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Testing and Certification Conference 2014
Global Opportunities and Challenges
[ 12-14 November 2014 ]
The Testing and Certification Conference 2014 – Global Opportunities and Challenges will be held in Hong
Kong, China, on 12-14 November 2014. The goal of the conference is to bring together leading engineers, scientists, researchers and academics from the world to discuss novel theories, technologies and applications in
the areas of testing and certification. The conference will feature prominent keynote speakers as well as technical sessions.
Testing and certification has been identified by the HKSAR Government as one of the six industries where
Hong Kong has good prospect for development. The Hong Kong Council for Testing and Certification (HKCTC)
was established by the HKSAR Government in 2009 to lead, support, advance and promote the development
of the industry. Hong Kong is in the leading position in providing academic training to Testing and Certification professionals up to Master degree level.
Authors are invited to submit full paper (Times New Roman, 12-point font, single spacing, 8 pages maximum) or
digest paper (Times New Roman, 12-point font, single
spacing, 2 pages maximum) for presentation in the conference by 10 Oct 2014. All submissions should be sent to
the Conference Technical Program Committee via email:
tcc2014@ouhk.edu.hk
All submissions will be reviewed by the members of the
Technical Program Committee of the conference. Accepted
papers will be presented at the conference and published
in the proceedings.
For details of paper submission, please refer to:
http://tcc2014.ouhk.edu.hk
Day 1: Free (Limited seats, registration is required)
Day 2 + Day 3: US$ 100 / HK$ 780
The Conference registration fee (Day 2 + Day 3) includes
coffee break refreshments, entry to technical paper
presentations, and transportation of the technical visit on
the corresponding date.
Conference Banquet fee: US$ 120 (1 person), US$ 600 (6
persons), US $1000 (12 persons) (Limited seats, registration is required)
For details of the registration, please refer to:
http://tcc2014.ouhk.edu.hk
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The organizing committee invites the submission of papers on, but not limit to, the following topics:
Quality assurance & management
Testing technologies, inspection & certification
Food safety & technology
Prospects, opportunities and challenges in testing and
certification industry
Product design, safety & reliability
Professional practice and ethics in testing & certification
Time
Programme
Test method development
9:00 – 9:15
Registration
Metrology & measurement
uncertainty
9:15
– 10:00 Travel by bus
Others
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10:00 – 12:00 Technical Visit:
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Science Park
Paper submission
deadline:
10 Oct 2014
Notification to ●authors
acceptance:
20Council
Oct 2014
Hongof
Kong
Productivity
Registration start
date:
10 Oct 2014
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HK Standard & Calibration Lab
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Jubilee College, The Open University of Hong Kong, 81
Chung Hau Street, Ho Man Tin, Hong Kong, China
Honorary Chair:
Prof. Y. S. WONG
The Open University of Hong Kong
Honorary Co-Chair:
Prof. K. C. HO
The Open University of Hong Kong
Position
Name
General Chair:
Dr. George LAU
The Open University of Hong Kong
Technical Program
Chair:
Dr. Fred LEE
The Open University of Hong Kong
Publicity Chair:
Dr. Eric SZE
The Open University of Hong Kong
Secretary:
Dr. Steven XU
The Open University of Hong Kong
Publication and Web Dr. Tony LEE
Chair:
The Open University of Hong Kong
Ir. S. L. MAK
The Open University of Hong Kong
Registration Chair:
Dr. Fiona FONG
The Open University of Hong Kong
Finance Chair:
Dr. Stanley SIU
The Open University of Hong Kong
Local Arrangement
Chair:
Ms. Fanny TANG
The Open University of Hong Kong
Name
Organization
Mr. Peter UNGER
Chairman, International Laboratory Accreditation Cooperation (ILAC)
Prof. C. F. CHEUNG
The Hong Kong Polytechnic University
Dr. S. W. CHEUNG
The University of Hong Kong
Dr. K. S. CHIN
City University of Hong Kong
Mr. Richard W. O’ BRIEN
Director, Office of International Programs & Intergovernmental Affairs, US CPSC
Prof. Fugee TSUNG
The Hong Kong University of Science and
Technology
Dr. John HO
City University of Hong Kong
Mr. John GOLDEN
Regional Product Safety Attaché, Asia Pacific, US CPSC
Ir. S. C. HO
Hong Kong Institution of Engineers
Prof. S. L. HO
The Hong Kong Polytechnic University
Mr. Daren SLEE
Member of the Leadership for the Forensics and Failure
Analysis (Chair) and Risk Assessment Technical Committees, IEEE
Prof. Alan LAU
The Hong Kong Polytechnic University
Dr. Christopher
LEUNG
Hong Kong Institute of Vocational
Education
Dr. K. S. LEUNG
The Hong Kong Polytechnic University
Mr. Mark I. MONTROSE
Past President and Founder, IEEE Product Safety Engineering Society
Dr. S. W. LEUNG
City University of Hong Kong
Dr. Eric LIU
Hong Kong Institute of Vocational
Education
Prof. G. X. LIU
South China University of Technology
Prof. Louis LOCK
Hong Kong Association for the
Advancement of Science and Technology
Ir. C. Y. SHIU
Hong Kong Institute of Vocational
Education
Ir. Alain TANG
The Hong Kong Institution of Engineers
Prof. C. Y. TANG
The Hong Kong Polytechnic University
Ir. S. S. TANG
Hong Kong Institute of Vocational
Education
Dr. Y. M. WONG
The Hong Kong Institution of Engineers
Dr. Peter YU
Technological and Higher Education
Institute of Hong Kong
Dr. Kiefert LORE
Chief Gemmologist, Gubelin Gem Lab., Switzerland
Prof. Hoi Shan KWAN
Professor, School of Life Sciences, The Chinese University of Hong Kong
Mr. Dennis W. K. LEE
Head of Standards & Calibration Laboratory, Innovation
and Technology Commission, Government of HKSAR
Supporting Organizations:
Conference website: http://tcc2014.ouhk.edu.hk
Name
Patronage Chair:
12:00 – 12:45 Return to OUHK
Day 1: Keynote Speeches
Day 2: Technical Paper Presentations
Day 3: Technical Visit
Position
Organizer:
Enquiry hotline: (852) 3120 2700
Email: tcc2014@ouhk.edu.hk
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