholas Jankowski (U.S. Army Research Laboratory),
Darin Sharar (General Technical Services LLC)
Flexible Hybrid Electronics
Manufacturing Innovation
Institute
If you would like to get free PDF files of these articles, Click here to
email a request to asmejep@gmail.com
Upcoming Free Downloads of JEP Review Articles

Thermal management in data centers, NSF Center for
Energy-Smart Electronic Systems

Packaging for power modules, Fuji Electric

Nanothermal interfaces- DARPA
Journal of Electronic
Packaging Associate Editors
Mehmet Arik, PhD
Ozyegin University
Mehdi Asheghi, PhD
Stanford University
NOTE: These free downloads will be available in a couple of
months. Sign up to join a free ASME JEP Group established online and check their availability through ASME JEP Community.
In addition, there are twelve additional review articles to be
published in 2015-2016. Click here to see the list. Leaders in
the field are invited to publish review articles on hot, emerging
and fundamental topics.
Satish Chaparala, PhD
Corning Inc.
Paul Conway, PhD
Loughborough University
Pradip Dutta, PhD
Indian Institute of Science
Ashish Gupta, PhD
Intel Corp.
2014 JEP Awards



JEP Best Paper Award- "Modeling of Two-Phase
Evaporative Heat Transfer in Three-Dimensional MultiCavity High Performance Microprocessor Chip Stacks" by
Yassir Madhour, Brian P. d'Entremont, Jackson Braz
Marcinichen, Bruno Michel, John Richard Thome. John R.
Thome is Professor of Heat and Mass Transfer at the
Ecole Polytechnique Fédérale de Lausanne (EPFL),
Switzerland (http://ltcm.epfl.ch/); he is the founder of
Virtual International Research Institute on Two-Phase Flow
and Heat Transfer (http://2phaseflow.org/). He is the editor
of the new 8-volume series Encyclopedia of Two-Phase
Heat Transfer and Flow, coming out in April 2015.
.
JEP Associate Editor Award- Yi-Shao Lai - Dr. Lai is a
Director with Advanced Semiconductor Engineering (ASE),
Inc. and an Adjunct Assistant Professor with National Sun
Yat-sen University. Dr. Lai has over 600 technical
publications and more than 95 patents. He has been a JEP
Associate Editor covering engineering mechanics since
June 2013
.
JEP Reviewer Award - Takashi Fukue - Dr. Fukue is
an Assistant Professor of Department of Mechanical
Engineering at Iwate University, Japan. His current
interests include flow and heat transfer control and an
optimization of thermal design in electronic equipment.
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Madhusudan Iyengar, PhD
Google, Inc.
Yi-Shao Lai, PhD
Advanced Semiconductor
Engineering (ASE), Inc.
Shi-Wei Ricky Lee, PhD
The Hong Kong University
of Science and Technology
(HKUST)
Seungbae (SB) Park, PhD
State University of New
York at Binghamton
Mark D. Poliks, PhD
State University of New
York at Binghamton
Jeffrey C. Suhling, PhD
Auburn University
Sandeep Tonapi, PhD
Anveshak Technology and
Knowledge Solutions
Tse Eric Wong, PhD
Raytheon Company
Editor's Picks - Selected Papers
Design and Control of the IBM Power 775 Supercomputer Water
Conditioning Unit, Michael J. Ellsworth, Jr., Randy J. Zoodsma,
Frank Cascio and Eileen Behrendt
Journal of Electronic
Packaging - Guest
Editors
Determination of the Lumped-Capacitance Parameters of AirCooled Servers Through Air Temperature Measurements, Amza
Salih Erden; H. Ezzat Khalifa; Roger R. Schmidt
Felix Chen, PhD
Microsoft Corp.
Experimental Characterization of Various Cold Aisle Containment
Configurations for Data Centers, Vikneshan Sundaralingam,
Vaibhav K. Arghode, Yogendra Joshi and Wally Phelps
Tong Cui, PhD
Qualcomm Corp.
Three-Dimensional and 2.5 Dimensional Interconnection
Technology: State of the Art, Dapeng Liu and Seungbae Park
Effect of Through-Silicon-Via Joule Heating on Device
Performance for Low-Powered Mobile Applications , Fahad Mirza,
Gaurang Naware, Ankur Jain and Dereje Agonafer
Study on Heat Conduction in a Simulated Multicore Processor
Chip�Part II: Case Studies, Wataru Nakayama
Application of Kriging and Radial Basis Function for Reliability
Optimization in Power Modules, Pushparajah Rajaguru, Stoyan
Stoyanov, Hua Lu and Chris Bailey
Statistical Manufacturing Model of Printing Technology, Nam-Soo
Kim, Sarah Luna, Jung-Hyou Lee and Tae-Eui Jeong
Comparison of Electronic Component Durability Under Uniaxial
and Multiaxial Random Vibrations , Matthew Ernst, Ed Habtour,
Abhijit Dasgupta, Michael Pohland, Mark Robeson and Mark
Paulus
Shidong Li, PhD
MAS Inc.
Susan Lu, PhD
State University of New
York at Binghamton
Kaustubh Nagaarkar, PhD
GE Global Research
Saurabh Shrivastava, PhD
Panduit Corp.
Gongan Xie, PhD
Northwestern Polytechnical
University
Xiaobing Luo, PhD
Huazhong Univ. of Sci.&
Tec.
Kyoung-sik Moon, PhD
Georgia Institute of
Technology
Toru Ikeda, PhD
Kagoshima University
Journal of Electronic Packaging
Click here for the March 2015 Table of Contents
Electronic Packaging "Flashes"
Courtesy of Binghamton University Small Scale Systems
Integration Center
Paper electronics could make health care more accessible
Flexible electronic sensors based on paper have the potential to
cut the price of a wide range of medical tools, from helpful robots
to diagnostic tests. Scientists have now developed a fast, lowcost way of making these sensors by directly printing conductive
ink on paper. The researchers developed a system for printing a
pattern of silver ink on paper within a few minutes and then
hardening it with the light of a camera flash. The resulting device
responded to touch even when curved, folded 15 times, and rolled
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Ronggui Yang, PhD
University of Colorado
and unrolled 5,000 times. The team concluded their durable,
lightweight sensor could serve as the basis for many useful
applications.
Researchers develop heat-conducting plastic
The spaghetti-like internal structure of most plastics makes it hard
for them to cast away heat, but a Univ. of Michigan research team
has made a plastic blend that does so 10 times better than its
conventional counterparts. Plastics are inexpensive, lightweight
and flexible, but because they restrict the flow of heat, their use
is limited in technologies like computers, smartphones, cars or
airplanes. The new work could lead to light, versatile, metalreplacement materials that make possible more powerful
electronics or more efficient vehicle. The new material results
from one of the first attempts to engineer the flow of heat in an
amorphous polymer.
Shaping the future of energy storage with conductive clay
Materials scientists have invented clay, which is both highly
conductive and can easily be molded into a variety of shapes and
sizes. It represents a turn away from the rather complicated and
costly processing -- currently used to make materials for lithiumion batteries and supercapacitors -- and toward one that looks a
bit like rolling out cookie dough with results that are even sweeter
from an energy storage standpoint.
New Material for Solar Cells and Flexible Electronics
Physicists at the University of Kansas have fabricated an
innovative substance from two different atomic sheets that
interlock much like Lego toy bricks. The researchers said the new
material--made of a layer of graphene and a layer of tungsten
disulfide--could be used in solar cells and flexible electronics.
Researchers created the new material with the aim of developing
novel materials for efficient solar cells.
Details of the above articles are available on the ASME JEP
Community website
Paper Review in 16 Weeks
Yes, we have established a system that will make sure the review
of every paper submitted to the journal will be completed in 16
weeks. If the author does not receive our decision (accept as is,
revisions required, or not acceptable), feel free to contact the
Editor. You are welcome to submit your manuscript.
About Journal of Electronic Packaging
Editor, Y. C. Lee,
University of Colorado Boulder
JEP Home Page, Editorial Board.
The Journal of Electronic Packaging publishes papers that address 1) thermal management, applied
mechanics and technologies for microsystems packaging; 2) critical issues in systems integration;
3) emerging packaging technologies and materials with micro/nano structures; and 4) general small
scale systems. The journal is to serve researchers and engineers working in academic and
industrial settings. Originality, scientific merit and high engineering relevance are the major criteria
for the acceptance of a submitted paper. In addition, leaders in the field are invited to publish review
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articles on hot, emerging and fundamental topics. See letter from editors for the transition. Send an
email to asmejep@gmail.com for any feedback or comments.
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