gases and TECHNOLOGY www.gasesandtechnology.com gases technology JANUARY/FEBRUARY • 2007 gases ™ The Magazine for news and technical developments in high technology gas markets gases St. Louis Fire: The Aftermath Maximizing Throughput in GC Electronic Pressure Control Pittcon Product Showcase PLUS: News of Companies • Management Management • People • Products • Stock Stock Watch Watch • Industry Events We officially support and endorse the following major industry events: GASES AND TECHNOLOGY V O L . 4 • N O . 6 GASES AND TECHNOLOGY V O L . 6 • N O . 1 Gases&Technology FEATURE Maximizing Sample Throughput in Gas Chromatography A N D R E W T I P L E R A N D M A R K C O L L I N S By focusing on critical design elements, a significant time savings can be realized. Introduction In today’s economy, improving efficiency and maximizing productivity are the keys to success. As with many analytical techniques, most gas chromatography (GC) analyses utilize established methods. The goal in designing a new high performance GC oven was to provide significant benefits in terms of sample throughput while at the same time allowing full compatibility with established methods. Further, the design should support standard injectors, detectors, pneumatics and columns, so that established methods and laboratory standard operating protocols (SOPs) could be followed without modification. In addition, a new GC oven design should support a migration path towards faster chromatography for those GC users wanting a lowrisk opportunity to explore such capabilities. Figure 1: GC oven design showing the air flow paths GC Oven Design The new GC uses an air-bath oven where a large fan is used to mix the air inside the oven during heating in order to assist with the exchange of the hot air with ambient during cooling. In this design (patent pending) a novel dual-walled oven approach has been adopted. The inner chamber of the oven holds the GC column, and injector and detector ports. This inner chamber is surrounded by a second wall that serves to reduce the heat loss from the inner chamber during heating and so improves the heating rate and minimizes temperature non-uniformity (gra- gases and TECHNOLOGY dients). A key factor in accomplishing faster sample injection-to-injection time is fast cooling. To achieve fast cooling rates, the oven was designed with a circular door mounted concentrically to the large oven fan as shown in Figure 1. During cooling, ambient air enters the inner chamber via the door, which is mounted behind and concentric to the fan. The hot air exits through the outer wall and out of the oven through a door that opens at the base and to a vent. During analysis, the dual-walls of the oven further insulate the inner oven from the outer oven walls and therefore helps minimize heat losses during heating, and also heat coming into the oven from the walls during operation at a low starting temperature. January/February 2007 Gases&TechnologyFEATURE Fast Cooling This oven design allows cooling from 450°C to 50°C in about 1.6 minutes. To perform this analysis, a thermocouple was placed inside the oven to record the data during cooling. Figure 2 demonstrates the cooling performance of the oven. In addition, the time required to cool down to even lower temperatures has been significantly improved—about 2 minutes to 40°C and just 4 min- A key factor in accomplishing faster sample injection-toinjection time is fast cooling. utes to 30°C with an ambient temperature of 23°C. This cool-down performance allows chromatography at these near ambient temperatures to become practical. Most ovens will cool to 30°C but this may take many minutes to achieve. The cooling algorithm includes a 1-minute stabilization time to achieve a steady temperature. The need for additional equilibration time is thus eliminated. While such cooling performance is a very welcome development, it does introduce some undesirable effects. The first concern is that, in some instances, the carrier gas inside the column contracts during rapid cooling at a rate faster than the carrier gas entering into the column inlet from the injector. This has the resultant effect of producing a partial vacuum at the column outlet. As the column outlet normally resides inside a detector, vapors inside that detector will be drawn back into the column during Figure 2: GC oven-cooling performance curves Figure 3: System for doping helium carrier gas with methane Figure 4: Flow rate versus response calibration January/February 2007 gases and TECHNOLOGY Gases&TechnologyFEATURE Figure 5: Flow rate into detector with the fast cooling GC oven Column: 60 m x 0.25 mm x 1.0 µm 5% Ph/Me Silicone Oven: Clarus 600 GC, cooling from 280°C to 50°C Carrier Gas: Helium at 25 psig Injector: 100 mL/min split at 375 °C Detector: Flame ionization at 400 °C Figure 7: Example of the use of SOFTcooling to limit the oven cooling rate to 300 °C/min using conditions given for Figure 5 rapid cooling. Such vapors may be hostile to the still hot column. Secondly, some columns generate significant stationary phase bleed when operated at temperatures close to their specified limit. A fast cooling oven may “chill” this bleed so that it collects in pockets along the column. When the column is next-temperature programmed, these focused areas of bleed will manifest themselves as “ghost peaks”. The system shown in Figure 3 was used to study the behavior of the carrier gas at the column-detector interface during column cooling. Essentially, this system dopes the carrier gas (helium) with a fixed concentra- gases and TECHNOLOGY Figure 6: SOFTcooling to a temperature limit Figure 8: Example of the use of SOFTcooling to limit the oven cooling rate to a given temperature threshold tion of methane. The flame ionization detector will give a response proportional to the mass flow rate of methane and hence the mass flow rate of the carrier gas, helium, as shown in Figure 4. Using the test rig shown in Figure 3, the FID signal was monitored during cooling of the experimental fast cooling oven with the result shown in Figure 5. The signal disappears completely soon after the onset of cooling, indicating that the flow of carrier gas into the detector has actually stopped. At this point, the temperature of the column is still very high. Oven-control software called SOFTcooling™ has been developed to limit the maximum cool-down rate by throttling the ambient air intake during cooling. Such an algorithm will only affect the initial cooling rate and will have a low effect on the total time required to completely cool the oven for the next run as shown in Figures 6 and 7. SOFTcooling The SOFTcooling approach described above may also be used to mitigate the ghost peak effects. In this instance, the oven must be cooled at a much slower rate to allow dissipation of the column bleed so that “focused” condensation within January/February 2007 Gases&TechnologyFEATURE Figure 9: Examples of different SOFTcooling rates from 350°C to 250°C to assess their effect on the creation of ghost peaks; GC conditions are provided below Column: 60 m x 0.25 mm x 1.0 µm 5% Ph/Me Silicone Oven: Clarus 600, 50 °C(1min) – 20°C/min – 350°C(15min) Carrier gas: Helium at 25 psig Injector: 100 mL/min split at 375 °C Detector: Flame ionization at 400 °C Figure 10: Heating rate at 230 V with fast 2000-watt heater Figure 12: Very light crude oil with high-power heater Figure 11: Diesel oil with high-power heater the column does not occur. Once a temperature has been reached at which column bleed has effectively disappeared from the carrier gas, ballistic cooling of the GC oven may be resumed. The SOFTcooling algorithm is essentially the same as before except that now a temperature threshold is applied as shown in Figures 8. Figure 9 shows “chromatograms” of ghost peaks at different cooling rates. Once the rate is reduced to 25°C/min on this 60 m x 0.25 mm x 1.0 µm 5% Phenyl/Methyl Silicone column, the ghost peaks are eliminated. January/February 2007 GC oven heating rates If a higher supply voltage is available, the GC oven can be supplied with a higher-power (2000-watt) heater to increase the potential programming rates as shown in Figure 10. High-speed chromatography Figures 11–14 show examples of fast chromatography showing excellent peak shape. For diesel oil, the separation is complete in 3.8 minutes; for very light crude the separation is complete in just under 4 minutes; and for C6–C44 the sepa- ration is complete in under 6.5 minutes. Figure 14 provides an example of fast chromatography showing excellent peak shape for a gas oil cut. The separation is complete in just over 4 minutes. Autosampler pre-rinse to speed up the analytical cycle time Having significantly improved the oven cool-down time, the next step was to address the autosampler rinsing and priming of the syringe. Figure 15 shows the timing of a typical analysis. The chromatogra- gases and TECHNOLOGY Gases&TechnologyFEATURE Figure 13: C6–C44 ASTM D2887 calibration standard with highpower heater phy normally occupies the bulk of the time and we can reduce this because of the increased oven heating rates. In terms of analytical throughput this is the only productive time. For temperature programming, the oven cooling time may be significant; we have reduced this dramatically on the Clarus 600 GC. The rest of the time is spent inbetween runs performing diagnostic checks, equilibrating the system and, most significantly, preparing the autosampler for the next injection. The autosampler will start to operate once the GC becomes ready. As a result, the GC sits idle and ready for injection but still has to wait for the autosampler to go through its various steps in rinsing the syringe and priming it with sample. By changing the system timing to initiate autosampler operation in advance of the GC becoming ready, reduction in analytical cycle time can be achieved by several minutes. The system now calculates the length of time to process all the steps in the GC necessary to become ready and together with the time needed to prepare the syringe with sample, and is so able to start the autosampler at the optimum moment: the autosampler injects at the same time the GC becomes ready. In practice though, we start the last step (Sample Pump) when the GC is ready; this is to prevent the gases and TECHNOLOGY Figure 14: Gas oil cut with high-power heater syringe from sitting with sample for extended periods if there is an interruption to the normal operation. The timing diagram now looks like the chart shown in Figure 16. Note how the ready time is much By changing the system timing to initiate autosampler operation in advance of the GC becoming ready, reduction in analytical cycle time can be achieved. reduced from the last chart. This feature can save several minutes under some conditions. Conclusions In improving analysis, all aspects of high speed GC were taken into consideration including the use of short columns, narrow-bore columns, thin film columns, fast temperature programs, and high carrier gas flow rates. The GC oven enables faster chromatography immediately using existing methods and delivering increased throughput and productivity: typically 3.5 minutes for each temperature-programmed cooling, and typically 1.5 minutes for each autosampler injection. The GC oven also delivers highspeed temperature programming, enabling even more time savings with faster chromatography and the capability of chromatography at near-ambient temperatures with practical and acceptable cycle times for highly volatile compounds. The analytical sample time can be reduced by several minutes if the system timing is changed to initiate autosampling while the GC is getting ready, a period of time that is nonproductive. The system calculates that period of time and compares it with the period needed to prepare the syringe with sample, then initiates the autosampler so it is ready to inject at that moment when the GC is ready for its new sample. Fast oven cooling, although simple in concept, does require some special care in its implementation. As illustrated in this paper, fast cooling can introduce two significant problems that can affect the integrity of the column and the analytical data. Techniques like SOFTcooling, as implemented on the GC oven, may be utilized to minimize or even eliminate any impact from the effects produced by fast cooling rates. Slight SOFTcooling totally eliminates the detector gas ingress effect January/February 2007 Gases&TechnologyFEATURE Figure 15: GC run timing and stronger SOFTcooling is required to eliminate the ghost peak effect. This is only necessary to reduce the column temperature to a point where bleed levels are very low. Ballistic cooling may then resume. Acknowledgements The authors wish to acknowledge and thank the entire development, engineering and manufacturing team at PerkinElmer for the innovative design, development and production of this oven that facilitates high speed GC. Andrew Tipler is Senior Staff Scientist, Chromatography Business Unit, PerkinElmer Inc., 710 Bridgeport Ave., Shelton, CT 06484. He has been with January/February 2007 Figure 16: Final GC run timing PerkinElmer for 24 years. Throughout that time, he has been responsible for developing new technologies and applications for the company’s GC product line— these include gas chromatographs, headspace samplers and thermal desorption systems. He has been awarded 9 patents for innovations in GC and has presented papers at many international symposia. He can be reached at 203-925-4600 or andrew.tipler@perkinelmer.com Mark Collins, Ph.D., Gas Chromatography Product Manager, Chromatography Business Unit, PerkinElmer LAS. He has been with PerkinElmer for 11 years. Throughout that time, he has been responsible for product and marketing management for the company’s GC product line. These include portable analytical instruments, gas chromatographs, GC/MS systems, headspace samplers and thermal desorption systems. He has presented papers at many international symposia. He can be reached at 203-9254600 or mark.collins@perkinelmer.com Note: Gases and Technology periodically publishes articles about the technology of new products or innovative technologies introduced into existing products. This is to explain the technology in a non-commercial way to inform possible endusers of the technology that may suit their application. Gases and Technology does not verify the test results noted, nor does Gases and Technology endorse these products. The technology is presented for information purposes only. gases and TECHNOLOGY 007811_01
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