Advancing Technology Through Sample Preparation
I N T E R N AT I O N A L SYMPOSIUM FOR TESTING A N D FA I L U R E A N A LY S I S Advancing Technology Through Sample Preparation E X P L O R I N G T H E M A N Y FA C E T S O F FA I L U R E A N A LY S I S Complex Device Deprocessing GEORGE R. BROWN CONVENTION CENTER Follows Physical Profile for: The X-Prep™ 3D is a specialized CNC-based milling/grinding/polishing machine designed and engineered to support electrical and physical failure analysis techniques through high precision sample preparation. This easy-to-use, highly versatile system is capable of working with flat (2D) and convex/concave (3D) device profiles, providing unmatched precision and accuracy. LIT and TDR on Package Devices SIMS Backside Analysis HOUSTON, TEXAS USA NOVEMBER 9 – 13, 2014 High NA SIL Imaging X-Ray images Before After Stacked die deprocessing 8-layer die stack processed to die 7 Die 7 & 8 electrically intact Expose Cu pillars & solder interconnect All the Pieces of the Semiconductor Failure Analysis Community Are Coming Together Unmatched Precision Die & Package Deprocessing 3D profile of a concave device 3D profile of a convex device www.alliedhightech.com 2376 E. Pacifica Place, Rancho Dominguez, CA 90220 • (800) 675-1118 (US/Canada) • (310) 635-2466 (Worldwide) Organized By: GE KR USA CN AP DECAPSULATION AND SAmPLE PrEP SOLUTIONS SESAMElaser TM Backside / Frontside / Cross Section SESAMEPLASMA TM SESAMEACID TM DC believes that applications knowledge and service support are the most important issues. We were the first to have found the most reliable recipe for openings of packages containing both coated and non-coated COPPER wires using an Automated Decapsulator (SesameACID777). SESAMEmechanical TM And first again now for SILVER wires. Why? We are a fabless company, and work directly with the manufacturers to develop the best methods using the four decapsulation techniques currently available. Our goal is to help you select the best technique for your next investment. With the largest technical network in the world, you can trust that we are here to help you. +33 (0) 231 354 354 - info@digit-concept.com - www.digit-concept.com Welcome to the Sunday, November 9–Thursday, November 13; George R. Brown Convention Center, Houston, Texas USA REGISTRATION HOURS Saturday: 5:00 p.m.–7:00 p.m. Sunday: 7:00 a.m.–5:00 p.m. Monday: 7:00 a.m.–5:00 p.m. Tuesday: 7:00 a.m.–5:30 p.m. Wednesday: 7:00 a.m.–5:00 p.m. Thursday: 7:00 a.m.–11:00 a.m. TECHNICAL PROGRAM Technical Program: Sunday–Thursday. Dedicated Tutorials on Sunday; integrated Tutorials throughout the Technical Program. For more conference details see pages 6–28. Policy on Cell Phone Usage: In consideration of fellow event attendees and presenters, we request your cooperation in setting cellular phones and/or other electronic devices to ‘silent mode’ in the meeting rooms. Policy on Audio/Video Recording: EDFAS™ prohibits any unauthorized audio or video recording, or still photography of presentations at ISTFA. EXPOSITION Tools of the Trade Tour–Monday (Pre-Registration Required)................................................................................ 5:00 p.m.–6:45 p.m. Exhibit Hours–Tuesday ............................................................................................................................................ 9:00 a.m.–6:00 p.m. Lunch.................................................................................................................................................................... 12:00 p.m.–1:30 p.m. Expo Networking Reception................................................................................................................................ 4:00 p.m.–6:00 p.m. Exhibit Hours–Wednesday ....................................................................................................................................... 9:30 a.m.–3:30 p.m. EDFAS General Membership Meeting and Luncheon ......................................................................................... 12:15 p.m.–1:30 p.m. Exhibitor Dessert Reception, Poster and Video Contest.................................................................................... 1:30 p.m.–3:30 p.m. GET CONNECTED Want to be hands free at ISTFA? There’s an app for that! Download the ISTFA 2014 mobile app to view the technical program, exhibitor information, networking opportunities and attendee survey. Don’t forget to complete the attendee survey on the mobile app and connect with fellow attendees. Available for apple and android devices - visit the iTunes and Google Play Store to download it now. SESSION CHAIR & AUTHORS’ COFFEE/BRIEFING Please join us for coffee, pastries and a program briefing on the day of your presentation in Meeting Room 320B. The room will open at 7:00 a.m. to allow you to meet and network with other participants. The program briefing will begin at 7:30 a.m. to review the program layout, presentation and A/V guidelines, and any final conference details. Poster authors please join us on Wednesday morning. YOUR ATTENDANCE IS VERY IMPORTANT. REFRESHMENT BREAKS Sunday–Monday........................................................................................................................................ Meeting Space Foyer Tuesday–Wednesday................................................................................................................................. Expo Hall B3 Thursday..................................................................................................................................................... Meeting Space Foyer CAREER/RESUME BOARDS Stop by Registration to post job openings, find talented people in the industry or to post a resume on the Career/Resume Board. CONTENTS George R. Brown Convention Center Floor Plan ......................... 2 Show Directory............................................................................ 34 2014 Organizing Committee......................................................... 3 Tools of the Trade Tour............................................................... 37 Networking and Membership Lounge Details.............................. 4 Exhibit Hall Floor Plan................................................................ 42 Technical Program Schedule........................................................ 6 Exhibitor List................................................................................ 43 Education Short Courses............................................................ 29 Company Descriptions................................................................ 46 Author Index................................................................................ 30 Product/Services Index............................................................... 56 1 George R. Brown Convention Center Floor Plan 2 ISTFA 2014 Organizing Committee General Chair Mr. Dan Bodoh Freescale Semiconductor Vice General Chair Technical Program Chair Tutorial Chair Exposition Chair Dr. James J. Demarest IBM Dr. Martin Keim Mentor Graphics Ms. Becky Holdford Texas Instruments, Inc Mr. Nicholas Antoniou Revera Inc. Activities Chairs and Vice Chairs Dr. Felix Beaudoin Panel Chair Global Foundries Mr. David Grosjean Panel Vice Chair Qualcomm Mr. Rick Livengood User Group Chair Intel Dr. Zhiyong Wang Ms. Rose Ring Past Chair Tutorial & Short Course Vice Chair, Movie Vice Chair Maxim Integrated GLOBALFOUNDRIES Dr. Lihong Cao International Chair AMD Ms. Susan Li Tutorial & Short Course Vice Chair Spansion Inc. Ms. Efrat Moyal Publicity Chair LatticeGear LLC Mr. Kendall Scott Wills Dr. Sam Subramanian Local Arrangements AV Chair Freescale Semiconductor Chair Consultant Dr. Mayue Xie Movie Chair & User Group Vice Chair Intel Technical Program Session Chairs 3D Packages Frank Altmann, Fraunhofer Institute for Mechanics of Materials Yan Li, Intel Case Studies and the Failure Analysis Process Peter Jacob, EMPA Duebendorf Zhigang Song, IBM Circuit Edit Michael DiBattista, Qualcomm, Inc Dane Scott, Intel Corporation Defect Characterization Emerging Concepts and Packaging and and Metrology Techniques Assembly Analysis Terence Kane, IBM Phil Kaszuba, IBM Detecting Counterfeit Devices Zhigang Song, IBM Electrical Characterization and Nanoprobing Stefan B. Kaemmer, Multiprobe Izak Kapilevich, DCG Systems Michael Bruce, Consultant Lihong Cao, Advanced Micro Devices Huimeng Wu, Carl Zeiss Microscopy, LLC Panel Discussion Microscopy Felix Beaudoin, Global Foundries Carl Nail, Evans Analytical Group, LLC Photon-Based Techniques Novel ResearchLevel Techniques and Concepts Herve Deslandes, DCG Systems Michael Bruce, Consultant Frank Zachariasse, NXP Semiconductors Posters David Grosjean, Qualcomm Martin Versen, University of Applied Sciences Rosenheim Sample Preparation and Device Deprocessing Software-Based Techniques, Test, Diagnosis, and Yield Geir Eide, Mentor Graphics Mark E. Kimball, Maxim Integrated Products, Inc. Roger Alvis, FEI Company Bryan Tracy, Spansion, Inc. Huimeng Wu, Carl Zeiss Microscopy, LLC Tutorial Session Chairs Electrical and Yield Jenny Ma, Intel Mayue Xie, Intel Fault Isolation Gregory M. Johnson, IBM Microscopy Carl Nail, Evans Analytical Group, LLC Susan Li, Spansion Inc. Rose Ring, Global Foundries Package and Physical Analysis Challenges Robert Champaign, Raytheon Network Centric Systems 3 Jake E. Klein, Texas Instruments Technology Specific FA Chris Richardson, Allied High Tech Products, Inc. Jeremy A. Walraven, Sandia National Labs Monday, November 10th from 7:00 – 9:00 p.m. at the Hilton Americas – Houston, Americas Ballroom DE (Casual Attire) Tuesday, November 11th from 4:00 – 6:00 p.m. inside Expo Hall B3 Wednesday, November 12th from 12:15 – 1:30 p.m. inside Expo Hall B3 Wednesday, November 12th from 1:30 – 3:30 p.m. inside Expo Hall B3 4 I N T E R N AT I O N A L SYMPOSIUM FOR TESTING A N D FA I L U R E A N A LY S I S E X P L O R I N G T H E M A N Y FA C E T S O F FA I L U R E A N A LY S I S GEORGE R. BROWN CONVENTION CENTER HOUSTON, TEXAS USA NOVEMBER 9 – 13, 2014 All the Pieces of the Semiconductor Failure Analysis Community Are Coming Together Membership lounge hours: Tuesday, November 11 9:00 a.m. – 6:00 p.m. Networking Reception: 4:00 p.m. – 6:00 p.m. 2014 ISTFA Member Booth Ad.indd 1 Wednesday, November 12 9:30 a.m. – 3:30 p.m. Exhibitor Dessert Reception, Poster and Video Contest: 1:30 p.m. – 3:30 p.m. 10/22/14 2:28 PM Technical Program On behalf of EDFAS, we would like to thank the organizers, session chairs, and speakers for their time and efforts in creating an outstanding ISTFA Conference and Exposition EVERYTHING YOU NEED TO KNOW ABOUT ISTFA 2014 IS ONLINE! DON’T FORGET TO DOWNLOAD THE ISTFA MOBILE APP AND ISTFA ONLINE PROCEEDINGS Mobile App and Online Proceedings Support is Available at Registration A Special Thank You to the EDFAS Lonestar Chapter for Their Support 6 Technical Program Sunday, November 9, 2014 Time Room Session 8:00 a.m. – 11:15 a.m. 310A Package and Physical Analysis Challenges 8:00 a.m. – 12:15 p.m. 310B Electrical and Yield 9:00 a.m. – 4:15 p.m. 310C Fault Isolation 10:00 a.m. – 10:15 a.m. Meeting Space Foyer Refreshment Break 11:15 a.m. – 2:15 p.m. Banners Café Attendee Luncheon 1:15 p.m. – 6:30 p.m. 310A Microscopy 2:15 p.m. – 4:15 p.m. 310B Technology Specific FA 4:15 p.m. – 4:30 p.m. Meeting Space Foyer Refreshment Break Electrical and Yield 8:00 a.m.-12:15 p.m. Meeting Room: 310 B Package and Physical Analysis Challenges 8:00 a.m.-11:15 a.m. Meeting Room: 310 A Session Chairs: Dr. Jenny Ma Intel Chandler, AZ USA Session Chair: Mr. Robert Champaign Raytheon Network Centric Systems McKinney, TX USA Dr. Mayue Xie Intel Chandler, AZ USA Mr. Jake E. Klein Texas Instruments Tucson, AZ USA 8:00 a.m. Chip Scale Packaging and Its Failure Analysis Challenges: Ms. Susan Li, Spansion Device Analysis Lab, Spansion Inc, Sunnyvale, CA 8:00 a.m. Yield Basics for FA: Mr. Dave Albert1 and Mr. Tracy Myers2, 1 Department 06YA, IBM, Hopewell Junction, NY, 2ON Semiconductor, Gresham, OR 9:00 a.m. SAM vs X-RAY: Dr. Thomas M. Moore, Waviks, Inc., Dallas, TX 9:00 a.m. Testing Small Technology Nodes in 2, 2.5, 3, and 5.5D: Dr. Martin Keim, Silicon Test Solutions, Mentor Graphics, Wilsonville, OR 10:00 a.m. – 10:15 a.m. • Refreshment Break • Meeting Space Foyer 10:00 a.m. – 10:15 a.m. • Refreshment Break • Meeting Space Foyer 10:15 a.m. Flip-Chip and Backside Techniques: Dr. Edward I. Cole Jr.1, Dr. Daniel L. Barton2 and Dr. Karoline Bernhard-Hofer3, 1Science and Technology, Sandia National Laboratories, Albuquerque, NM, 2Sandia National Laboratories, Albuquerque, NM, 3Infineon, Regensburg, Germany 10:15 a.m. The Role of Nanoprobing in Yield and Failure Analysis: Mr. Randal E. Mulder, Device Analysis Lab, Silicon Labs, Austin, TX 11:15 a.m. Test Fundamentals and Implementation of Wafer Level Tester-Based Failure Analysis: Dr. SH Goh, Technology Development- New Technology Prototyping, GLOBALFOUNDRIES, Singapore, Singapore 11:15 a.m. – 1:15 p.m. • Attendee Luncheon •Banners Café 12:15 p.m. – 1:15 p.m. • Attendee Luncheon • Banners Café Programs are tentative: papers, authors, and order of presentations are subject to change. 7 Sunday, November 9, 2014 Technical Program Fault Isolation 9:00 a.m.-4:15 p.m. Meeting Room: 310 C Microscopy 1:15 p.m.-6:30 p.m. Meeting Room: 310 A Session Chairs: Mr. Gregory M. Johnson IBM Hopewell Junction, NY USA Session Chairs: Mr. Carl Nail Evans Analytical Group, LLC Irvine, CA USA Ms. Susan Li Spansion Inc Sunnyvale, CA USA Ms. Rose Ring GLOBALFOUNDRIES Malta Stillwater, NY USA 9:00 a.m. Beam-Based Defect Localization: Dr. Edward I. Cole Jr., Science and Technology, Sandia National Laboratories, Albuquerque, NM 1:15 p.m. Scanning Electron Microscopy: Dr. William E. Vanderlinde, Laboratory for Physical Sciences, College Park, MD 2:15 p.m. Transmission Electron Microscopy: Dr. Sam Subramanian, Freescale Semiconductor, Inc., Austin, TX 10:00 a.m. – 10:15 a.m. • Refreshment Break • Meeting Space Foyer 10:15 a.m. Photonic Localization Techniques: Dr. Arkadiusz Glowacki and Prof. Christian Boit, Semiconductor Devices, Berlin University of Technology, Berlin, Germany 3:15 p.m. Ultra-High Resolution in the SEM: Dr. William E. Vanderlinde, Laboratory for Physical Sciences, College Park, MD 4:15 p.m. – 4:30 p.m. • Refreshment Break • Meeting Space Foyer 11:15 a.m. Laser Induced Techniques for Microelectronic Failure Analysis: SDL and LADA: Dr. Michael Bruce, Consultant, Austin, TX 4:30 p.m. Focused Ion Beam (FIB) for Circuit Edit, Fault Isolation and Sample Preparation: Mr. Steven B. Herschbein1, Mr. Oleg Sidorov2, Mr. Chris Scheffler3, Mr. Richard Livengood3 and Dr. Shida Tan3, 1IBM Systems & Technology, Hopewell Junction, NY, 2 FEI Company, Hillsboro, OR, 3Intel Corporation, Santa Clara, CA 12:15 p.m. Defect localization by Lock-in-Thermography: Mr. Frank Altmann, Centre for Applied Microstructure Diagnostics, Fraunhofer Institute for Mechanics of Materials, Halle, Germany 5:30 p.m. Materials Characterization for Failure Analysis: Dr. William E. Vanderlinde, Laboratory for Physical Sciences, College Park, MD 1:15 p.m. – 2:15 p.m. • Attendee Luncheon • Banners Café 2:15 p.m. Magnetic Imaging for Die and Package Fault Isolation: Mr. David Vallett, PeakSource Analytical, LLC, Fairfax, VT 3:15 p.m. FA Technique Selection for Front End Defect Localization in Bulk Semiconductor (Si) FA: Mr. Gregory M. Johnson and Mr. Christopher D’Aleo, Physical Failure Analysis, IBM, Hopewell Junction, NY 4:15 p.m. – 4:30 p.m. • Refreshment Break • Meeting Space Foyer Programs are tentative: papers, authors, and order of presentations are subject to change. 8 Sunday, November 9, 2014 Technical Program Technology Specific FA 2:15 p.m.-4:15 p.m. Meeting Room: 310 B Session Chairs: Mr. Chris Richardson Allied High Tech Products, Inc. Rancho Dominguez, CA USA Mr. Jeremy A. Walraven Sandia National Labs Albuquerque, NM USA 2:15 p.m. Emerging Failure Modes of Advanced Technology: Mr. Terence Kane, IBM, Hopewell Junction, NY 3:15 p.m. Failure Anamnesis (be)for(e) Failure Analysis: Prof. Peter Jacob, Principal Engineer Microstructure Failure Analysis, Dept. Electronics/ Metrology - Reliability-Center, EMPA Duebendorf, Duebendorf, Switzerland 4:15 p.m. – 4:30 p.m. • Refreshment Break • Meeting Space Foyer TECHNICAL MAGAZINE EDFAS Member Benefit EDFA is a quarterly magazine that contains key information dedicated to meeting the technical and networking needs of electronic device failure analysis technicians, engineers, and managers. • Technical articles contributed by experts that cover everything from operations to analysis techniques • Trends of failure analysis in the microelectronics industry • News of the Electronic Device Failure Analysis Society • Guest columns provide vital perspective into FA topics FOR ADVERTISING INFORMATION CONTACT: Kelly Thomas | Global Manager, Sales & Expositions 440.338.1733 | Fax: 614.948.3090 | kelly.thomas@asminternational.org EDFAS Member Benefit Ad.indd 1 10/21/14 4:03 PM Programs are tentative: papers, authors, and order of presentations are subject to change. 9 Monday, November 10, 2014 Technical Program Time Room Session 8:00 a.m. – 9:40 a.m. Grand Ballroom B Plenary Session 9:40 a.m. – 9:55 a.m. Meeting Space Foyer Refreshment Break 9:55 a.m. – 11:15 a.m. Grand Ballroom B Emerging Concepts and Techniques 11:15 a.m. – 12:05 p.m. Grand Ballroom B Novel Research – Level Techniques and Concepts 12:05 p.m. – 1:00 p.m. Grand Ballroom B Attendee Luncheon 1:00 p.m. – 2:40 p.m. 310A 3D Packages I 1:00 p.m. – 1:25 p.m. 310B Detecting Counterfeit Devices 1:25 p.m. – 2:40 p.m. 310B Photon-Based Techniques I 2:40 p.m. – 2:50 p.m. Meeting Space Foyer Refreshment Break 2:50 p.m. – 4:05 p.m. 310A Packaging and Assembly I 2:50 p.m. – 4:05 p.m. 310B Photon-Based Techniques II 4:05 p.m. – 6:00 p.m. 310A Contactless User Group 5:00 p.m. – 6:45 p.m. Expo Hall B3 Tools of the Trade Tour (Pre-Registration Required) 7:00 p.m. – 9:00 p.m. Hilton Americas – Houston, Americas Ballroom DE ISTFA Social Event Plenary Session 8:00 a.m.-9:40 a.m. Meeting Room: Grand Ballroom B Session Chair: Dan Bodoh Freescale Semiconductor Austin, TX impossible to do given the state of the art technology of the time. This talk will take us from its impossible beginning to its successful conclusion. And as usual the effort was under scoped—there were far more issues than its being impossible. Biography: Gene A Frantz is a Professor in the Practice at Rice University. He took this position after 39 years at Texas Instruments where he retired as TI’s Principal Fellow. For the last 30 years he applied his passion for finding new opportunities and creating new businesses utilizing TI’s digital signal processing technology and took a leadership role in starting businesses within the corporate structure. As a result, he is a recognized leader in DSP technology both within TI and throughout the industry. 8:10 a.m. – 8:45 a.m. Professor Gene Frantz Rice University Houston, TX Frantz is a Fellow of the IEEE, holds 48 patents in the area of memories, speech, consumer products and DSP, has written more than 100 Papers and articles and continually presents at Universities and conferences worldwide. Frantz has been recognized as an industry expert and has been widely quoted in the media due to his tremendous knowledge and visionary view of DSP solutions. The Speak & Spell™ : The Birth of the Digital Signal Processor It was to be a simple educational product to help students learn to spell. It had one problem standing in its way—It was continued Programs are tentative: papers, authors, and order of presentations are subject to change. 10 Monday, November 10, 2014 8:45 a.m. – 8:50 a.m. ISTFA 2013 Best & Outstanding Paper Awards 9:15 a.m. – 9:40 a.m. ESREF 2013 Outstanding Paper Best Paper Winner Detectability of automotive power MOSFET on-resistance failure at high current induced by Wafer Fab process excursion: Yann WEBER, Julien GOXE, Maris CASTIGNOLLES, Freescale Semiconducteurs France SAS, Toulouse Product Analysis Lab, 134 avenue du Général Eisenhower, B.P. 72329, 31023 Toulouse Cedex, France Two-Photon-Absorption-Enhanced Laser-Assisted Device Alteration and Single-Event Upsets in 28nm Silicon Integrated Circuits: Dr. Keith A. Serrels1, Mr. Kent Erington2, Mr. Dan J. Bodoh2, Prof. Derryck T. Reid3, Dr. Carl Farrell3, Mr. Neel Leslie1, Dr. Ted R. Lundquist1 and Dr. Praveen Vedagarbha1, 1 DCG Systems, Fremont, CA, 2Silicon Systems Diagnostic Center, Freescale Semiconductor, Austin, TX, 3Institute of Photonics and Quantum Sciences, Heriot-Watt University, Edinburgh, United Kingdom. This paper presents the meaningful consequence of a minor Wafer Fab process variability, generating on-resistance (RDSon) drift on low voltage vertical power N-MOSFETs dedicated to micro-hybrid automotive application. The research challenge concerned the fact that failure was not detected in production but at customer level; therefore, it was determinant to understand the root cause of this failure mode to drive corrective actions in order to secure customer by detecting and delivering correct parts. The originality of that paper concerns the necessity to use complementary Failure Analysis (FA) investigations, needed to determine the origin of the failure without any possibilities to perform any fault localization. First, assembly investigations are presented to discriminate if the failure was coming from customer or provider. Then, electrical characterizations at high current confirmed the RDSon failure. Thus, strategic physical destructive FA approaches were combined in order to discriminate all potential root causes, using physical step-by-step deprocessing, FIB milling cross-sections and TEM analysis. Finally, a nanometric layer of oxide residue was identified as the origin of the failure and corresponded to a wafer Fab process defect, induced by a lack of oxide overetch at spacer definition process step. These results allowed implementing corrections and improving test screening to protect customer. Outstanding Paper Winner Laser Voltage Imaging and Its Derivatives, Efficient Techniques to Address Defect On 28nm Technology: Mr. Thierry Parrassin1, Mr. Guillaume Celi1, Dr. Antoine Reverdy2, Sylvain Dudit1, Michel Vallet1, Dr. Philippe Perdu3 and Prof. Dean Lewis4, 1 ST Microelectronics, Crolles, France, 2Sector Technologies, Gieres, France, 3Laboratories and Expertise, Quality Assurance, Centre National d’Etudes Spatiales (CNES), Toulouse, France, 4 IMS laboratory, University of Bordeaux, Talence, France. 8:50 a.m. – 9:15 a.m. IPFA 2014 Best Paper Defect localization enhancement using Light Induced CIAFP: N. Dayanand, A.C.T Quah, C.Q.Chen, S.P.Neo, G.B.Ang, M. Gunawardana, Product Failure Analysis, GLOBALFOUNDRIES Singapore This paper describes the effectiveness of coupling Photovoltaic (PV) Effect with Current Imaging – Atomic Force Microscopy (CI-AFP) to localize defects that are not detected through conventional CI-AFP. By operating the p-n junctions of a MOS transistor as photovoltaic cell, and measuring the photocurrent to generate a light induced current image, it has widened the spectrum of defects detectable through CI-AFP. In some cases, the precision of defect localization can also be improved. 9:40 a.m. – 9:55 a.m. • Refreshment Break • Meeting Space Foyer Programs are tentative: papers, authors, and order of presentations are subject to change. 11 Monday, November 10, 2014 Emerging Concepts and Techniques 9:55 a.m.-11:15 a.m. Meeting Room: Grand Ballroom B Novel Research-Level Techniques and Concepts 11:15 a.m.-12:05 p.m. Meeting Room: Grand Ballroom B Session Chairs: Dr. Michael Bruce Consultant Austin, TX USA Session Chairs: Dr. Michael Bruce Consultant Austin, TX USA Dr. Huimeng Wu Carl Zeiss Microscopy, LLC Peabody, MA USA Dr. Huimeng Wu Carl Zeiss Microscopy, LLC Peabody, MA USA 9:55 a.m. Welcoming Remarks: Michael Keim, Mentor Graphics, Wilsonville, OR 11:15 a.m. High-Resolution Backside GMR Magnetic Current Imaging on a Contour-Milled Globally Ultrathin Die: Mr. David Vallett1, Mr. Jan Gaudestad2 and Mr. Chris Richardson3, 1 PeakSource Analytical, LLC, Fairfax, VT, 2Magnetic Field Imaging, Neocera, LLC, Beltsville, MD, 3FA Products & Applications, Allied High Tech Products, Inc., Rancho Dominguez, CA 10:00 a.m. Novel NIR Camera with Extended Sensitivity and Low Noise for Photon Emission Microscopy of VLSI Circuits: Dr. Andrea Bahgat Shehata1, Dr. Franco Stellari2, Alan Weger2, Dr. Peilin Song1, Dr. Herve Deslandes3, Dr. Ted R. Lundquist4 and Dr. Euan Ramsay3, 1Circuit Test and Diagnostics Technology, IBM T.J. Watson Research Center, Yorktown Heights, NY, 2IBM Research, Yorktown Heights, NY, 3DCG Systems, Fremont, CA, 4DCG Systems, Inc, Fremont, CA 11:40 a.m. Resolution Improvement through Sparse Image Reconstruction Techniques for Dark Field Subsurface Microscopy of Integrated Circuits: Mrs. Tenzile Berkin Cilingiroglu1, Prof. W. Clem Karl1, Prof. Janusz Konrad1, Dr. Michael D W Grogan1, Mr. Abdulkadir Yurt2, Mr. Ahmet Tuysuzoglu1, Prof. Bennett B. Goldberg3 and Prof. M. Selim Unlu1, 1Electrical and Computer Engineering, Boston University, Boston, MA, 2Material Science, Boston University, Boston, MA, 3 Physics, Boston University, Boston, MA 10:25 a.m. Automated Mapping of Very Large Areas of VLSI Circuit using SIL: Dr. Chung-Ching Lin1 and Dr. Franco Stellari2, 1 IBM T.J. Watson Research Center, Yorktown Heights, NY, 2IBM Research, Yorktown Heights, NY 10:50 a.m. Routine Device-Level Atom Probe Analysis: Mr. Daniel F. Lawrence, Applications, Cameca, Inc., Madison, WI 12:05 p.m. – 1:00 p.m. • Attendee Luncheon • Grand Ballroom B Programs are tentative: papers, authors, and order of presentations are subject to change. 12 Monday, November 10, 2014 3D Packages I 1:00 p.m.-2:40 p.m. Meeting Room: 310 A Detecting Counterfeit Devices 1:00 p.m.-1:25 p.m. Meeting Room: 310 B Session Chairs: Mr. Frank Altmann Fraunhofer Institute for Mechanics of Materials Halle, Germany Session Chair: Dr. Zhigang Song IBM Systems & Technology Hopewell Junction, NY USA Dr. Yan Li Intel Chandler, AZ USA 1:00 p.m. Advanced Physical Inspection Methods for Counterfeit Detection: Dr. Sina Shahbazmohamadi, PhD, Prof. Domenic Forte, PhD and Prof. Mark Tehranipoor, PhD, Electrical and Computer Engineering, University of Connecticut/ CHASE Center, Storrs, CT 1:00 p.m. 3D IC/Stacked Device Fault Isolation Using 3D Magnetic Field Imaging: Dr. Antonio Orozco1, Mr. Nicolas Gagliolo2, Mr. Christopher Rowlett3, Mr. Enoch Wong2, Mr. Anurag Moghe1, Mr. Steve Garrahan1, Mr. Jan Gaudestad4, Mr. Alex Jeffers5, Mr. Keyvan Torkashvan5, Dr. Frederick C. Wellstood5, Dr. A. B. Cawthorne6 and Dr. Fulvio Infante7, 1Magnetic Field Imaging, Neocera, Beltsville, MD, 2Neocera, Beltsville, MD, 3Neocera LLC, Beltsville, MD, 4Magnetic Field Imaging, Neocera, LLC, Beltsville, MD, 5Department of Physics, Center for Nanophysics and Advanced Materials, College Park, MD, 6Department of Science and Mathematics, Trevecca Nazarene University, Nashville, TN, 7 Intraspec Technologies, Toulouse, France 1:25 p.m. Failure Analysis Work Flow for Electrical Shorts in Triple Stacked 3D TSV Daisy Chains: Mr. Jan Gaudestad1, Dr. Antonio Orozco2, Prof. Ingrid De Wolf3, Teng Wang3, Tomas Weber3, Mr. Ron Kelley4, Troy Morrison4 and Mr. Surendra Madala4, 1Magnetic Field Imaging, Neocera, LLC, Beltsville, MD, 2 Magnetic Field Imaging, Neocera, Beltsville, MD, 3imec, Leuven, Belgium, 4FEI, Hillsboro, OR 1:50 p.m. Short Localization in 2.5D Microchip with Interposer using Magnetic Current Imaging: Mr. Jan Gaudestad1, Mr. Daniel Nuez2 and Mr. Phoumra Tan3, 1Magnetic Field Imaging, Neocera, LLC, Beltsville, MD, 2QNG, Xilinx, San Jose, CA, 3Device Analysis Lab, Xilinx, Inc, San Jose, CA 2:15 p.m. Applying Innovative Techniques for Solving FA Challenges of 3D IC Failures Utilizing Conventional Equipment: Mr. Phoumra Tan, Device Analysis Lab, Xilinx, Inc, San Jose, CA 2:40 p.m. – 2:50 p.m. • Refreshment Break • Meeting Space Foyer Programs are tentative: papers, authors, and order of presentations are subject to change. 13 Monday, November 10, 2014 Photon-Based Techniques I 1:25 p.m.-2:40 p.m. Meeting Room: 310 B Packaging and Assembly Analysis I 2:50 p.m.-4:05 p.m. Meeting Room: 310 A Session Chairs: Dr. Herve Deslandes DCG Systems Fremont, CA USA Session Chair: Dr. Lihong Cao Advanced Micro Devices Austin, TX USA Dr. Frank Zachariasse NXP Semiconductors Nijmegen, Netherlands 2:50 p.m. Comparative Study on Decapsulation for Copper and Silver Wire-Bonded Devices: Mr. Francois Kerisit1,2, Dr. Bernadette Domengès2 and Mr. Michael Obein1, 1Digit Concept, Secquevilleen-Bessin, France, 2Presto-Engineering Europe, LAMIPS, CRISMAT – NXP semiconductors - Presto-Engineering Europe laboratory, CNRS-UMR6508; ENSICAEN, UCBN, CAEN, France 1:25 p.m. Laser Logic State Imaging (LLSI): Dr. Baohua Niu1, Ms. Grace Khoo2, Mr. Fernando Chapman3, Mr. Steven Chen4 and Mr. Dan Bockelman5, 1TMG Labs, Intel Corp., Hillsboro, OR, 2ATM FA Technology Development, Intel Corp., Hillsboro, OR, 3CQN QR Product FAFI and Debug, Intel Corp., Hillsboro, OR, 4CQN QR CPU/SOC FA-FI-DL Group, Intel Corp., Hillsboro, OR, 5PEG Devices Development Group, Intel Corp., Hillsboro, OR 3:15 p.m. Laser Focus Depth Adaptation for Decapsulation of Copper Wirebonded Devices: Ms. H. B. Kor1, Dr. Qing Liu1, Ms. Y. W. Siah1 and Prof. Chee Lip Gan1,2, 1Temasek Laboratories@NTU, Nanyang Technological University, Singapore, Singapore, 2 School of Materials Science & Engineering, Nanyang Technological University, Singapore, Singapore 1:50 p.m. Root Cause Analysis Techniques Using Picosecond Time Resolved LADA: Mr. Dan J. Bodoh1, Mr. Kent Erington1, Mr. Kristofor Dickson1, Mr. George Lange1, Mr. Carey Wu1 and Mr. Tom Crawford2, 1New Product and Technology Diagnostic Center, Freescale Semiconductor, Austin, TX, 2DCG Systems, Fremont, CA 3:40 p.m. A Sample Preparation on Decapsulation Methodology for Effective Failure Analysis on Thin Small Leadless (TSLP) Flip Chip Package with Copper Pillar (CuP) Bump Interconnect Technology: Mr. HoonYen Gwee, Quality Management Department/ Failure Analysis, INFINEON TECHNOLOGIES, Malacca, Malaysia 2:15 p.m. The Role of Free Carrier Absorption in LADA: Mr. Kent Erington, Mr. Dan J. Bodoh, Mr. Kristofor Dickson and Mr. George Lange, New Product and Technology Diagnostic Center, Freescale Semiconductor, Austin, TX 2:40 p.m. – 2:50 p.m. • Refreshment Break • Meeting Space Foyer Programs are tentative: papers, authors, and order of presentations are subject to change. 14 Monday, November 10, 2014 Photon-Based Techniques II 2:50 p.m.-4:05 p.m. Meeting Room: 310 B Contactless User Group 4:05 p.m.-6:00 p.m. Meeting Room: 310 A Supply Chain Assurance and Device Reliability With a Laser Confocal Microscope, David Stoker, SRI International Session Chairs: Dr. Herve Deslandes DCG Systems Fremont, CA USA On Die Logic Analyzer, Dr. Mike Bruce, Independent Consultant Dr. Frank Zachariasse NXP Semiconductors Nijmegen, Netherlands Photon for FA, where do we go from here, Dr. Ed Cole, Sandia National Labs 7:00 p.m. – 9:00 p.m. • ISTFA Social Event • Hilton Americas-Houston Americas Ballroom DE 2:50 p.m. Improved Lock-In Phase Mapping of Modulated Reflectance with SIL: Dr. Zhongling Qian, IFAG COM BTS PFS FA 2, Infineon Technologies AG, Neubiberg, Germany 3:15 p.m. Visible Light LVP on Ultra-Thinned Substrates: Dr. Joshua Beutler, Dr. Edward I. Cole Jr., Ms. Mary A. Miller, Mr. Joe Clement and Mr. Jeff Stevens, Science and Technology, Sandia National Laboratories, Albuquerque, NM 3:40 p.m. Introduction of Spectral Mapping through Transmission Grating, Derivative Technique of Photon Emission: Mr. Thierry Parrassin1, Sylvain Dudit2, Michel Vallet2, Dr. Antoine Reverdy3 and Dr. Herve Deslandes4, 1STMicroelectronics, CROLLES, France, 2ST Microelectronics, Crolles, France, 3Sector Technologies, Gières, France, 4DCG Systems, Fremont, CA Programs are tentative: papers, authors, and order of presentations are subject to change. 15 Tuesday, November 11, 2014 Time Room Session 8:00 a.m. – 9:40 a.m. 310A 3D Packages II 8:00 a.m. – 9:15 a.m. 310B Microscopy I 9:00 a.m. – 6:00 p.m. Expo Hall B3 Exhibits Open 9:40 a.m. – 9:55 a.m. Expo Hall B3 Refreshment Break 9:55 a.m. – 12:00 p.m. 310A Packaging and Assembly Analysis II 9:55 a.m. – 12:00 p.m. 310B Electrical Characterization and Nanoprobing 12:00 p.m. – 1:30 p.m. Expo Hall B3 Attendee Luncheon 12:20 p.m. – 2:20 p.m. Expo Hall B3 Nano-Probing User Group 2:20 p.m. – 2:35 p.m. Expo Hall B3 Refreshment Break 2:35 p.m. – 3:50 p.m. 310A Packaging and Assembly Analysis III 2:35 p.m. – 4:40 p.m. 310B Case Studies and the Failure Analysis Process I 4:00 p.m. – 6:00 p.m. Expo Hall B3 Expo Networking Reception 8:50 a.m. Advances in FIB-SEM Analysis of TSV and Solder Bumps - Approaching Higher Precision, Throughput and Comprehensiveness: Dr. Tomas Hrncir1, Mr. Jiri Dluhos1, Mr. Lukas Hladik2, Mrs. Efrat Moyal3, Mrs. Janet Teshima3 and Dr. Jaromir Kopecek4, 1R&D - Physics, TESCAN Brno, Brno, Czech Republic, 2Application department, TESCAN ORSAY HOLDING, Brno, Czech Republic, 3LatticeGear, Beaverton, OR, 4Institute of Physics ASCR, Prague, Czech Republic 3D Packages II 8:00 a.m.-9:40 a.m. Meeting Room: 310 A Session Chairs: Mr. Frank Altmann Fraunhofer Institute for Mechanics of Materials Halle, Germany Dr. Yan Li Intel Chandler, AZ USA 9:15 a.m. A Systematic Method for the Physical Isolation of a Die in a Stacked-Die Configuration: Ms. Vivian Jang and Mr. Ken C. Sias, Texas Instruments, Dallas, TX 8:00 a.m. SAM Assisted Contour Milling: Dr. Christian Hollerith1 and Mr. Bernd Krueger2, 1Infineon tech. AG, Neubiberg, Germany, 2 Infineon Tech. AG, Neubiberg, Germany 9:40 a.m. – 9:55 a.m. • Refreshment Break • Expo Hall B3 8:25 a.m. Efficient Non-destructive 3D Defect Localization by Lock-in Thermography utilizing Multi Harmonics Analysis: Mr. Falk Naumann, Mr. Rolf Herold and Mr. Frank Altmann, Center for Applied Microstructure Diagnostics (CAM), Fraunhofer Institute for Mechanics of Materials, Halle, Germany Programs are tentative: papers, authors, and order of presentations are subject to change. 16 Tuesday, November 11, 2014 Microscopy I 8:00 a.m.-9:15 a.m. Meeting Room: 310 B Packaging and Assembly Analysis II 9:55 a.m.-12:00 p.m. Meeting Room: 310 A Session Chair: Mr. Carl Nail Evans Analytical Group, LLC Irvine, CA USA Session Chair: Dr. Lihong Cao Advanced Micro Devices Austin, TX USA 8:00 a.m. Evaluation of TEM-Lamella Oxidation: Dr. Thomas Haber1 and Dr. Christian Gspan2, 1Product Reliability, ams AG, Unterpremstaetten, Austria, 2Institute for Electron Microscopy and Nano Analysis, Graz University of Technology, Graz, Austria 9:55 a.m. Reballing+Prepping Micro Devices Less Than 0.5mm Pitch: Mr. Robert Wettermann, BEST Inc, Rolling Meadows, IL 10:20 a.m. A Comprehensive Investigation of the Galvanic Corrosion Induced Ag-Al Bonding Degradation in Microelectronic Packaging Using Argon Ion Milling, SEM, Dual Beam FIBSEM, STEM and TOF-SIMS: Dr. Yixin Chen, WinTech NanoTechnology Services Pte. Ltd., Singapore, Singapore 8:25 a.m. Spectrum Sharpening on Rotation Averaged TEM Nano Beam Electron Diffraction Patterns: Dr. Yongkai Zhou1, Dr. Younan Hua2 and Mr. Xiaomin Li3, 1Physical Analysis Division, WinTech Nano-Technology Services Pte. Ltd., Singapore, Singapore, 2WinTech Nano-Technology Services Pte. Ltd., Singapore, Singapore, 3MD, WinTech Nano-Technology Services Pte. Ltd., Singapore, Singapore 10:45 a.m. Correlation of Thin Film Measurement Techniques for Device Packaging Processes: Mr. Juergen Walter, IFAG OP BE QM FA 6, Infineon Technologies AG, Regensburg, Germany 8:50 a.m. Automated Defect Analysis in Solar Cells Using EBIC: Dr. Grigore Moldovan1, Mr. Shark Lotharukpong2 and Prof. Peter Wilshaw2, 1NanoAnalysis, Oxford Instruments, High Wycombe, United Kingdom, 2Materials Science, The University of Oxford, Oxford, United Kingdom 11:10 a.m. Case Studies on Application of 3D Real Time X-ray for Flip Chip C4 Package: Dr. Lihong Cao, Quality & Reliability Engineering, Advanced Micro Devices, Austin, TX 11:35 a.m. Analysis of Two Electrical Failures Caused By Die Attach of Exposed Pad Package: Mr. Jinglong Li, Mr. Motohiko Masuda, Mr. Yi Che and Miao Wu, Product Analysis Laboratory, Freescale Semiconductor(China) Limited, Tianjin, China 9:40 a.m. – 9:55 a.m. • Refreshment Break • Expo Hall B3 12:00 p.m. – 1:30 p.m. • Attendee Luncheon • Expo Hall B3 Programs are tentative: papers, authors, and order of presentations are subject to change. 17 Tuesday, November 11, 2014 Electrical Characterization and Nanoprobing 9:55 a.m.-12:00 p.m. Meeting Room: 310 B 11:10 a.m. Failure Analysis of Bit Line to SNC Leakage Fail in 2xnm DRAM Using Nano Probing Technique: Mr. Jaeho Won1, Mr. Jundong Kim1, Mrs. Jina Kim1, Mrs. Jihye Shin1, Mr. Jihoon Kim1, Ms. Kyungrim Lee1, Ms. Miae Yoon1, Mr. Jong Hak Lee2, Mr. Jaeyun Lee2, Mr. Weonjoon Suh1 and Dr. Hyeonsoo Kim1, 1R&D Division, SK hynix, Icheon-si, South Korea, 2DRAM Development Division, SK Hynix Semiconductor Inc, Icheon-si, South Korea Session Chairs: Dr. Stefan B. Kaemmer Multiprobe Santa Barbara, CA USA 11:35 a.m. Analysis of an Anomalous CMOS Transistor Exhibiting Drain to Source Leakage –Its Model and Cause: Mr. Yuk L. Tsang1, Mr. Alex VanVianen2, Xiang-Dong wang3 and N. David Theodore3, 1Freescale Semiconductor Inc., Austin, TX, 2Freescale Semiconductor Inc., Tempe, TX, 3Freescale Semiconductor, Chandler, AZ Mr. Izak Kapilevich DCG Systems Fremont, CA USA 9:55 a.m. Identification Failure Mechanism of Threshold Voltage Shift Induced By Dopant Diffuse Via Nano-Probe, Simulation and Wet Stain Techniques: Ms. May Yang and Mr. Lee JH, Analysis Lab, Semiconductor Manufacturing International (Beijing) Corp, Beijing, China 12:00 p.m. – 1:30 p.m. • Attendee Luncheon • Expo Hall B3 Nano-Probing User Group 12:20 p.m.-2:20 p.m. Meeting Room: Expo Hall B3 10:20 a.m. Analysis of InGaAs Epi Defects by Conductive AFM: Mr. Aaron Cordes1, Mr. Tom Dyer2 and Mr. Sean M. Hand3, 1Metrology, SEMATECH, Albany, NY, 2Atomic Layer Manufacturing, SEMATECH, Albany, NY, 3Bruker BNS, Santa Barbara, CA Advanced Probing Tools, Stephan Kleindiek, Kleindiek Nanotechnik, GmbH 10:45 a.m. Utilizing Nanoprobing and Circuit Diagnostics to Identify Key Failure Mechanism of Otherwise Non-Visible Defects in 20nm Logic Devices: Dr. M. K. Dawood1, Dr. Changqing Chen2, Mr. P.K. Tan3, Ms. Sabitha James3, Mr. Pariyarathu Salimon Limin1, H. Tan3, Mr. H.H. Yap4, Mr. G.R. Low3, J. C. Lam5 and Dr. Z.H. Mai5, 1New Technology Prototyping, Technology Development and Research, Globalfoundries Singapore Pte. Ltd., Singapore, Singapore, 2Failure Analysis, Product failure analysis, Globalfoundries Singapore, Singapore, Singapore, 3 Technology Development-New Technology Prototyping, Globalfoundries Singapore Pte. Ltd., Singapore, Singapore, 4 Technology Development- New Technology Prototyping, Global Foundries, Singapore, Singapore, 5Product, Test and Failure Analysis, GLOBALFOUNDRIES Singapore Pte Ltd, Singapore, Singapore Capacitance Voltage Measurements and Imaging – 10attoFarads and Below, Sean Zumwalt, Multiprobe Advancements in Nanoprobing, Bob Newton, DCG Nano Instruments 2:20 p.m.-2:35 p.m. • Refreshment Break • Expo Hall B3 Programs are tentative: papers, authors, and order of presentations are subject to change. 18 Tuesday, November 11, 2014 Packaging and Assembly Analysis III 2:35 p.m.-3:50 p.m. Meeting Room: 310 A Case Studies and the Failure Analysis Process I 2:35 p.m.-4:40 p.m. Meeting Room: 310 B Session Chair: Dr. Lihong Cao Advanced Micro Devices Austin, TX USA Session Chairs: Dr. Zhigang Song IBM Systems & Technology Hopewell Junction, NY USA Prof. Peter Jacob EMPA Duebendorf Duebendorf, Switzerland 2:35 p.m. Feature Based Non-Destructive Fault Isolation in Advanced IC Packages: Dr. Ka Chung Lee1, Dr. Jesse Alton1, Mr. Martin Igarashi1 and Mr. Stephane Barbeau2, 1TearView Limited, Cambridge, United Kingdom, 2IBM Microelectronics, Bromont, QC, Canada 2:35 p.m. Understanding the Cu Void Formation by TEM Failure Analysis: Dr. Binghai Liu1, Dr. Jie Zhu2, Mr. Eddie Er2, Dr. Si Ping Zhao3, Dr. Jeffrey Lam4, Dr. Changqing Chen5 and Mr. Mark Najarian6, 1Product, Test and FA, GLOBALFOUNDRIES Singapore, Singapore, Singapore, 2QRA-FA, GLOBALFOUNDRIES Singapore, Singapore, Singapore, 3Failure Analysis, Quality and Customer Enablement (QCE) department, Globalfoundries Singapore, Singapore, SC, Singapore, 4 Technology Development- New Technology Prototyping, GLOBALFOUNDRIES, Singapore, Singapore, 5Failure Analysis, Product failure analysis, Globalfoundries Singapore, Singapore, Singapore, 6FEI, SARATOGA SPRINGS, NY 3:00 p.m. Failure Mechanism Studies and Root Cause Identification of Non-Stick on Pad on Microchip Al Bondpads: Dr. Younan Hua, WinTech Nano-Technology Services Pte. Ltd., Singapore, Singapore 3:25 p.m. Failure Localization of Intermittent Short Failures Caused By Vertical Conductive Anodic Filament Formation: Mr. Daniel Nuez, QNG, Xilinx, San Jose, CA 3:00 p.m. Failure Analysis Methodology on Systematic Missing Cu in RAM Due to Cu CMP: Mr. Ang Ghim Boon, Dr. Changqing Chen, Ms. Hui Peng Ng, Dr. Alfred C.T. Quah, Ms. Angela Teo, Mr. Kim Hong Yip, Ms. Soh Ping Neo, Dr. Jeffrey Lam and Dr. Zhihong Mai, Product, Test and Failure Analysis, GLOBALFOUNDRIES Singapore Pte Ltd, Singapore, Singapore 3:25 p.m. Identification of Subtle Defect By Means of High Kev SEM Passive Voltage Contrast: Dr. Sujing Xie1, Ms. Chaoying Chen2, Mr. Nathan Wang2, Dr. Andrew Komrowski2, Ms. Qindi Wu2 and Mr. Saunil Shah2, 1Product Engineering, Maxim Integrated, Hillsboro, OR, 2Product Engineering, Maxim Integrated, San Jose, CA 3:50 p.m. Inline Defects Overlaying with Functional Failures and Characterization for Fast Defect Learning and Fast Yield Improvement: Dr. Zhigang Song, Dr. Oliver D. Patterson and Dr. Qian Xu, IBM Systems & Technology, Hopewell Junction, NY 4:15 p.m. Observation of Channel Strain Release in pMOS Device with Low Idsat Using Energy-Filtered Nano-Beam Diffraction Technique: Dr. Jie Zhu, QRA-FA, GLOBALFOUNDRIES Singapore, Singapore, Singapore Programs are tentative: papers, authors, and order of presentations are subject to change. 19 Wednesday, November 12, 2014 Time Room Session 8:00 a.m. – 10:00 a.m. 310A Technology Specific FA Tutorial 9:00 a.m. –10:00 a.m. 310B Fault Localization Tutorial 9:30 a.m. – 3:30 p.m. Expo Hall B3 Exhibits Open 10:00 a.m. – 10:15 a.m. Expo Hall B3 Refreshment Break 10:15 a.m. – 12:15 p.m. 310A Panel Discussion – System to Component Level Failure Analysis in Space & Oil industries 12:15 p.m. – 1:30 p.m. Expo Hall B3 EDFAS General Membership Meeting and Luncheon 1:30 p.m. – 3:30 p.m. Expo Hall B3 Exhibitor Dessert Reception, Poster and Video Contest 3:30 p.m. – 4:20 p.m. 310B Circuit Edit 3:30 p.m. – 5:35 p.m. 310A Sample Preparation and Device Deprocessing I 4:20 p.m. – 6:00 p.m. 310B Microscopy II Technology Specific FA Tutorial 8:00 a.m.-10:00 a.m. Meeting Room: 310 A Fault Localization Tutorial 9:00 a.m.-10:00 a.m. Meeting Room: 310 B Session Chair: Mr. Jeremy A. Walraven Sandia National Labs Albuquerque, NM USA Session Chairs: Mr. Gregory M. Johnson IBM Hopewell Junction, NY USA Ms. Susan Li Spansion Inc Sunnyvale, CA USA 8:00 a.m. Oil & Gas Microelectronics Failure Analysis: Methodologies and Selected Case Studies: Mr. John Bescup, Weatherford Drilling Services, Houston, TX 9:00 a.m. Fundamentals of Laser Signal Injection Microscopy: Dr. R. Aaron Falk, OptoMetrix, Quantum Focus Instruments, Newcastle, WA 10:00 a.m. – 10:15 a.m. • Refreshment Break • Expo Hall B3 10:00 a.m. – 10:15 a.m. • Refreshment Break • Expo Hall B3 Programs are tentative: papers, authors, and order of presentations are subject to change. 20 Wednesday, November 12, 2014 Panel Discussion: System to Component Level Failure Analysis in Space & Oil industries 10:15 a.m.-12:15 p.m. Meeting Room: 310 A Exhibitor Dessert Reception, Poster and Video Contest 1:30 p.m.-3:30 p.m. Meeting Room: Expo Hall B3 Session Chairs: Mr. David Grosjean Qualcomm Andover, MA USA Panel Moderator: Felix Beaudoin Global Foundries Panelists: Bobby Hooghan, Weatherford Laboratories Ted Kolasa, Orbital Sciences Corporation John Martin, MARTIN COMPANY Philippe Perdu, CNES Dr. Martin Versen University of Applied Sciences Rosenheim Rosenheim, Germany Advanced Fault Localization Technique on e-Fuse Read Failure: Mr. Hung Chin Chen1, Chih Yang Tsai2, Mr. Shih-Yuan Liu2, Mr. Jian-Chang Lin2 and Mr. Yu-Pang Chang2, 1Product Engineer Department, United Microelectronics Corporation, Ltd., Tainan County, Taiwan, 2Failure Analysis Dept, PED, UMC, Tainan County, Taiwan Panel Description: Electronic components and systems used in space and oil industries have to withstand usually harsh environments such as extreme temperature, humidity, corrosive environments, mechanical shock and vibration, radiation, or high E and B-fields. Reliability of those components is critical since they cannot be replaced and/or can cause catastrophic consequence in case of malfunction. Failures at component and system level either resulting from reliability tests or final assembly tests must be thoroughly investigated prior to deployment. The panel presentations will discuss the present methodologies and techniques for performing comprehensive failure analysis of integrated electrical systems followed by a panel discussion highlighting the challenges of achieving root cause identification especially when only one unique fail device is available. Application of Soft Defect Localization (SDL) for SRAM Soft Failure Debug: Dr. SeungJe Moon1, Boon Lian Yeoh1, Dr. SH Goh1, Shaalini CHITHAMBARAM1, Dr. Alfred C.T. Quah2 and Dr. Jeffrey Lam1, 1Technology Development- New Technology Prototyping, GLOBALFOUNDRIES, Singapore, Singapore, 2 Product, Test and Failure Analysis, GLOBALFOUNDRIES Singapore Pte Ltd, Singapore, Singapore Applications and Techniques for 2D Picosecond Imaging for Circuit Analysis: Dr. Franco Stellari1, Dr. Peilin Song2 and Mr. Alan J. Weger3, 1IBM Research, Yorktown Heights, NY, 2Circuit Test and Diagnostics Technology, IBM T.J. Watson Research Center, Yorktown Heights, NY, 3Optical Communication and High Speed Test, IBM T.J. Watson Research Center, Yorktown Heights, NY EDFAS General Membership Meeting and Luncheon 12:15 p.m.-1:30 p.m. Meeting Room: Expo Hall B3 Join us to hear the President report on the current status of and future vision for EDFAS; to meet the new EDFAS Officers and Board members; and to congratulate the 2014 Photo Contest winners. We look forward to seeing you there! The meeting is open to all EDFAS members, exhibitors and interested prospective members. One ticket is included with full conference and exhibitor registrations. Applications of AFP Nanoprobing for Localization of Implant Related Issues: Mr. Dayanand Nagalingam, Mr. Tao Xie, Dr. Alfred C.T. Quah, Ms. Soh Ping Neo, Ms. Hui Peng Ng, Mr. Ghim Boon Ang, Mr. Kim Hong Yip, Dr. Z.H. Mai and J. C. Lam, Product, Test and Failure Analysis, GLOBALFOUNDRIES Singapore Pte Ltd, Singapore, Singapore Automatic Emission Spots Identification in Static and Dynamic Imaging by Research of Local Maxima: Mr. Anthony Boscaro1, Dr. Philippe Perdu2, Sabir Jacquir3, Mr. Samuel Chef3, Mr. Kevin Sanchez2 and Stephane Binczak3, 1Centre National d’Etudes Spatiales, Toulouse, France, 2Laboratories and Expertise, Quality Assurance, Centre National d’Etudes Spatiales (CNES), Toulouse, France, 3LE2I, University of Burgundy, Dijon, France continued Programs are tentative: papers, authors, and order of presentations are subject to change. 21 Wednesday, November 12, 2014 Auto-Metrology on TEM Images of FinFET: Dr. Sajal Biring1 and Dr. C H Chu2, 1R&D, Materials Analysis Technology Inc., Hsinchu, Taiwan, 2Surface Analysis and R&D, Materials Analysis Technology Inc., Hsinchu, Taiwan Metal Bridge Defects Localization By a Tiny Leakage Between One of Bridged Signals and VDD (GND): Mr. Chunlei Wu, Product Analysis Laboratory, Freescale Semiconductor (China) Limited, Tianjin, China Characterization and Simulation of a Body Biased Structure in Triple-Well Technology Under Pulsed Photoelectric Laser Stimulation: Mr. Nicolas Borrel1, Mr. Clement Champeix1, Mrs. Edith Kussener2, Mr. Wenceslas Rahajandraibe2, Mr. Mathieu Lisart1, Mr. Jean-Max Dutertre3 and Mr. Alexandre Sarafianos1, 1 STMicroelectronics, Rousset, France, 2IM2NP-UMR CNRS 7334 / Aix-Marseille University, Marseille, France, 3Ecole Nationale Supérieure des Mines de St-Etienne, CMP-GC, Gardanne, France Quantitative Analysis of Heterogeneous Materials by SEM/ EDS by Use of Rapid Phase Decomposition: Mr. John F. Konopka, Thermo Fisher Scientific, Madison, WI Safe Decapsulation Techniques Using Viton Caulk: Mr. Kristopher D. Staller, Tucson Device Analysis Operations Laboratory, Texas Instruments, Tucson, AZ Sample Preparation for High Numerical Aperture Solid Immersion Lens Laser Imaging: Mr. Maozhe Samuel Wei1 and Mr. Soon Huat Lim2, 1Advanced Micro Devices (Singapore) Pte Ltd, Singapore, Singapore, 2Device Analysis Laboratory, Advanced Micro Devices Pte Ltd, SIngapore, Singapore Continuous Wave 1064nm Laser for Laser Voltage Imaging and Probing Applications: Mr. Venkat Ravikumar1, S.L. Phoa1, Prasad Sabbineni2 and Dr. Dmitry Skvortsov2,3, 1Advanced Micro Devices - Singapore Pte Ltd, Singapore, Singapore, 2DCG Systems, Fremont, CA, 3DCG Systems, Inc, Fremont, CA Static Fault Isolation on The Functional Failure of An Digital IC Device: Dr. Changqing Chen, Failure Analysis, Product failure analysis, Product, test and failure analysis Dept. (PTF Singapore), Globalfoundries Singapore, Singapore, Singapore Development of DPA(Distractive Physical Analysis) for Cu wire device: Mr. Hirofumi Tateyama, Reliability Analysis Division, Oki Engineering Co., Ltd., Nerima-ku,Tokyo, Japan TDR Analysis on Short Transmission Lines: Mr. Nicholas Konkol and Mr. Colin Stark, MSECE, GPAC, Intel Corporation, Hillsboro, OR Ex Situ Lift Out of PFIB Prepared Site Specific Specimens: Dr. Lucille A. Giannuzzi1, Dr. Lisa Chan2 and Dr. Jon M. Hiller2, 1 EXpressLO LLC, Fort Myers, FL, 2Tescan USA, Inc., Cranberry Township, PA Test Circuit Conditioning for Soft Defect Localization: Mr. Kristopher D. Staller, Tucson Device Analysis Operations Laboratory, Texas Instruments, Tucson, AZ Failure Analysis Methodology on Resistive Open Defects: Dr. Alfred C.T. Quah, Mr. Ghim Boon Ang, Mr. Dayanand NAGALINGAM, Ms. Magdeliza Gunawardana, Mrs. Ng Hui Peng, Soh Ping NEO, Dr. Z.H. Mai and J. C. Lam, Product, Test and Failure Analysis, GLOBALFOUNDRIES Singapore Pte Ltd, Singapore, Singapore To Eliminate Curtain Effect of FIB TEM Samples by a Combination of Sample Dicing and Backside Milling: Dr. Jian-Shing Luo and Ms. Hsiu-Ting Lee, Physical Failure Analysis Department, Inotera Memories, Inc., Taoyuan, Taiwan Integrated ESD Robustness through Device Analysis of Ultra-Small Low Voltage Power MOSFETs: Mr. Ian Kearney1 and Mr. Hank Sung2, 1Texas Instruments, Bethlehem, PA, 2Texas Instruments, Dallas, TX Ultra-Low Voltage TRE Measurements from 32 nm SOI CMOS Integrated Circuits: Dr. Andrea Bahgat Shehata1, Dr. Franco Stellari2, Alan Weger2, Dr. Peilin Song1, Dr. Vikas Anant3, Kristen Sunter4, Dr. Karl Berggren4, Dr. Ted R. Lundquist5 and Dr. Euan Ramsay5, 1Circuit Test and Diagnostics Technology, IBM T.J. Watson Research Center, Yorktown Heights, NY, 2IBM Research, Yorktown Heights, NY, 3Photon Spot, Monrovia, CA, 4 Research Laboratory of Electronics, Massachusetts Institute of Technology, Cambridge, MA, 5DCG Systems, Inc, Fremont, CA Marginal Failure Diagnosed with LADA: Case Studies: Mr. Sukho Lee1, Mr. Keonil Kim1, Mr. Yunwoo Lee1, Mr. Euncheol Lee1, Mr. Yojoung Kim1 and Mr. Izak Kapilevich2, 1Product & Test Engineering Team, Samsung Electronics co. Ltd, Young-in, South Korea, 2DCG Systems, Fremont, CA Memory Address Verification Using NIR Laser: Mr. Wilson Lee Cheng Hoe, Failure Engineer, Qualcomm, Singapore, Singapore Visit Expo Hall B3 to view this year’s posters, watch videos and to cast your vote! Programs are tentative: papers, authors, and order of presentations are subject to change. 22 Wednesday, November 12, 2014 Circuit Edit 3:30 p.m.-4:20 p.m. Meeting Room: 310 B Sample Preparation and Device Deprocessing I 3:30 p.m.-5:35 p.m. Meeting Room: 310 A Session Chairs: Dr. Michael DiBattista Qualcomm Technologies, Inc. San Diego, CA USA Session Chairs: Mr. Roger Alvis FEI Company Hillsboro, OR USA Mr. Dane Scott Intel Corporation Folsom, CA USA Mr. Bryan Tracy Spansion, LCC Sunnyvale, CA USA 3:30 p.m. Using Energy Dispersive Spectroscopy (EDS) to Determine the Resistance of FIB Jumpers for Circuit Edit: Dr. Michael DiBattista1, Mr. Hasan Faraby2, Mr. Corey Senowitz1 and Dr. Prabhakar Bandaru3, 1Qualcomm Technologies, Inc., San Diego, CA, 2Department of Electrical and Computer Engineering, University of California, San Diego, La Jolla, CA, 3Department of Mechanical and Aerospace Engineering, University of California, San Diego, La Jolla, CA 3:30 p.m. Basic Decapsulate Tool Function Develop for Cu Wire Bonding IC and the Real Usage on Function Extended Basic EMMI for Dynamic EFA: Ms. Yoyo Wen1 and Ms. May Yang2, 1SMIC, Beijing, BC, China, 2Analysis Lab, Semiconductor Manufacturing International (Beijing) Corp, Beijing, China 3:55 p.m. Effective and Efficient FEOL Defects Localization/ Inspection By Selective Mechanical/Chemical Deprocessing: Mrs. Ng Hui Peng, Ms. Angela Teo, Mr. Ang Ghim Boon, Mr. Kim Hong Yip, Dr. Chang Qing Chen, Dr. Alfred C.T. Quah, Mr. Tam Yong Seng, Dr. Jeffrey Lam and Dr. Zhihong Mai, Product, Test and Failure Analysis, GLOBALFOUNDRIES Singapore Pte Ltd, Singapore, Singapore 3:55 p.m. New Ion Source for High Precision FIB Nanomachining and Circuit Edit: Dr. Adam V. Steele1, Dr. Brenton Knuffman1 and Dr. Jabez J. McClelland2, 1zeroK NanoTech Corporation, Montgomery Village, MD, 2National Institute of Standards and Technology, Gaithersburg, MD 4:20 p.m. Site-Specific, Wide Field-of-View Cross-Sectional Sample Preparation, Imaging and Analysis in a Plasma Ion Source Microscope: Mr. Roger Alvis and Mr. Ron Kelley, FEI Company, Hillsboro, OR 4:45 p.m. microPREP - A Novel Laser Tool for High-Throughput Sample Preparation: Prof. Thomas Höche, Center for Applied Microstructure Diagnostics, Fraunhofer IWM Halle, Halle, Germany continued Programs are tentative: papers, authors, and order of presentations are subject to change. 23 Wednesday, November 12, 2014 Microscopy II 4:20 p.m.-6:00 p.m. Meeting Room: 310 B 5:10 p.m. Application of Fast Laser Deprocessing Techniques in Physical Failure Analysis on SRAM Memory of Advance Technology: Mr. H.H. Yap1, P. K. Tan2, Mr. G.R. Low3, Dr. M. K. Dawood3, Mr. Hua Feng4, Mr. Y.Z. Zhao1, Mr. R. He3, H. Tan3, Dr. Yamin Huang5, Dr. Dandan Wang6, Mr. Y. Zhou1, Mr. Pariyarathu Salimon Limin3, Ms. Sabitha James3, Dr. Jeffrey Lam7 and Dr. Z.H. Mai8, 1Technology Development- New Technology Prototyping, Global Foundries, Singapore, Singapore, 2Technology Development, Globalfoundries Singapore Pte Ltd., Singapore, Singapore, 3Technology Development-New Technology Prototyping, Globalfoundries Singapore Pte. Ltd., Singapore, Singapore, 4TD-NTP-PSE, GLOBALFOUNDRIES Singapore Pte. Ltd, Singapore, Singapore, 5 GLOBALFOUNDRIES Singapore Pte Ltd, Singapore, Singapore, 6 GLOBALFOUNDRIES Singapore Pte. Ltd, Singapore, Singapore, 7 Technology Development- New Technology Prototyping, GLOBALFOUNDRIES, Singapore, Singapore, 8Product, Test and Failure Analysis, GLOBALFOUNDRIES Singapore Pte Ltd, Singapore, Singapore Session Chair: Mr. Carl Nail Evans Analytical Group, LLC Irvine, CA USA 4:20 p.m. Evaluation of Power SiC-MOSFET Using Super-HigherOrder Scanning Nonlinear Dielectric Microscopy: Imaging of Carrier Distribution and Depletion Layer: Mr. Norimichi Chinone1, Dr. Takashi Nakamura2 and Prof. Yasuo Cho1, 1 Research Institute of Electrical Communication, Tohoku University, Sendai, Japan, 2Power Electronics R&D Unit, ROHM Co., Ltd., Kyoto, Japan 4:45 p.m. Imaging Performance of aSIL Microscopy on Subsurface Imaging of SOI Chips: Ms. Aydan Uyar1, Mr. Abdulkadir Yurt2, Mrs. Tenzile Berkin Cilingiroglu1, Prof. Bennett B. Goldberg3 and Prof. M. Selim Ünlü1, 1Electrical and Computer Engineering, Boston University, Boston, MA, 2Material Science, Boston University, Boston, MA, 3Physics, Boston University, Boston, MA 5:10 p.m. Methods to Reconstruct SEM and Optical Probe Tips using a FIB Tool: Mr. Walter Lepuschenko and David Goulet, IBM Microelectronics, Essex Junction, VT 5:35 p.m. Near-Field Scanning Optical Microscopy for Through-Silicon Imaging and Fault Isolation of Integrated Circuits: Dr. Rajiv Giridharagopal, Dr. Travis M. Eiles and Dr. Baohua Niu, TMG Labs, Intel Corp., Hillsboro, OR Programs are tentative: papers, authors, and order of presentations are subject to change. 24 Thursday, November 13, 2014 Time Room Session 8:00 a.m. – 9:40 a.m. 310A Sample Preparation and Device Deprocessing II 8:00 a.m. – 9:40 a.m. 310B Case Studies and the Failure Analysis Process II 9:40 a.m. – 9:50 a.m. Meeting Space Foyer Refreshment Break 9:50 a.m. – 11:55 a.m. 310A Sample Preparation and Device Deprocessing III 9:50 a.m. – 11:30 a.m. 310B Defect Characterization and Metrology 11:55 a.m. – 1:00 p.m. Grand Ballroom B Attendee Luncheon 12:20 p.m. – 2:20 p.m. Grand Ballroom B Sample Prep/3D Package Prep User Group 2:20 p.m. – 2:30 p.m. Meeting Space Foyer Refreshment Break 2:30 p.m. – 3:20 p.m. 310A Sample Preparation and Device Deprocessing IV 2:30 p.m. – 3:45 p.m. 310B Software-Based Techniques, Test, Diagnostics, and Yield 3:45 p.m. – 5:45 p.m. Grand Ballroom B FIB User Group Sample Preparation and Device Deprocessing II 8:00 a.m.-9:40 a.m. Meeting Room: 310 A Case Studies and the Failure Analysis Process II 8:00 a.m.-9:40 a.m. Meeting Room: 310 B Session Chairs: Mr. Roger Alvis FEI Company Hillsboro, OR USA Session Chairs: Prof. Peter Jacob EMPA Duebendorf Duebendorf, Switzerland Mr. Bryan Tracy Spansion, LCC Sunnyvale, CA USA Dr. Zhigang Song IBM Systems & Technology Hopewell Junction, NY USA 8:00 a.m. Application of Automated FIB for TEM Sample Preparation in Semiconductor Failure Analysis: Dr. Jie Zhu1, Dr. Si Ping Zhao1 and Mr. Mark Najarian2, 1QRA-FA, GLOBALFOUNDRIES Singapore, Singapore, Singapore, 2FEI, SARATOGA SPRINGS, NY 8:00 a.m. Incorporating a Compact Scan Diagnostic System Enhances the Failure Analysis Flow: Mr. Rommel Estores1, Pascal Vercruysse1, Karl Villareal1, Mr. Eric Barbian2, Mr. Ralph Sanchez3 and Mr. Rich Ackerman3, 1Failure Analysis, ON Semiconductor, Oudenaarde, Belgium, 2ON Semiconductor, Phoenix, AZ, 3 Teseda, Portland, OR 8:25 a.m. Development of Productive Polishing TEM Sample Preparation Methodology: Dr. Huisheng Yu, Mrs. Shuqing Duan, Ming Li, Qihua Zhang and Wei-Ting Kary Chien, Semiconductor Manufacturing International (Shanghai) Corp., Shanghai, China 8:25 a.m. Determination of the Source of an Electrical Over Stress Event to a Digital Variable Gain Amplifier Module: Ms. Thiri Htun1 and Mr. Steve Brockett2, 1Quality and Reliability, TriQuint Semiconductor, San Jose, CA, 2Quality and Reliability, TriQuint Semiconductor, Inc., Hillsboro, OR 8:50 a.m. Optimization of TEM Sample Preparation to Reduce the Overlapping of TEM Images: Mrs. Shuqing Duan, Liu Chen, Dr. Huisheng Yu, Ming Li, Qihua Zhang and Wei-Ting Kary Chien, Semiconductor Manufacturing International (Shanghai) Corp., Shanghai, China 8:50 a.m. Temperature-Dependent Logic Failure in a GaAs Power Amplifier-Duplexer Module Caused by a Subtle Parasitic Schottky Diode: Dr. Rose Emergo1, Mr. Steve Brockett2 and Mr. Pat Hamilton3, 1Quality and Reliability, TriQuint, Hillsboro, OR, 2 Quality and Reliability, TriQuint Semiconductor, Inc., Hillsboro, OR, 3Test & Front End Process, TriQuint, Hillsboro, OR 9:15 a.m. Delayering on Advanced Process Technologies using FIB: Dr. David Donnet, Mr. Oleg Sidorov, Dr. Chad Rue and Mr. Peter Carleson, FEI Company, Hillsboro, OR 9:40 a.m. – 9:50 a.m. • Refreshment Break • Meeting Space Foyer continued Programs are tentative: papers, authors, and order of presentations are subject to change. 25 Thursday, November 13, 2014 Sample Preparation and Device Deprocessing III 9:50 a.m.-11:55 a.m. Meeting Room: 310 A 9:15 a.m. Debugging Phase Locked Loop Failures in Integrated Circuit Products: Dr. SH Goh, Technology Development- New Technology Prototyping, GLOBALFOUNDRIES, Singapore, Singapore Session Chairs: Mr. Bryan Tracy Spansion, LCC Sunnyvale, CA USA 9:40 a.m. – 9:50 a.m. • Refreshment Break • Meeting Space Foyer Mr. Roger Alvis FEI Company Hillsboro, OR USA 9:50 a.m. A Novel Method for the Specified Site Planar View TEM Sample Preparation: Mrs. Shuqing Duan, Yanli Zhao and Ming Li, Semiconductor Manufacturing International (Shanghai) Corp., Shanghai, China 10:15 a.m. Investigation of Protection Layer Materials for Ex-situ ‘lift-out’ TEM sample Preparation Technique with FIB for 14nm FinFET: Mr. Hua Feng1, Mr. G.R. Low2, Mr. P.K. Tan2, Mr. Y.Z. Zhao3, Mr. H.H. Yap3, Dr. M. K. Dawood2, Mr. Y. Zhou3, Dr. Anyan Du4, Dr. Changqing Chen5, H. Tan2, Dr. Yamin Huang6, Dr. Dandan Wang7, Dr. Jeffrey Lam2 and Dr. Z.H. Mai8, 1TDNTP-PSE, GLOBALFOUNDRIES Singapore Pte. Ltd, Singapore, Singapore, 2Technology Development-New Technology Prototyping, Globalfoundries Singapore Pte. Ltd., Singapore, Singapore, 3Technology Development- New Technology Prototyping, Global Foundries, Singapore, Singapore, 4QRA-FA, GLOBALFOUNDRIES Singapore, Singapore, Singapore, 5Failure Analysis, Product failure analysis, Globalfoundries Singapore, Singapore, Singapore, 6GLOBALFOUNDRIES Singapore Pte Ltd, Singapore, Singapore, 7GLOBALFOUNDRIES Singapore Pte. Ltd, Singapore, Singapore, 8Product, Test and Failure Analysis, GLOBALFOUNDRIES Singapore Pte Ltd, Singapore, Singapore 10:40 a.m. Application of Passive Voltage Contrast (PVC) to DualBeam Focused Ion Beam (FIB) Based Sample Preparation for the Scanning/Transmission Electron Microscope (S/TEM): Mr. Corey Senowitz, Ms. Theresa Graupera, Mr. Don Lyons, Mr. Hieu Nguyen, Ms. Ruby Vollrath and Dr. Michael DiBattista, Qualcomm Technologies, Inc., San Diego, CA 11:05 a.m. Tri-Directional TEM Failure Analysis on Sample Prepared By in-Situ Lift-out FIB and Flipstage: Dr. Jie Zhu, Elizabeth Sebastian, QRA-FA, GLOBALFOUNDRIES Singapore, Singapore, Singapore 11:30 a.m. Will Tomorrow’s Failure Analysis Lab Operate more like Today’s Fab?: Mr. Todd J. Templeton, Electronics Business Unit, FEI Company, Hillsboro, OR 11:55 a.m. – 1:00 p.m. • Attendee Luncheon • Grand Ballroom B Programs are tentative: papers, authors, and order of presentations are subject to change. 26 Thursday, November 13, 2014 Defect Characterization and Metrology 9:50 a.m.-11:30 a.m. Meeting Room: 310 B Sample Prep/3D Package Prep User Group 12:30 p.m.-2:20 p.m. Meeting Room: Grand Ballroom B Session Chairs: Mr. Terence Kane IBM Hopewell Junction, NY USA Re-Packaging Challenges for FA, Monte Drennan, Priority Packaging, Inc. Sample Preparation for Enhanced LIT Isolation, Eddy Chua Bok Khoon, Infineon Mr. Phil Kaszuba IBM Systems and Technology Essex Junction, VT USA Advancements in Sample Preparation, Chris Richardson, Allied High Tech Products, Inc. Milli-to-Nano, Helios PFIB Dual Beam, a Single-Tool Workflow for EFI-to-PFA, Roger Alvis, FEI Corporation 9:50 a.m. Localization of Weak Points in Thin Dielectric Layers By Electron Beam Absorbed Current (EBAC) Imaging: Mr. Jörg Jatzkowski, Mr. Michél Simon-Najasek and Mr. Frank Altmann, Center for Applied Microstructure Diagnostics (CAM), Fraunhofer Institute for Mechanics of Materials, Halle, Germany 2:20 p.m. – 2:30 p.m. • Refreshment Break • Meeting Space Foyer Sample Preparation and Device Deprocessing IV 2:30 p.m.-3:20 p.m. Meeting Room: 310 A 10:15 a.m. Al-Cu Alloy Films Characterization & Studies using TOFSIMS, XPS, AFM, EBSD and TEM: Mr. Jingjing Shao, Surface Group, Wintech Nano-Technology Services Pte. Ltd, Singapore, Singapore Session Chairs: Mr. Bryan Tracy Spansion, LCC Sunnyvale, CA USA 10:40 a.m. Advanced Failure Analysis on Silicon Pipeline Defects and Dislocations in Automotive Mixed-Mode Devices: Dr. Yann Weber1, Mr. Julien Goxe1, Dr. Stephane alves1, Mr. Thomas zirilli1, Dr. Marie Castignolles1, Dr. Sam Subramanian2, Dr. Yuk Tsang2 and Mr. Keith Harber2, 1Quality Labs, Freescale Semiconducteurs France SAS, Toulouse, France, 2Freescale Semiconductor, Inc., Austin, TX Mr. Roger Alvis FEI Company Hillsboro, OR USA 2:30 p.m. TEM Sample Preparation Methods for MEMS Floating Structure Analysis: Dr. Huisheng Yu, Shuqing Duan and Ming Li, Semiconductor Manufacturing International (Shanghai) Corp., Shanghai, China 11:05 a.m. Foil Capacitor Characterization and Failure Analysis with Special Respect to Noise Filter Applications: Prof. Peter Jacob, Principal Engineer Microstructure Failure Analysis, Dept. Electronics/ Metrology - Reliability-Center, EMPA Duebendorf (50%, 1993-today, Main Affiliation), Duebendorf, Switzerland 2:55 p.m. Cross-Section Sample Preparation Method for Imaging Dopant Related Anomalies Using Scanning Probe Microscopy Techniques: Dr. Sam Subramanian, Mrs. Khiem ly and Mr. Tony Chrastecky, Freescale Semiconductor Inc., Austin, TX 11:55 a.m. – 1:00 p.m. • Attendee Luncheon • Grand Ballroom B Programs are tentative: papers, authors, and order of presentations are subject to change. 27 Thursday, November 13, 2014 Software-Based Techniques, Test, Diagnosis, and Yield 2:30 p.m.-3:45 p.m. Meeting Room: 310 B FIB User Group 3:45 p.m.-5:45 p.m. Meeting Room: Grand Ballroom B Session Chairs: Mr. Geir Eide Mentor Graphics Wilsonville, OR USA Enabling EFI, EFA and PFA with Plasma FIB - Large Area sampling for X-ray Tomography and Batch Lamella Preparation, Ron Kelly, FEI Company Elimination of ESD damage during FIB operations, Valery Ray, NISP Lab, University of Maryland Mr. Mark E. Kimball Maxim Integrated Products, Inc. Hillsboro, OR USA FIB line resistivity calculations, there’s an app for that, Michael DiBattista, Qualcomm Incorporated 2:30 p.m. Design Debug for Intermittent Power up Failure in Analog/Mixed Signal Device: Mr. Sagar Karki, DDAO, Texas Instruments Corporation, Dallas, TX 2:55 p.m. A Case Study on the Benefits of Functional Memory Access During ATE Test and Electrical Fault Isolation Techniques for Embedded SRAM: Mr. Corey Goodrich, SBDAO, Texas Instruments, Dallas, TX 3:20 p.m. Introduction to Verification and Test Using a 4-bit Arithmetic Logic Unit Including a Failure Module in a Xilinx XC9572XL CPLD: Dr. Martin Versen1 and Mr. Michael Hayn2, 1Faculty of Engineering, University of Applied Sciences Rosenheim, Rosenheim, Germany, 2University of Applied Sciences Rosenheim, Rosenheim, Germany 2015 I N T E R N AT I O N A L S Y M P O S I U M F O R T E S T I N G A N D F A I L U R E A N A LY S I S C F O N O F L E L R E O N C W E & T E H X P E O S D I T A I O T N A NOVEMBER 1–5, 2015 OREGON CONVENTION CENTER • PORTLAND, OR, USA C A L L F O R PA P E R S ABSTRACT DEADLINE: APRIL 17, 2015 Sponsored By: ISTFA 2015 CFP for 2014 Final Program.indd 1 10/13/14 1:22 PM Programs are tentative: papers, authors, and order of presentations are subject to change. 28 Education Short Courses Full Day Course Price* EDFAS Member - $499 EDFSD Non-Member - $625 Student - $199 Education Short Courses will be held at the Hilton Americas – Houston on Saturday, November 8, 2014. Half Day Course Pricing* EDFAS Member - $249 EDFSD Non-Member - $375 Student - $99 AS6171 Counterfeit Electronics Detection Test Techniques and Implementation Instructor: Bhanu Sood Time: 8:30 a.m. – 12:30 p.m. Room: 337 B Course Description: This short course being offered at ISTFA 2014 begins with a brief introduction to the electronic parts supply chain, the sources of authorized and unauthorized parts and overview of the diverse counterfeit part creation techniques. The tools, techniques and procedures for the non-destructive, destructive and analytical technique that are part of AS6171 will be discussed. Also included are discussions of minimum level of inspection, sampling plan based on tier level of accepted risk, and reject criteria. Attendees will also get an overview of the certification and training requirements for each AS6171 inspection technique. In the end, authentication tools (such as DNA marking, dye pigments and barcodes) will be discussed. Fault Isolation Instructor: David Vallett Time: 8:30 a.m. – 4:30 p.m. Room: 338 Course Description: Technology development, yield learning, and reliability engineering are critical to the microelectronics and now nanoelectronics business. All are highly dependent on fault isolation and failure analysis. With higher density packaging, transistor counts into the billions, scaling below 22 nanometers, and new materials however, analysis of root cause of failures is becoming exceedingly challenging. This course examines both traditional and recently developed tools and techniques for isolating defects on simple and advanced ICs and microelectronic devices. Packaging FA Instructor: Becky Holdford Time: 8:30 a.m. – 4:30 p.m. Room: 337 A Course Description: The course will teach the basics of package failure analysis including common package construction, the most common fault isolation tools/techniques, common fail modes/mechanisms, die access techniques for plastic and hermetic packages, and some case studies. * Separate Registration Required 29 Author Index A Ackerman, R...............................25 Albert, D........................................7 Altmann, F......................... 8, 16, 27 Alton, J........................................19 Alves, S........................................27 Alvis, R................................... 23, 27 Anant, V.......................................22 Ang, G.B........................... 11, 21, 22 B Bandaru, P..................................23 Barbeau, S..................................19 Barbian, E...................................25 Barton, D.L....................................7 Berggren, K.................................22 Bernhard-Hofer, K........................7 Bescup, J.....................................20 Beutler, J.....................................15 Binczak, S...................................21 Biring, S.......................................22 Bockelman, D.............................14 Bodoh, D.J............................ 11, 14 Boit, C...........................................8 Boon, A.G.............................. 19, 23 Borrel, N......................................22 Boscaro, A...................................21 Brockett, S..................................25 Bruce, M.................................. 8, 15 C Cao, L..........................................17 Carleson, P..................................25 Castignolles, M..................... 11, 27 Cawthorne, A.B...........................13 Celi, G..........................................11 Champeix, C................................22 Chan, L........................................22 Chang, Y.-P..................................21 Chapman, F.................................14 Che, Y...........................................17 Chef, S.........................................21 Chen, C.Q.......11, 18, 19, 22, 23, 26 Chen, H.C....................................21 Chen, L........................................25 Chen, S........................................14 Chen, Y.........................................17 Chien, W.-T.K...............................25 Chinone, N..................................24 Chithambaram, S.......................21 Cho, Y...........................................24 Chrastecky, T...............................27 Chu, C.H......................................22 Cilingiroglu, T.B.................... 12, 24 Clement, J...................................15 Cole, Jr., E.I......................... 7, 8, 15 Cordes, A.....................................18 Crawford, T..................................14 D D’Aleo, C........................................8 Dawood, M.K................... 18, 24, 26 Dayanand, N...............................11 Deslandes, H......................... 12, 15 deWolf, I......................................13 DiBattista, M................... 23, 26, 28 Dickson, K...................................14 Dluhos, J.....................................16 Domengès, B...............................14 Donnet, D....................................25 Drennan, M.................................27 Du, A............................................26 Duan, S............................ 25, 26, 27 Dudit, S................................. 11, 15 Dutertre, J.-M..............................22 Dyer, T..........................................18 Hollerith, C..................................16 Hooghan, B.................................21 Hrncir, T.......................................16 Htun, T.........................................25 Hua, Y.................................... 17, 19 Huang, Y................................ 24, 26 I Igarashi, M...................................19 Infante, F.....................................13 J Jacob, P................................... 9, 27 Jacquir, S....................................21 James, S................................ 18, 24 Jatzkowski, J..............................27 Jeffers, A.....................................13 JH, L............................................18 Johnson, G.M................................8 E Eiles, T.M.....................................24 Emergo, R...................................25 Er, E.............................................19 Erington, K............................ 11, 14 Estores, R....................................25 K Kane, T..........................................9 Kapilevich, I................................22 Karki, S........................................28 Karl, W.C......................................12 Kearney, I....................................22 Keim, M.........................................7 Kelley, R................................ 13, 23 Kelly, R........................................28 Kerisit, F......................................14 Khoo, G.......................................14 Khoon, E.C.B...............................27 Kim, H.........................................18 Kim, J..........................................18 Kim, K..........................................22 Kim, Y...........................................22 Kleindiek, S.................................18 Knuffman, B................................23 Kolasa, T......................................21 Komrowski, A..............................19 Konkol, N....................................22 Konopka, J.F...............................22 Konrad, J.....................................12 Kopecek, J..................................16 Kor, H.B.......................................14 Krueger, B...................................16 Kussener, E.................................22 F Falk, R.A......................................20 Faraby, H.....................................23 Farrell, C......................................11 Feng, H.................................. 24, 26 Forte, D.......................................13 Frantz, G......................................10 G Gagliolo, N..................................13 Gan, C.L.......................................14 Garrahan, S.................................13 Gaudestad, J......................... 12, 13 Giannuzzi, L.A.............................22 Giridharagopal, R.......................24 Glowacki, A...................................8 Goh, S.H............................ 7, 21, 26 Goldberg, B.B........................ 12, 24 Goodrich, C.................................28 Goulet, D.....................................24 Goxe, J................................... 11, 27 Graupera, T.................................26 Grogan, M.D.W............................12 Gspan, C......................................17 Gunawardana, M.................. 11, 22 Gwee, H.Y.....................................14 L H Lam, J.C... 18, 19, 21, 22, 23, 24, 26 Lange, G......................................14 Lawrence, D.F.............................12 Lee, E...........................................22 Lee, H.-T......................................22 Lee, J.H.......................................18 Lee, K...........................................18 Lee, S...........................................22 Lee, Y...........................................22 Lepuschenko, W.........................24 Leslie, N.......................................11 Lewis, D.......................................11 Li, J..............................................17 Haber, T.......................................17 Hamilton, P.................................25 Hand, S.M....................................18 Harber, K.....................................27 Hayn, M.......................................28 He, R............................................24 Herold, R.....................................16 Herschbein, S.B............................8 Hiller, J.M....................................22 Hladik, L......................................16 Höche, T......................................23 Hoe, W.L.C...................................22 30 Li, M................................. 25, 26, 27 Li, S................................................7 Li, X..............................................17 Lim, S.H.......................................22 Limin, P.S.............................. 18, 24 Lin, C.-C.......................................12 Lin, J.-C.......................................21 Lisart, M......................................22 Liu, B...........................................19 Liu, Q...........................................14 Liu, S.-Y........................................21 Livengood, R.................................8 Lotharukpong, S.........................17 Low, G.R.......................... 18, 24, 26 Lundquist, T.R................. 11, 12, 22 Luo, J.-S......................................22 Ly, K.............................................27 Lyons, D.......................................26 M Madala, S....................................13 Mai, Z.H.... 18, 19, 21, 22, 23, 24, 26 Martin, J......................................21 Masuda, M...................................17 McClelland, J.J............................23 Miller, M.A....................................15 Moghe, A.....................................13 Moon, S.J....................................21 Moore, T.M....................................7 Morrison, T..................................13 Moyal, E.......................................16 Mulder, R.E....................................7 Myers, T.........................................7 N Nagalingam, D...................... 21, 22 Najarian, M........................... 19, 25 Nakamura, T...............................24 Naumann, F................................16 Neo, S.P..................... 11, 19, 21, 22 Newton, B...................................18 Ng, H.P................................... 19, 21 Nguyen, H...................................26 Niu, B..................................... 14, 24 Nuez, D.................................. 13, 19 O Obein, M......................................14 Orozco, A.....................................13 P Parrassin, T............................ 11, 15 Patterson, O.D............................19 Peng, N.H.............................. 22, 23 Perdu, P................................. 11, 21 Phoa, S.L.....................................22 Q Qian, Z.........................................15 Quah, A.C.T...........11, 19, 21, 22, 23 R Rahajandraibe, W.......................22 Ramsay, E............................. 12, 22 Author Index Ravikumar, V...............................22 Ray, V...........................................28 Reid, D.T......................................11 Reverdy, A............................. 11, 15 Richardson, C....................... 12, 27 Rowlett, C...................................13 Rue, C..........................................25 S Sabbineni, P................................22 Sanchez, K..................................21 Sanchez, R..................................25 Sarafianos, A...............................22 Scheffler, C....................................8 Sebastian, E................................26 Seng, T.Y......................................23 Senowitz, C........................... 23, 26 Serrels, K.A..................................11 Shah, S........................................19 Shahbazmohamadi, S................13 Shao, J........................................27 Shehata, A.B......................... 12, 22 Shin, J.........................................18 Siah, Y.W......................................14 Sias, K.C......................................16 Sidorov, O............................... 8, 25 Simon-Najasek, M......................27 Skvortsov, D................................22 Song, P............................ 12, 21, 22 Song, Z........................................19 Staller, K.D..................................22 Stark, C........................................22 Steele, A.V....................................23 Stellari, F......................... 12, 21, 22 Stevens, J....................................15 Stoker, D......................................15 Subramanian, S...................... 8, 27 Suh, W.........................................18 Sung, H........................................22 Sunter, K.....................................22 V T W Vallet, M................................ 11, 15 Vallett, D................................. 8, 12 Vanderlinde, W.E..........................8 VanVianen, A...............................18 Vedagarbha, P.............................11 Vercruysse, P...............................25 Versen, M.....................................28 Villareal, K...................................25 Vollrath, R...................................26 Tan, H.............................. 18, 24, 26 Tan, P...........................................13 Tan, P.K........................... 18, 24, 26 Tan, S............................................8 Tateyama, H................................22 Tehranipoor, M...........................13 Templeton, T.J............................26 Teo, A..................................... 19, 23 Teshima, J...................................16 Theodore, N.D............................18 Torkashvan, K.............................13 Tsai, C.Y........................................21 Tsang, Y.L.............................. 18, 27 Tuysuzoglu, A..............................12 Walter, J......................................17 Wang, D................................. 24, 26 Wang, T........................................13 Wang, X.-D...................................18 Want, N.......................................19 Weber, T......................................13 Weber, Y................................. 11, 27 Weger, A................................ 12, 22 Weger, A.J....................................21 Wei, M.S.......................................22 Wellstood, F.C.............................13 Wen, Y..........................................23 Wettermann, R...........................17 Wilshaw, P...................................17 Won, J.........................................18 Wong, E.......................................13 Wu, C..................................... 14, 22 U Ünlü, S................................... 12, 24 Uyar, A.........................................24 31 Wu, M..........................................17 Wu, Q...........................................19 X Xie, S............................................19 Xu, Q............................................19 Y Yang, M.................................. 18, 23 Yap, M.H.......................... 18, 24, 26 Yeoh, B.L.....................................21 Yip, K.H............................ 19, 21, 23 Yoon, M........................................18 Yu, H...................................... 25, 27 Yurt, A.................................... 12, 24 Z Zhang, Q.....................................25 Zhao, S.P............................... 19, 25 Zhao, Y.Z............................... 24, 26 Zhou, Y............................ 17, 24, 26 Zhu, J.............................. 19, 25, 26 Zie, T............................................21 Zirilli, T........................................27 Zumwalt, S..................................18 Notes 32 Notes 33 Show Directory EXHIBIT HOURS Expo Hall B3 Tuesday, November 11, 2014– 9:00 a.m. – 6:00 p.m. Refreshment Break - 9:40 a.m. – 9:55 a.m. Lunch – 12:00 p.m. – 1:30 p.m. Refreshment Break – 2:20 p.m. – 2:35 p.m. Expo Networking Reception – 4:00 p.m. – 6:00 p.m. Wednesday, November 12, 2014– 9:30 a.m. - 3:30 p.m. Refreshment Break - 10:00 a.m. – 10:15 a.m. EDFAS General Membership Meeting and Luncheon – 12:15 p.m. – 1:30 p.m. Exhibitor Dessert Reception, Poster, and Video Contest – 1:30 p.m. – 3:30 p.m. Because there may have been some late changes in booth assignments, some exhibitors may have a different booth number than was shown on their invitations and advertising. Please check this Directory for the most-up-to-date listings, as well as onsite signage. Reasonable precautions have been taken to avoid errors and omissions from this Directory, but ASM International does not guarantee listings herein and shall not be responsible for errors or omission in this Directory. 34 SPONSORS Thank You To Our 2014 Sponsors! Corporate Sponsor: Sponsors: Media Sponsor: EDFA eNews 35 Patented, ultra-high-efficiency downstream plasma cleaner “Absolutely the most advanced electron microscope cleaner on the market...” Removes hydrocarbons in-situ from SEMs, FIBs, TEMs and other analytical tools — and pre-cleans samples ex-situ Before cleaning After GV10X cleaning 10X Faster Hydrocarbon Removal Exclusive 5 mTorr plasma and >20W power generates greater O 0 density with longer mfp — giving GV10X significantly higher ashing efficiency than competitive cleaners. Much Gentler Cleaning Gently oxidizes hydrocarbons into molecules that are pumped free of the chamber. No specimen damage from energetic species, sputtering or heat. Easy-to-use graphical user interface gives operator full control of all functions. Faster Start, Total Control Universal software works on any EM — no system integration needed. Start using GV10X in two minutes. Easy-to-use GUI gives operator full control of all functions. Uninterrupted Specimen Analysis Want to clean a specimen during analysis? It’s easy. Takes just 5 minutes for GV10X to cycle On/Clean/Off — not an hour! Get more information: ibssAd-ASM 1pg 11.14.indd 1 admin@ibssgroup.com • The World’s Most Advanced Electron Microscope Cleaning See us at Booth #508 1 (415) 566-5774 • www.ibssgroup.com 10/10/14 4:32:34 PM Tools of the Trade Tour Tools of the Trade Tour What: Demonstrations of the latest products and services. Learn useful information and see firsthand the latest tools in the industry. Take part in the parallel technical session and see equipment in action right on the show floor… Where: Expo Show Floor—Expo Hall B3 When: Monday, November 10th Time: 5:00-6:45 p.m. Scheduled Tours: Allied High Tech Products, Inc. Bruker Optics Checkpoint Technologies, LLC E.A. Fischione Instruments, Inc. HiLevel Technology, Inc. Hitachi High Technologies America, Inc. LatticeGear LLC Mentor Graphics RKD Engineering SPI Supplies ULTRA TEC Manufacturing, Inc. Varioscale, Inc. (Must Pre-Register to Attend – Space is Limited – First Come, First Served) Allied High Tech Products, Inc. Booth #: 309 Product Name: X-Prep Mechanical Milling Machine Product Description: Automated, 5-axis mechanical milling machine for failure analysis (backside/frontside thinning and delayering), die extraction, materials research, and more. Overview of Demonstration: Tour attendees will be able to see a demonstration of the X-Prep removing a specific amount of material from the backside of a chip package. The X-Prep is not new – but has exciting new milling capabilities such as 3D contouring and removal of +/- 5 µm remaining silicon thickness for SIL requirements. These capabilities have been unavailable on most milling machines in our industry! Bruker Corporation Booth #: 403 Product Name: NEW: LUMOS—Stand Alone FT-IR Microscope with Full Automation Product Description: LUMOS is a stand-alone FT-IR microscope with full automation. It is designed to combine best performance for visible inspection and infrared spectral analysis with a simple and easy-to-use interface. Due to the motorization of all moveable components inside the LUMOS, the system provides a high degree of automation. The intuitive software of the LUMOS guides the operator step by step through the process of data acquisition. The user interface presents only those options which may be applied next. Overview of Demonstration: In this demonstration we will show the high performance and ease of use the Lumos FTIR Microscope can add to your Laboratory. The system utilizes many automated features that we will demonstrate including, discrete point analysis, line mapping, and large area chemical images using Reflection, Transmission and even ATR Mapping. The high quality visual observation of the Lumos will also be on display, using the high resolution Digital camera that can take individual snap shots, automated digital zoom, or large area visual images. By utilizing various visual techniques, like bright-field and visual polarization, we will display the best way to collect and archive images with your Spectrum. 37 OptiFIB Tools of the Trade Tour Checkpoint Technologies, LLC Booth #: 203 Product Name: InfraScan™ ES-LW Product Description: Checkpoint Technologies, LLC, designs and manufactures optical failure analysis tools for the semiconductor industry. Checkpoint’s new InfraScan™ ES-LW, meets the demands of lower power IC designs and architectures. Smaller geometries and lower voltages IC’s require emission tools that see emissions further into the infrared regime than the traditional InGaAs cameras. E.A. Fischione Instruments, Inc. Booth #: 224 Product Name: Model 1080 PicoMill™ TEM specimen preparation system Product Description:The Model 1080 PicoMill™ TEM specimen preparation system combines an ultra-low energy, inert gas ion source and a scanning electron column with multiple detectors to yield optimal TEM specimen preparation. Overview of Demonstration: Do TEM specimen preparation First Time Right. Join us for a demonstration of the new Fischione Instruments Model 1080 PicoMill™ TEM specimen preparation system. Experience firsthand the fully integrated solution for producing the highest quality specimens possible for TEM imaging and analysis. The PicoMill system allows you to do TEM specimen preparation First Time Right. HiLevel Technology, Inc. Booth #: 310 Hitachi High Technologies America, Inc. Booth #: 119 Product Name: The Hitachi SU5000 Field Emission Scanning Electron Microscope Product Description: The SU5000, featuring a novel and revolutionary user interface called the EM WIZARD, provides even novice users with optimum levels of resolution, repeatability, and throughput. The advent of our new Automatic Axis Adjustment Technology restores the microscope to its “best condition” on demand, yielding on-demand image optimization optimizing performance on the fly! Overview of Demonstration: Hitachi is pleased to participate in this year’s Tools Tour at ISTFA 2014. Visitors to the booth can catch a firsthand look at this game-changing revolutionary software interface (EM WIZARD) and its patented technology on Hitachi’s latest addition to its product portfolio, the SU5000 FE-SEM, equipped with the innovations in field emission imaging our customers have come to expect. Expert or Novice, the SU-5000 and the EM Wizard puts Hitachi’s superior nano-scale imaging capabilities at everyone’s fingertips. The robust “draw-out” specimen chamber of the SU5000 accommodates large specimens (~200 mmf, ~80 mmH), and the instrument’s rapid sample exchange allows its user to go from evacuation to observation in 3 minutes or less! An on-site applications engineer will be available for demonstrations and to answer specific questions. LatticeGear, LLC. Booth: 521 Product Name: LatticeAx 300, Large Sample Platform for LatticeAx, Small Sample Cleaver Cleaving Tools Product Description: The LatticeAx 300 is LatticeGear’s highest performance www.latticegear.com cleaving system. The Ax is integrated with a vision package with 5 μm optical resolution cleaves with ±10μm accuracy in <5 minutes. NEW Large Sample Platform for the LatticeAx and Small Sample Cleaver accessories expand cleaving to full 300 mm wafers and samples as small as 4 mm. Overview of Demonstration: LatticeGear has the tools for those needing a simple, quick and accurate way to cleave SMALL samples LARGE wafers at low cost. The LatticeAx 300 will be demonstrated cleaving large wafer pieces and very small samples using the NEW accessories. 39 Revolutionary SEM Control Debuted from Hitachi EM Wizard Changes the Game SEM operation, as you currently know it, is about to change. Groundbreaking computer-assisted technology from Hitachi, referred to as EM Wizard, offers a new level of SEM operation and control. Expert or novice, the result is now the same: Highest quality nano-scale images at everyone’s fingertips! Schedule a demo of the all new Hitachi SU5000 FE‑SEM and experience EM Wizard at: Booth #119 Many More Exiciting New Products from Hitachi • Ion Milling Systems—Enhanced gun design for faster milling without compromising sample integrity. New cryo system available! • Tabletop SEM—World’s most popular tabletop SEM, the TM Series, now with a NEW Ultra Variable Detector! • Atomic Force Microscope—Environmental control SPM for measurement conditions including air, vacuum, and liquids. IM4000Plus Cryo AFM5300E Inspire Innovation through Collaboration *Hitachi is a registered trademark of Hitachi, Ltd. All other trademarks are property of respective owners. Copyright © 2014 Hitachi High Technologies America, Inc. All rights reserved. Hitachi High Technologies America, Inc. 2014-10Oct-ISTFA-SU5000.indd 1 www.hitachi-hta.com 800-548-9001 10/12/2014 1:53:43 PM Tools of the Trade Tour Mentor Graphics Corporation Booth #: 117 Product Name: Tessent Diagnosis Product Description: The Tessent Diagnosis software accelerates defect identification in digital semiconductor devices. New for 2014 is cell-aware technology that that enables diagnosis at transistor level. Failure analysis engineers will now know in advance what to look for in PFA. Overview of Demonstration: Attendees will be introduced to the diagnosis flow and see how Tessent Diagnosis software can be used to identify several types of defects in digital semiconductor devices based on design and failure data. The focus will be on the new transistor level (cell-aware) capability. RKD Engineering Booth #: 417 SPI Supplies Booth #: 316 Product Name: Plasma Prep Reactive Ion Etcher Product Description: The Plasma Prep RIE is a tabletop anisotropic plasma etcher designed for package removal and sample preparation. Featuring 200 watts of continuous power, the RF based system has a 10 inch diameter chamber. With a touchpad screen and dual gas inputs, it is designed to work with a number of gasses. Overview of Demonstration: We will be demonstrating the use of the system, as well describing the situations and applications it is designed to handle. ULTRA TEC Manufacturing, Inc. Booth #: 109 Product Name: PEEC for ASAP-1 IPS Product Description (50 words or less): PEEC for ASAP-1 IPS is a patent pending system upgrade that uses electronic data, gathered from the polishing tip, to provide REALTIME through-silicon characterization of the device under test (DUT) – thus achieving a specific remaining silicon thickness (RST) in the low single digits, and below. Overview of Demonstration: PEEC is suitable for dies which have already been thinned below 20 microns and offers PARAMETRIC, PLOT and OSCILLOSCOPE modes to achieve a higher level of confidence than traditional “cut-image-then-cut-some-more” techniques, by removing the need to continually transfer the part between polisher and microscope. Varioscale, Inc Booth #: 717 Product Name: VarioMill Product description: VarioMill: Adaptive 5-axis CNC Tool that Grinds and Polishes advanced package ICs. Continuous, sub-micron, 5-axis motion provides ultra-precise preparation for CE and FA. In-situ measurement tracks shape and thickness as the curved part surface changes during thinning. Automatic tool exchange enables multi-step processing from rapid grind to final optical polish. Overview of demonstration: We will be showing video clips of the tool in operation performing 5-axis CNC grinding, in situ measurement with adaptive shape feedback, as well as tool exchange and polishing. 41 Exhibit Hall Floor Plan 42 Exhibit List COMPANY BOOTH # Advanced Circuit Engineers, LLC...............................................719 Keysight Technologies...............................................................308 Agilent Technologies..................................................................610 Allied High Tech Products, Inc...................................................309 Angstrom Scientific Inc..............................................................220 Applied Beam.............................................................................616 Bruker Optics..............................................................................403 BSET EQ......................................................................................211 CAMECA Instruments, Inc...........................................................621 Carl Zeiss Microscopy, LLC.........................................................524 Carl Zeiss Microscopy, LLC.........................................................525 Checkpoint Technologies, LLC..................................................203 DCG Systems...............................................................................509 Digit Concept..............................................................................427 E.A. Fischione Instruments, Inc.................................................224 Ebatco.........................................................................................607 EDAX Inc......................................................................................724 Electron Microscopy Sciences...................................................527 Evans Analytical Group..............................................................304 EXpressLO LLC............................................................................608 FA Instruments Inc.....................................................................209 FEI Company...............................................................................402 Fraunhofer CAM .........................................................................518 Gatan, Inc....................................................................................204 Hadland Technologies...............................................................713 Hamamatsu Corporation...........................................................103 HDI Solutions - Hitachi...............................................................727 HiLevel Technology, Inc.............................................................310 Hitachi High Technologies America, Inc....................................119 HORIBA Scientific.......................................................................617 IEEE Reliability Society..............................................................718 Hysitron, Inc...............................................................................302 IR Labs........................................................................................627 ibss Group, Inc............................................................................218 JEOL USA, Inc.............................................................................213 JG & A Metrology Center............................................................619 Keyence Corporation.................................................................116 LatticeGear LLC..........................................................................521 Left Coast Instruments...............................................................417 COMPANY BOOTH # Leica Microsystems....................................................................609 Materials Analysis Technology, Inc............................................504 Meiji Techno America.................................................................613 Mentor Graphics.........................................................................117 Micromanipulator......................................................................721 MultiProbe, Inc...........................................................................303 Nanolab Technologies...............................................................421 Nanosurf Inc...............................................................................125 Neocera, LLC...............................................................................612 Nisene Technology Group..........................................................118 NIST/CNST...................................................................................625 Nordson DAGE............................................................................113 OKOS ..........................................................................................425 Olympus......................................................................................517 Oxford Instruments America.....................................................217 Precision Surfaces International...............................................126 Quantum Focus Instruments.....................................................110 Quartz Imaging Corp..................................................................225 RKD Engineering.........................................................................417 Sage Analytical Lab, LLC............................................................716 Robson Technologies, Inc..........................................................505 SAMCO, Inc. ................................................................................516 SEMICAPS....................................................................................424 South Bay Technology...............................................................720 Semitracks, Inc...........................................................................725 Sonoscan, Inc.............................................................................520 SPI Supplies................................................................................316 Synopsys Inc. .............................................................................519 Ted Pella, Inc..............................................................................127 TeraView.....................................................................................503 TMC Ametek................................................................................726 Tescan USA Inc...........................................................................325 Trion Technology........................................................................202 ULTRA TEC Manufacturing, Inc..................................................109 Varioscale, Inc. ...........................................................................717 WinTech Nano-Technology Services Pte. Ltd. ..........................124 XEI Scientific, Inc........................................................................327 YXLON Feinfocus.........................................................................502 Zurich Instruments AG...............................................................611 43 Picoammeter/Electrometer Reinvented. CONFIDENTLY MEASURE DOWN TO 0.01 fA AND UP TO 10 PΩ The Keysight B2980A Series brings you features that will boost measurement condence and unveil insights. Previously hidden true signals now can be detected thanks to battery operation for AC power line noise free measurement. Critical measurement phenomenon won’t be overlooked, thanks to real-time histograms and time-domain displays. And with setup integrity checker software you can easily isolate issues. So start taking sensitive measurements condently with the world’s most precise and accurate graphical picoammeters/electrometers. Keysight B2980A Series Picoammeters/Electrometers Battery option models: yes Real-time histogram and time domain viewer Current measure: 0.01 fA - 20 mA Resistance measurement: Up to 10 PΩ Voltage source: Up to ±1000 V Reading rate: Up to 20,000 rdg/s See more details with histogram view. View a video demo and more. www.keysight.com/nd/b2980a_info USA: 800 829 4444 CAN: 877 894 4414 Scan to view video demo. © Keysight Technologies, Inc. 2014 Company Descriptions Advanced Circuit Engineers, LLC Booth #719 www.acellc.net DCG Systems Booth #509 DCG’s high-performance systems address critical issues in semiconductor failure analysis, yield ramp, design debug and transistor characterization, empowering innovation for IDMs, wafer foundries and fabless chip companies worldwide. www.dcgsystems.com Agilent Technologies Booth # 610 Agilent Technologies, a leader in chemical and materials testing, provides a wide range of non-destructive testing solutions for polymers and advanced materials. Agilent’s bench, microscopy, and handheld FTIR solutions allows for the identification, contamination analysis, or degradation determination of materials at the sample site. www.agilent.com E.A. Fischione Instruments, Inc. Booth # 224 E.A. Fischione Instruments, Inc. designs, manufactures, distributes, and services advanced microscopy and nanotechnology devices for the global scientific community. Products include specimen preparation devices, imaging detectors, and specimen holders for electronics, energy, industrial, life sciences, and research. www.fischione.com Angstrom Scientific Inc. Booth #220 Angstrom Scientific, Inc. is pleased to feature Kleindiek nanomanipulators and probe stations. In addition, we distribute Hitachi TM3030 Tabletop SEMs, DENSsolutions In-Situ TEM holders, and NanoMegas Precession Electron Diffraction systems, as well as other principals in the electron microscopy market. www.angstrom.us Ebatco Booth # 607 Ebatco is a leading service lab that provides failure analysis for electronics, IC, and semiconductor industrial customers. Ebatco specializes in working with surfaces, interfaces, ultra-thin films, small volumes and miniaturized devices. Contact us for nanoscale analyses, material characterization, surface contamination issues, failure mode and root cause determination. www.ebatco.com Applied Beam Booth #616 Bruker Corporation Booth # 403 Bruker is a performance leader in life science and analytical systems. For over 50 years, Bruker has provided the best technological solutions for each analytical task. Trusted solutions include Optical and X-Ray Spectroscopy and Microanalysis in key applications: life science & materials research, nanotechnology, clinical research and more. www.bruker.com EDAX Inc Booth #724 EDAX is a leading provider of materials characterization encompassing Energy Dispersive Spectrometry (EDS), Wavelength Dis¬persive Spectrometry (WDS), Electron Backscatter Diffraction (EBSD) and Micro X-ray Fluorescence (XRF). The company designs, manufactures, distributes and services hardware/software solutions for a broad range of industries. www.edax.com Bset Eq Booth # 211 BSET EQ manufactures gas plasma systems and develops key process technologies used throughout the industries. Semiconductor related applications include plasma cleaning, package decapsulation or delayering for failure analysis, wafer level etching, and ashing or descum processes in single wafer or batch processes. http://www.bsetplasmas.com CAMECA Instruments, Inc. Booth #621 www.cameca.com Electron Microscopy Sciences Booth # 125 Electron microscopy sciences will have on display their complete line of accessories, chemicals, supplies and equipment for all fields of microscopy, biological research and general laboratory requirements. As well as our full line of tools, tweezers and dissecting equipment www.emsdiasum.com Carl Zeiss Microscopy, LLC Booth # 524 As the world’s only manufacturer of light, X-ray and electron/ion microscopes, ZEISS offers tailor-made microscope systems for industry, materials research and academia. A well-trained sales force, an extensive support infrastructure and a responsive service team enable customers to use their ZEISS microscope systems to their full potential. www.zeiss.com/microscopy Evans Analytical Group Booth # 915 EAG is the leading commercial service organization uniquely bringing the broadest set of Electrical Test, Failure Analysis, Reliability and Materials Analysis expertise to a range of markets and technologies. EAG can help reduce cycle time and cost of New Microelectronic Product introduction and support your test and analysis needs. www.eag.com/mte Checkpoint Technologies, LLC Booth #203 Checkpoint Technologies designs and builds industry lead-ing tools and solutions for laser scanning, photon emission and laser probing applications. Its proprietary SIL technology enables failure analysis and debugging of the smallest IC structures. Its optics are designed for applications at 32 nm and beyond with voltages as low as 600mV www.checkpointtechnologies.com EXpressLO LLC Booth #608 Offers expert lift-out specimen preparation instrumenta-tion and training with the new patent pending EXpressLO(TM) solution, method, and grids. EXpressLO(TM) negates the need for a carbon film, allowing for plasma cleaning, further FIB milling, and routine backside manipulation for curtain-free FIB milling. www.EXpressLO.com 46 Realtime_Convergence.indd 1 9/12/14 3:11 PM Company Descriptions HiLevel Technology, Inc. Booth #310 HiLevel Technology, Inc. is a privately-held company headquartered in Irvine, California. We have been building world-class test equipment since 1979. Our goal has always been to offer the best systems at the most affordable cost, and to provide unsurpassed support. HiLevel is classified as “small business”, and the advantages of this tight-knit are reflected in our swift response to customer needs. www.hilevel.com FA Instruments Inc. Booth #209 FA Instruments provides solutions for FA with SIFT (Stim-ulus Induced Fault Test) and TOFSIFT (Time of Flight SIFT). We are innovators improving on traditional tools such as OBIRCH @ 1240nm and Emission Microscopy, including a wide range of lab services on our equipment. www.fainstruments.com for more info and access to past publications/patents. www.fainstruments.com FEI Company Booth # 402 Get accurate, high-quality answers in the lab or in the fab for optimizing IC design and production ramp. Industry-leading FEI sample preparation, imaging and analysis solutions combined with in-depth application expertise help you successfully perform electrical fault isolation and failure analysis, design improvements, reduce yield loss, and accelerate time-to-market for electronic devices. www.fei.com Hitachi High Technologies America, Inc. Booth # 119 Hitachi High Technologies America provides technologically advanced imaging solutions to the materials science, biological research, and academic and industrial manufacturing sectors. Our innovative and reliability-proven instrumentation includes SEM, analytical and biological TEM, dedicated STEM, FIB, Ion Milling instrumentation, Atomic Force and Scanning Probe microscopes, tabletop microscopes, and microanalysis sample prep systems. www.hitachi-hta.com Fraunhofer CAM Booth # 518 Based on twenty years of experience in microstructure diagnostics and material assessment for semiconductor technologies, microelectronic components, microsystems and nano-structured materials, Fraunhofer CAM is tying the entire flow from nondestructive defect localization to high precision target preparation right up to cutting edge nanoanalytics supplemented by micromechanical testing and numerical simulation. http://www.cam.fraunhofer.de/ HORIBA Scientific Booth #617 www.horiba.com/scientific ibss Group, Inc. Booth #218 ibss Group, Inc. developed and produced the GV10x, a new paradigm in situ downstream plasma asher. Competitively priced, the GV10x Downstream Asher reduces carbon and hydrocarbon contamination 10 to 20 times more effectively than traditional methods, at vacuum pressure safe for TEM operation. www.ibssgroup.com Gatan, Inc. Booth # 204 Gatan designs and manufactures instruments and products for advanced microelectronics testing and analysis in electron microscopy. Gatan’s products are used in a broad range of failure analysis applications, including those for semiconductors (micro- and nano-electronics), nano-materials, and optoelectronic devices. www.gatan.com IEEE Reliability Society Booth # 718 The Reliability Society is a technical Society within the IEEE, the world’s leading association for the advancement of technology. We are a volunteer group of professionals engaged in assuring reliability in the engineering disciplines of hardware, software, and human factors. The RS is focused on the broad aspects of reliability. rs.ieee.org Hadland Technologies Booth #713 Hadland Technologies provides high-quality, 3-D inspection services using X-ray computed tomography for use in research and development, failure analysis, and academia. X-ray CT is a nondestructive technique useful for material segmentation, porosity/inclusion analysis, geometric measurement, and defect detection. The company has over 20 years of experience in microfocus X-ray technology. www.hadtek.com IR Labs Booth # 627 IRLabs is a subsidiary of Infrared Laboratories; a premier designer, supplier, and integrator of cryogenic systems, Infrared Detectors, IR and NIR low light level imaging for astronomy, aerospace, IR and Photon Emission Microscopes for semiconductor applications, founded 1967. irlabs.com Hamamatsu Corporation Booth # 103 Hamamatsu Corporation is the North American subsidiary of Hamamatsu Photonics K.K. (Japan), a leading manufacturer of devices for the generation and measurement of infrared, visible, UV light, and x-rays. We offer specialized systems for semiconductor failure analysis and other applications. We also offer photomultiplier tubes, photodiodes, image sensors, cameras, and light sources. www.hamamatsu.com JEOL USA, Inc Booth # 213 High resolution electron microscopes and tools for failure analysis, materials research, product inspection, nanotech and semiconductor R&D. Research-grade LV and FE-SEMs for nano observation/analysis; TEMs for atomic level resolution imaging & high speed mapping; Surface analyzers for characterization; New benchtop EDXRF spectrometer for elemental composition; SEM and TEM sample prep. www.jeolusa.com HDI Solutions – Hitachi Booth #727 www.hdi-solutions.com 48 Fault Isolation Precision ITRS 2011 Line-width resolution < 100 nm 14 nm technology node qualified SEMICAPS Aplanatic SIL - being used by a leading manufacturer for the 14 nm technology node Resolution of better than 200 nm pitch (100 nm linewidth) SIL for imaging silicon wafer with a full backside thickness of up to 800 μm SIL can be used for both inverted and upright systems World’s Best Aplanatic SIL Click and move feature Company Descriptions JG & A Metrology Center Booth #619 www.jgarantmc.com Meiji Techno America Microscopes Booth # 613 Meiji Techno Co., Ltd. is the third-largest manufacturer of optical microscopes in Japan. Meiji Products come Limited Lifetime Warranty and is 100% MADE IN JAPAN. Meiji microscopes are built like a tank. Meiji Techno America has 80 different models that can easily be outfitted with a variety of cameras. www.meijitechno.com Keyence Corporation Booth #116 With over 20 years of development experience, Keyence Corporation is the world leader in digital microscopes and video microscopy systems. Offering four different microscope models for both industrial and life science research, these all-in-one units are designed to overcome the inadequacies of conventional microscopes and measurement systems. www.keyence.com/usa.jsp Mentor Graphics Booth #117 Software based yield inprovement. Mentor Graphics pro-vides comprehensive solutions for yield analysis, diagnosis, debug and characterization. For more information about how to leverage diagnosis of DFT based product test results to accelerate failure analysis and understand the cause of systematic yield, visit Mentor Graphics. www.mentor.com Keysight Technologies Booth # 308 Keysight Technologies, Inc. is a global electronic measurement technology and market leader helping to transform its customers’ measurement experience. Keysight provides electronic measurement instruments and systems and related software, software design tools and services used in the design, development, manufacture, installation, deployment and operation of electronic equipment. www.keysight.com Micromanipulator Booth #721 The first name in analytical probing, Micromanipulator delivers the tools and life cycle support the semiconductor industry depends on. Micromanipulator invented analytical probing in 1956. Since then we’ve established a significant global presence with a substantial product installation base. LatticeGear, LLC. Booth # 521 LatticeGear provides sample preparation solutions that offer high productivity and throughput enabling customers to obtain superior SEM and analytical results. Its cleaving tools and accessories offer a low cost of ownership with a high return on investment for semiconductor, solar and general materials laboratories. LatticeGear’s flagship product is the LatticeAx cleaving system. www.latticegear.com MultiProbe Booth # 303 Hyperion, the world’s most advanced nanoprober, is an essential electrical fault localization tool for today’s most demanding FA labs. Proven at 10nm, Hyperion is capable of detecting defects invisible to other fault isolation techniques (with superior SCM, C-V, Pulsed IV and PicoCurrent measurements) while enhancing throughput and ease of use. www.multiprobe.com Left Coast Instruments Booth #417 Left Coast Instruments exclusively offers the entire RKD Engineering product line worldwide. Our network of representatives and international distributors are highly knowledgeable in all aspects of these products and their applications. www.leftcoastinstruments.com Nanolab Technologies Booth #421 Nanolab Technologies’ new analytical lab provides opti-mum performance for all analytical services including: TEM/STEM/ EELS;SEM;EDS;XPS;DBFIB;CIRCUIT EDIT FIB;FA (electrical and physical); CSAM;2 AND 3D XRAY, etc. www.nanolab1.com Leica Microsystems Booth # 609 Leica Microsystems’ focus is to support our customers’ pursuit of the highest quality end result. Leica Microsystems provide the best and most innovative imaging systems to see, measure, and analyze the microstructures in routine and research industrial applications, materials science, quality control, forensic science investigation, and educational applications. http://www.leica-microsystems.com/ Nanosurf Inc. Booth #125 www.nanosurf.com Nisene Technology Group Booth #118 Nisene Technology Group is committed to providing innovative, high-quality products that address the changing needs of failure analysis professionals. Our mission is to continue to provide products and services that meet the requirements of our customers, and to offer fast, precise, reproducible sand safe package deprocessing. www.nisene.com Materials Analysis Technology, Inc. Booth #504 MA-tek is a world leading laboratory in Materials Analysis (MA). MAtek has successfully expanded to provide Failure Analysis(FA) and Reliability Test(RT) services as well. Up to now, MA-tek has set up 5 laboratories and 1 sales office worldwide, providing around-theclock services in logistic support and technical services. www.ma-tek.com NIST/CNST Booth #625 www.nist.gov/cnst 50 QuantumScope TM Failure Analysis Microscopes emmiTM Photoemission, XIVATM LSIM, and Thermal-HS Infrared Hot Spot Detection integrated into a core microscope solution µK hot spot sensitivity common on Thermal-HS Direct lens-to-sensor coupling allows installation of MWIR Thermal-HS hot spot detection on same microscope as NIR techniques XIVATM LSIM and emmiTM photoemission. Unique design allows overlay of highest resolution possible reference images to highest sensitivity data images for all techniques. Thermal-HS Hot Spot detection sensitivity driven by QFI’s unique Modulation Mode and new Pulse Sampling Thermography (PST) Mechanical Platform Solutions — LabWalkerTM portable, probe station, ATE docking QFI QuantumScopeTM is the most sensitive and efficient F.A. microscope available for detecting: Portable LabWalkerTM creates bridge between applications and labs. ohmic shorts impedance issues leakage currents leaky capacitors oxide defects damaged junctions resistive vias CMOS latch up ESD damage dynamic failures speed path issues Quantum Focus Instruments Corporation QuantumScopeTM in probe station configuration offers ultimate F.A. lab efficiency. 2385 La Mirada Drive • Vista CA 92081 Phone: +1 (760) 599-1122 Fax: +1 (760) 599-1242 e-mail: sales@quantumfocus.com http://www.quantumfocus.com Company Descriptions Quartz Imaging Corporation Booth # 225 Quartz Imaging Corp. provides Specialized Solutions for Electronic Device Labs & Analysis. Quartz FA-LIMS is the only Laboratory Information Management System build specifically for Failure Analysis and Material Characterization Labs. RE-LIMS is designed for Reliability and QA Labs. PCI-AM version 2.0 Automated Measurement software is designed for semiconductor features. www.quartzimaging.com Neocera, LLC Booth # 612 Magma Electrical Fault Isolation is a dual magnetic field imaging system that can find Shorts, Leakages (Magnetic Current Imaging) & Opens (Space Domain Reflectometry) with a sensitivity of 500nA and with a front side die resolution of less than 500nm; making it the best nondestructive 3D Fault Isolation tool. www.neocera.com Nordson DAGE Booth # 113 Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN) manufactures and supports a complete range of award winning X-ray inspection systems and bondtesters for the PCBA and Semiconductor industries which are recognized as the Industry Standard. The excellence of their engineered products is at the core of their success. www.nordsondage.com RKD Engineering Corporation Booth # 417 RKD Engineering Corporation designs and manufactures Semeconductor Test Equipment. Elite Etch, Elite Etch-Cu, Elite Etch Cu ESD, MicroMill, NanoPrep w/MountPlate, basic kit and one device kit, MountPlate, NanoMill, UltraPrepII with pneumatic backlash compensation Includes MountPlate,basic kit and one device kit UtraPrepII w/MountPlate basic kit and one device kit. Warranties provided. www.rkdengineering.com OKOS Booth #425 Providing comprehensive solutions for integrity assessment and failure analysis of Semiconductor Packages, OKOS is a premier manufacturer of custom designed and precision engineered systems and components for Scanning Acoustic Microscopy. Robson Technologies, Inc. Booth #505 Robson Technologies Inc. specializes in the design, manu-facture, and assembly of customizable hardware for testing IC packages, SoC modules, PCBs, and other electronics. Our parts are used for most test applications in labs worldwide. Test sockets, DUT boards, test fix¬tures, and peripherals all work together to provide a turnkey solution. www.testfixtures.com Olympus Booth # 517 Olympus Scientific Solutions Americas, a part of the global Olympus life science and industrial instrumentation business, delivers solutions for clinical, educational, and research microscopes, nondestructive testing equipment, and analytical instruments. Designed to contribute to the safety, security, quality and productivity of society, Olympus strives to enhance people’s lives every day. https://www.olympus-ims.com Sage Analytical Lab Booth # 716 Sage Analytical Lab is a world-class laboratory dedicated to providing the best-in-class analytical techniques using state of the art equipment for analyzing/diagnosing all levels of failures in today’s advanced electronic devices. With decades of collective practical expertise, we provide advanced procedures and methods to analyze and expose various failure sites. http://sagefalab.com/ Oxford Instruments America Booth #217 Oxford Instruments provides leading-edge tools that enable sample manipulation and materials characterization. Used on SEM, TEM & FIB systems, our EDS, WDS and EBSD microanalysis tools are used for failure analysis across a wide range of applications. Our OmniProbe tools are used for nanomanipulation, fabrication and sample lift-out. www.oxford-instruments.com Samco Inc. Booth # 516 SAMCO provides a wide selection of etching systems for deprocessing semiconductor and related devices. We offer a variety of cost-effective RIE and ICP etching systems for removal of passivation, ILD and metal layers in packaged devices, individual die, as well as for full 200 or 300 mm wafers. www.samcointl.com Precision Surfaces International Booth #126 Quantum Focus Instruments Corporation Booth # 110 QFI manufactures Failure Analysis (FA) and Temperature Measurement Microscope Systems. Our modular QuantumScope FA microscopes offer emmi photoemission, XIVA Laser Signal Injection, and Thermal-HS MWIR hot spot detection. Temperature measurement techniques include MWIR (InfraScope) and thermoreflectance (T°Imager). QFI systems have earned a strong reputation for flexibility, sensitivity, accuracy, and durability. www.quantumfocus.com SEMICAPS Booth # 424 SEMICAPS is a developer and manufacturer of world-leading fault localization and defect characterization equipment for the semiconductor industry. With the semiconductor technology node progressing towards 22 nm and 14 nm, more demand is anticipated for our leading edge machines to help customers analyze their advance node products. www.semicaps.com 52 Distributed in the US by: ProbeWorkstation Extreme precision, virtually no drift Ultra-compact, load-lockable platform with up to 27 axes The high-end solution for in situ electrical probing on 14 nm ... and beyond! See us at ISTFA Booth 220! Company Descriptions Semitracks, Inc. Booth # 725 Semitracks provides education and training to the semiconductor and electronics industry. We provide basic courses up through complex in-depth courses and consulting on a variety of topics from processing to packaging to reliability to test and FA. We also provide online training, custom websites, and webinars in these same areas. http://www.semitracks.com TESCAN USA Inc. Booth # 325 TESCAN USA is a leading supplier in North America of Scanning Electron Microscopes and Focused Ion Beam workstations. The quality, performance and reliability of our products are the foundation of our business, serving customers in academia, industry and the government sector. www.tescan-usa.com Sonoscan, Inc. Booth # 520 Sonoscan® is a leader and innovator in Acoustic Microscopy (AM) technology. Sonoscan manufactures acoustic microscope instruments and provides laboratory services to nondestructively inspect and analyze materials, devices, components and products. Sonoscan’s C-SAM® systems provide unmatched accuracy for the inspection of products for hidden internal defects, such as delamination, etc. www.sonoscan.com TMC Ametek Booth #726 www.techmfg.com Trion Technology Booth # 202 Trion Technology is an original equipment manufacturer of a wide variety of Plasma Etch (Reactive Ion Etch), Strip, and Plasma Enhanced Chemical Vapor Deposition tools for the Failure Analysis, Compound Semiconductor, MEMS and OptoElectronic markets. http://www.triontech.com South Bay Technology Booth #720 www.southbaytech.com ULTRA TEC Booth # 109 Manufacturer and Worldwide supplier of SAMPLE PREPARATION equipment & CONSUMABLES. Our ASAP-1 Selected Area Preparation equipment has become the the de-facto standard for BACKSIDE PREPARATION and MECHANICAL DECAPSULATION. ULTRAPOL Advance offers a clear technical advantage for IC DEPROCESSING & CROSS-SECTION POLISHING. See more at www.ultratecusa.com SPI Supplies Booth #316 Celebrating 40 years of excellence and innovation, SPI Supplies is a worldwide leading manufacturer and distributor of sample preparation equipment and consumable supply items for routine operation of microscopy laboratories. The Plasma Prep III Low Temperature Plasma Etcher offers a bench top solution for etching, cleaning and preparation needs. www.2spi.com Varioscale, Inc. Booth #717 www.varioscale.com Synopsys Inc. Booth #519 Synopsys provides products and services that accelerate innovation in the global electronics market. As a leader in electronic design automation (EDA) and semiconductor intellectual property (IP), Synopsys’ comprehensive, integrated portfolio of system-level, IP, implementation, verification, manufacturing, optical and fieldprogrammable gate array (FPGA) solutions help address the key challenges designers face such as power and yield management, system-to-silicon verification and time-to-results. www.synopsys.com WinTech Nano-Technology Services Pte. Ltd. Booth #124 www.wintech-nano.com XEI Scientific, Inc. Booth #327 XEI Scientific, Inc. manufactures and sells anti-contamination systems for the Electron Microscope Community. The Evactron(R) De-Contaminator line was introduced in 1999 and provides a faster and more complete cleaning process, solving hydrocarbon contamination problems in electron microscopes and other high vacuum systems. www.evactron.com Ted Pella, Inc. Booth #127 Ted Pella, Inc. is the premier manufacturer and distributor of consumable and specimen preparation equipment for electron microscopy, AFM and FIB. Ted Pella, Inc. also offers the most comprehensive selection of specimen mounts and holders for SEM and FIB systems. Distributors for the complete line of compact desktop Cressington EM coating systems. www.tedpella.com Yxlon FeinFocus Booth #502 YXLON is the leading supplier of industrial X-Ray inspection and CT solutions for the non-destructive testing of materials and electronics. The Y.Cheetah and Y.Cougar combine proprietary FeinFocus technology with advanced high-speed flat panel detector technology. Within seconds, the systems adapt between inspection tasks-failure analysis, research and development, process control and product testing including QuickScan mode. www.yxlon.com TeraView Booth #503 TeraView LTD is the world’s leading supplier of terahertz based equipment such as imaging, spectroscopy, and time domain reflectometry (TDR) systems; based in Cambridge, UK. The EOTPR 2000 was jointly developed with Intel to address the increasing challenges in isolating faults in advanced IC packages using the concept of THz based TDR technology. Zurich Instruments AG Booth #611 www.zhinst.com 54 300μm 0.2μm Highest Productivity Failure Analysis and Circuit Edit Solutions • Highest Throughput TEM Workflows • Highest Performance DualBeam Platforms • 14nm Circuit Edit Solutions • Revolutionary new Plasma FIB DualBeam Discover more at FEI.com/Electronics Products/Services Index Laser Signal Injection Microscopy Hamamatsu Corporation .................................................... 103 Analytical Probe Stations (instruments, equipment, accessories) Agilent Technologies ........................................................... 610 Electron Microscopy Sciences ............................................. 125 Evans Analytical Group ....................................................... 915 Fraunhofer CAM ................................................................... 518 JEOL USA, Inc ....................................................................... 213 Keysight Technologies ......................................................... 308 Meiji Techno America Microscopes ..................................... 613 MultiProbe ........................................................................... 303 Nordson DAGE ...................................................................... 113 Sage Analytical Lab ............................................................. 716 SEMICAPS ............................................................................. 424 ULTRA TEC ............................................................................ 109 Microanalysis and Digital Imaging Systems for Materials Analysis Asylum Research, an Oxford Instruments company .......... 217 E.A. Fischione Instruments, Inc. .......................................... 224 FEI Company ........................................................................ 402 Gatan, Inc. ............................................................................ 204 JEOL USA, Inc ....................................................................... 213 Leica Microsystems .............................................................. 609 Meiji Techno America Microscopes ..................................... 613 MultiProbe ........................................................................... 303 Nordson DAGE ...................................................................... 113 Olympus ............................................................................... 517 Quartz Imaging Corporation ............................................... 225 Sage Analytical Lab ............................................................. 716 TESCAN USA Inc. .................................................................. 325 ULTRA TEC ............................................................................ 109 Yxlon FeinFocus ................................................................... 502 Failure Analysis Laser Cutter: Micro Electronics Laser Sage Analytical Lab ............................................................. 716 ULTRA TEC ............................................................................ 109 Failure Analysis Test Sockets Evans Analytical Group ....................................................... 915 Sage Analytical Lab ............................................................. 716 Microhardness Testing Ebatco .................................................................................. 607 Nordson DAGE ...................................................................... 113 FTIR Equipment Agilent Technologies ........................................................... 610 Bruker Corporation .............................................................. 403 Evans Analytical Group ....................................................... 915 ULTRA TEC ............................................................................ 109 Microscopes (scanning electron, acoustic, confocal, upright, inverted & stereo) Agilent Technologies ........................................................... 610 Asylum Research, an Oxford Instruments company .......... 217 Carl Zeiss Microscopy, LLC .................................................. 524 E.A. Fischione Instruments, Inc. .......................................... 224 Electron Microscopy Sciences ............................................. 125 Evans Analytical Group ....................................................... 915 FEI Company ........................................................................ 402 Fraunhofer CAM ................................................................... 518 Hitachi High Technologies America, Inc. ............................ 119 JEOL USA, Inc ....................................................................... 213 Leica Microsystems .............................................................. 609 Meiji Techno America Microscopes ..................................... 613 MultiProbe ........................................................................... 303 Neocera, LLC 612 Olympus ............................................................................... 517 Sage Analytical Lab ............................................................. 716 Sonoscan, Inc. ...................................................................... 520 TESCAN USA Inc. .................................................................. 325 ULTRA TEC ............................................................................ 109 Image Analysis Systems & Software Agilent Technologies ........................................................... 610 Carl Zeiss Microscopy, LLC .................................................. 524 Gatan, Inc. ............................................................................ 204 IR Labs .................................................................................. 627 JEOL USA, Inc ....................................................................... 213 MultiProbe ........................................................................... 303 Neocera, LLC ........................................................................ 612 Nordson DAGE ...................................................................... 113 Olympus ............................................................................... 517 Quartz Imaging Corporation ............................................... 225 Sage Analytical Lab ............................................................. 716 Semitracks, Inc. ................................................................... 725 Sonoscan, Inc. ...................................................................... 520 ULTRA TEC ............................................................................ 109 Yxlon FeinFocus ................................................................... 502 Infrared Thermal Imaging Systems: Thermal Inducing Systems Agilent Technologies ........................................................... 610 Evans Analytical Group ....................................................... 915 IR Labs .................................................................................. 627 MultiProbe ........................................................................... 303 Sage Analytical Lab ............................................................. 716 ULTRA TEC ............................................................................ 109 Professional Society/Trade Association PublisherScanning IEEE Reliability Society ........................................................ 718 Specialized Objectives Meiji Techno America Microscopes ..................................... 613 Olympus ............................................................................... 517 ULTRA TEC ............................................................................ 109 56 SOFTWARE for a FASTER SMARTER LAB QUARTZ PCI-AM FA LIMS RE LIMS Automated Feature Measurement Designed for Failure Analysis Laboratories Reliability Laboratory LIMS System • SavesTime • IncreasesAccuracy IncreasesConsistency • EasyDataExportand ReportGeneration • 3EdgeDetection Techniques ► ► • ‘ImageSmart’Laboratory InformationManagement System • GenerateProjectsQuickly • FromJobRequesttoFinal Report • ManagePriorities& Resources • ImprovesLabEfficiency& Communication • TrackResults,Dates& Times • ImprovesLabManagement &Performance QUARTZ IMAGING CORPORATION SPECIALIZED SOLUTIONS FOR ELECTRONIC DEVICE LABS SeeusatISTFA-Booth#225 www.quartzimaging.com Products/Services Index Specimen Preparation Equipment E.A. Fischione Instruments, Inc. .......................................... 224 Electron Microscopy Sciences ............................................. 125 FEI Company ........................................................................ 402 Fraunhofer CAM ................................................................... 518 Gatan, Inc. ............................................................................ 204 Hitachi High Technologies America, Inc. ............................ 119 JEOL USA, Inc ....................................................................... 213 LatticeGear, LLC. .................................................................. 521 Leica Microsystems .............................................................. 609 Meiji Techno America Microscopes ..................................... 613 MultiProbe ........................................................................... 303 RKD Engineering Corporation ............................................. 417 Samco Inc. ............................................................................ 516 ULTRA TEC ............................................................................ 109 Fraunhofer CAM ................................................................... 518 Hitachi High Technologies America, Inc. ............................ 119 JEOL USA, Inc ....................................................................... 213 Leica Microsystems .............................................................. 609 Meiji Techno America Microscopes ..................................... 613 Olympus ............................................................................... 517 Sonoscan, Inc. ...................................................................... 520 Trion Technology ................................................................. 202 ULTRA TEC ............................................................................ 109 Testing Labs Ebatco .................................................................................. 607 Evans Analytical Group ....................................................... 915 Fraunhofer CAM ................................................................... 518 Meiji Techno America Microscopes ..................................... 613 MultiProbe ........................................................................... 303 Sage Analytical Lab ............................................................. 716 SEMICAPS ............................................................................. 424 Sonoscan, Inc. ...................................................................... 520 Yxlon FeinFocus ................................................................... 502 Surface Analysis Systems and Services Agilent Technologies ........................................................... 610 Ebatco .................................................................................. 607 FEI Company ........................................................................ 402 We are investing in your success Our vision is to create nanoscale imaging and analysis workflows that enable existing and new customers to innovate in science, technology, and production. Discover more at FEI.com 59 NEW Checkpoint Technologies, LLC. InfraScan™ ES-LW The Ultimate Emission Solution for Lower Voltage IC Designs New InfraScan ES-LW system was developed to offer better sensitivity for our customer's smaller geometries, lower voltage designs and architectures. Based on Checkpoint's Proprietary MCT Camera Design • Emission Detection Capabilities from 900nm to 2500nm • 25% Increase in Optical Resolution • Broadband 3.3 NA SIL Optimized to Operate in the Larger Wavelength Regime See us at ISTFA 2014 Booth # 203 Checkpoint Technologies, LLC 66 Bonaventura Drive San Jose, CA 95134 (408)-321-9780 www.checkpointtechnologies.com GE KR USA CN AP DECAPSULATION AND SAmPLE PrEP SOLUTIONS SESAMElaser TM Backside / Frontside / Cross Section SESAMEPLASMA TM SESAMEACID TM DC believes that applications knowledge and service support are the most important issues. We were the first to have found the most reliable recipe for openings of packages containing both coated and non-coated COPPER wires using an Automated Decapsulator (SesameACID777). SESAMEmechanical TM And first again now for SILVER wires. Why? We are a fabless company, and work directly with the manufacturers to develop the best methods using the four decapsulation techniques currently available. Our goal is to help you select the best technique for your next investment. With the largest technical network in the world, you can trust that we are here to help you. +33 (0) 231 354 354 - info@digit-concept.com - www.digit-concept.com I N T E R N AT I O N A L SYMPOSIUM FOR TESTING A N D FA I L U R E A N A LY S I S Advancing Technology Through Sample Preparation E X P L O R I N G T H E M A N Y FA C E T S O F FA I L U R E A N A LY S I S Complex Device Deprocessing GEORGE R. BROWN CONVENTION CENTER Follows Physical Profile for: The X-Prep™ 3D is a specialized CNC-based milling/grinding/polishing machine designed and engineered to support electrical and physical failure analysis techniques through high precision sample preparation. This easy-to-use, highly versatile system is capable of working with flat (2D) and convex/concave (3D) device profiles, providing unmatched precision and accuracy. LIT and TDR on Package Devices SIMS Backside Analysis HOUSTON, TEXAS USA NOVEMBER 9 – 13, 2014 High NA SIL Imaging X-Ray images Before After Stacked die deprocessing 8-layer die stack processed to die 7 Die 7 & 8 electrically intact Expose Cu pillars & solder interconnect All the Pieces of the Semiconductor Failure Analysis Community Are Coming Together Unmatched Precision Die & Package Deprocessing 3D profile of a concave device 3D profile of a convex device www.alliedhightech.com 2376 E. 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