1. No category

Tillverkning av ett
Dubbelsidigt Flex Kort!
Jag gillar komplicerade
funktioner gjorda av
sofistikerade material
på en liten yta!
Elektronik Konstruktören
Vad är IPC-7351B
Mina footprints
är från 1903!
CADDAREN
Ritningar och
Filer för
Stansverktyg
IPC-2223B
IPC-7351B
IPC-2581
Preparering av:
•Cover lager
•Lödmask
•Stiffener
•Ritningar
IPC-4202A
IPC-4101C
PI
Cover
Layer
IPC-4203
IPC-4204
FR4
Stiffener
DATA from
CAM
Exempel 2-Lager FLEX
Topp
Botten
Förbättringsförslag?
Exempel 2-Lager FLEX
Topp
Botten
Tillverkningspanel
Tillverkningspanel
Qualification and Performance
Specification
for Rigid Printed Boards
The BIG question is:
Class 1?
Class 2?
Class 3?
IPC-6011
IPC-6013B
IPC
Qualification for
Printed Board Design
• IPC-6010 series
– IPC-6011. General.
– IPC-6013B Flex.
IPC-6013B
Qualification and Performance
Specification
for Rigid Printed Boards
IPC-6010
IPC-6011
IPC-6013B
Tillverkning av ett
Dubbelsidigt Flex Kort!
Double side Flexible PCB Flow Chart
Double side
base film
PI
Etching
Drilling
Laser or
Mechanical
AOI
Chemical
Cu 2-3 µm
Cover Lay
Alignment
Electrical
Plating 10 µm
Cover Lay
Lamination
Image
No
Inspection
OK?
Yes
Surface
Finish
Stiffener
Assembly
Silkscreen
Inspection
El. Test
Packing
Outline
Delivery
Repair
Scrap
IPC-4202A
IPC-4101C
PI
Cover
Layer
IPC-4203
IPC-4204
FR4
Stiffener
DATA from
CAM
Laminat
Double-sided Flexible Cu Clad Laminat
Cu Film
Adhesive
PI Film
Cu Film
Bas Flex Laminat
Inkl. Adhesive Akryl 2 x 25µm
Standard Tjocklek: 12,5, 25 elelr 50 µm PI
Standard Cu folie: 17,5 eller 35 µm.
Standard Material: Polyimide (PI)
Rolling (RA) eller Electro Deposit (ED) Cu Foil
STACK-UP Double side + Stiffener
Thickness in µm
12,5
5-15
18
13
12,5
13
18
5-15
129,5
12,5
40
125
294,5
Cover Lay PI
Cover Lay Adhesive (Acrylic)
Copper
Adhesive
Polyimide (PI)
Adhesive
Copper
Cover Lay Adhesive
Cover Lay PI
Adhesive
Stiffener PI
STACK-UP Double side + Stiffener
Thickness in µm
12,5
15
18
13
12,5
13
18
15
129,5
12,5
50
Cover Lay PI
Cover Lay Adhesive (Acrylic)
Copper
Adhesive
Polyimide (PI)
Adhesive
Copper
Cover Lay Adhesive
Cover Lay PI
Adhesive PSA
800
Stiffener FR4
979,5
IPC-4202
IPC-4101C
PI
Cut PI
panel
Cover
Layer
IPC-4203
IPC-4204
FR4
Stiffener
DATA from
CAM
Tillverkningspanel
Pressad med eller utan Lim
Bas Laminat för FLEX
Cu 17,5 µm
PI, 2 x 17,5µm 0,05 mm
Polyimide
PI
Laser
Drilling DATA from
CAM
Stacking
Cut PI
panel
Drilling
Laserborrning av hål
PI
Laser
Drilling DATA from
CAM
Stacking
Cut PI
panel
Drilling
Chemical
Plating 2-3µm
DATA from
CAM
Laser
plotter Exposure
Mylar removal
Developing
Etch Cu
Stripping
Inspect
El Plating
Cu 12µm
Inspect
El Plating
Cu 12µm
AOI
Tillverkningspanel
Inspect
El Plating
Cu 12µm
AOI
Cover lay
Alignment &
Lamination
FLEX & FLEX RIGID
DATA from
CAM
Cover Lager preparation
Mekaniskt eller Laser
Tillverkningspanel med
Cover Lager
Adhesive
Cu Lager
PI Lager
Inspection
Silkscreen
1.
2.
3.
4.
5.
6.
HASL SnPb
HASL SnCu
ENIG
Immersion Ag
Immersion Sn
OSP
HASL
Silkscreen
Electrical
Test
Stiffener Assembling
Delivery
Stiffener
Punching
Outline
Tillverkningspanel
Outline
Double side Flexible PCB Flow Chart
Double side
base film
PI
Etching
Drilling
Laser or
Mechanical
AOI
Chemical
Cu 2-3 µm
Cover Lay
Alignment
Electrical
Plating 10 µm
Cover Lay
Lamination
Image
No
Inspection
OK?
Yes
Surface
Finish
Stiffener
Assembly
Silkscreen
Inspection
El. Test
Packing
Outline
Delivery
Repair
Scrap
Tillverkning av ett
8-Lagers FLEX-RIGID
Ett färdigt 8-Lager Flex-Rigid Kort
Ritningar och
Filer för
Stansverktyg
IPC-2223B
IPC-7351A
IPC-2581
Preparering av:
•Cover lager
•Lödmask
•Stiffener
•Ritningar
Uppbyggnaden av ett 8-Lagers FR
1
8-Layer Flex-Rigid PCB Flow Chart 1
Double side
base film PI
for IL
Etching
Inspection
Black
Oxide
C
U
T
Laminating
Dry Film
Stripping
Exposure &
Mylar
Removal
AOI
Cover Lay
Application
Developing
Cover Lay
Lamination
Optical
Registration
Transportation to
Multi-Layer Lay up
Riveting
IPC-4202A
IPC-4101C
PI
Cover
Layer
IPC-4203
IPC-4204
FR4
Stiffener
DATA from
CAM
PI
Cutter
DATA from
CAM
Tillverkningspanel
Laser
Plotter
DATA from
CAM
Lamination
m
Laser
Plotter Exposure
Mylar removal
Developing
Etching
Lamination
Stripping
AOI
Inspect
El Plating
Cu 12µm
AOI
Cover lay
Alignment &
Lamination
FLEX & FLEX RIGID
DATA from
CAM
Cover Lager preparation
Mekaniskt eller Laser
Lay up
Press
Black
Oxide
Optical
Registration
Flex kärnan är avbildad och etsad
1
Cover lagren är
preparerade och laminerade
The build up of an 8-Layer FR
2
1
2
8-Layer Flex-Rigid PCB Flow Chart 2
Double side
FR4 base
material
for IL
Etching
Laminating
Dry Film
Stripping
Transportation to
Multi-Layer Lay up
AOI
Exposure &
Mylar
Removal
Optical
Registration
Developing
Black
Oxide
Laser
Plotter
DATA from
CAM
Lamination
m
Laser
Plotter Exposure
Mylar removal
Developing
Etching
Lamination
Stripping
AOI
Black
Oxide
Optical
Registration
Lay up
Press
Black
Oxide
Optical
Registration
8-Layer Flex-Rigid PCB Flow Chart 3
Flex IL plus
2 x FR4 IL
Lay up of
Precut
NF Prepreg
Drilling
Mechanical
Exposure
Mylar removal
Soldermask
Lay up of
Teflon
release part
Lay up of
FR4 IL &
Prepreg
Plasma
Chemical
Cu 2-3µm
Deburring
Developing
Surface
Finish
El. Plating
25-30 µm
Silkscreen
Etching
Profile
ML
Press
Laminate
Dry film
AOI
E-Test
Delivery
No-flow Prepreg and fillers are pre cut
and prepared
Fillers Teflon
3
Prepreg
Multi-Layer Lay Up
Inner layers and prepregs and foils are added
3
Everything are pressed together
Teflon part 0,2-0,3 mm
PI
Laser
Drilling DATA from
CAM
Stacking
Cut PI
panel
Drilling
Chemical
Plating 2-3µm
Holes are drilled and
electroless copper processed
DATA from
CAM
Laser
plotter Exposure
Mylar removal
Developing
Etch Cu
Stripping
Inspect
El Plating
Cu 25µm
Stripping
Sn resist
Inspect
El Plating
Cu 25µm El Plating
Sn 4-5µm
Stripping
AOI
Etch Cu
Holes and pattern are plated,
pattern are etched
AOI
Soldermask
application
IPC-SM-840D
Exposure
Developing
Cure
Inspection
Silkscreen
1.
2.
3.
4.
5.
6.
HASL SnPb
HASL SnCu
ENIG
Immersion Ag
Immersion Sn
OSP
HASL
Soldermask is applied,
exposed and developed
Electrical
Test
Stiffener Assembling
Delivery
Stiffener
Punching
Routing
Outline
Surface treatment is applied, board is
control dept routed to release flex part.
The 8-Layer Rigid-Flex
board is completed
8-Layer Flex-Rigid PCB Flow Chart 1
Double side
base film PI
for IL
C
U
T
Laminating
Dry Film
Etching
Stripping
Inspection
Plasma
Black
Oxide
Exposure &
Mylar
Removal
AOI
Cover Lay
Application
Developing
Cover Lay
Lamination
Optical
Registration
Transportation to
Multi-Layer Lay up
Riveting
8-Layer Flex-Rigid PCB Flow Chart 2
Double side
FR4 base
material
for IL
Etching
Laminating
Dry Film
Stripping
Transportation to
Multi-Layer Lay up
AOI
Exposure &
Mylar
Removal
Optical
Registration
Developing
Black
Oxide
8-Layer Flex-Rigid PCB Flow Chart 3
Flex IL plus
2 x FR4 IL
Lay up of
Precut
NF Prepreg
Drilling
Mechanical
Exposure
Mylar removal
Soldermask
Lay up of
Teflon
release part
Lay up of
FR4 IL &
Prepreg
Plasma
Chemical
Cu 2-3µm
Deburring
Developing
Surface
Finish
El. Plating
25-30 µm
Silkscreen
Etching
Profile
ML
Press
Laminate
Dry film
AOI
E-Test
Delivery
Robust Konstruktion
• Denna uppbyggnadsmetod är den mest
använda, och producerar de mest robusta
och tillförlitliga Flex-Rigid korten.
• Inget Lim i de pläterade hålen.
• En hård ytteryta (Rigid) för alla
komponentplaceringar, tillåter användandet
av en foto definierad lödmask.
IPC Standarder för
FLEX & FLEX RIGID
IPC-6011
IPC-6013B
IPC-600H
IPC-SM-840D
IPC-4552 IPC-4553A IPC-4554