Technological State 2014 receipt of information prepare the production creating films press drilling exposuring plating printing milling quality-management archiving logistic © 2014 by G&W Leiterplatten Dresden GmbH & Co. KG Technological State 2014 Our products: single and double layers (non plated drill), double layer (plated drill) multilayer spanning 30 layers flexible/ flexirigid boards copper thickness up to 400 µm HDI circuit smallest drill diameter 0.1 mm microvias, blind holes, buried holes, buried blind holes, stacked holes, backdrilling Impedance control, construction and measurement of testcoupon back panel in embossing technology galvanised or electroless nickel/gold, electroless pewter, ROHS or leaded HAL, chemical nickel/ palladium/ gold soldermasks and equipment printing in diverse colours via fillers, strippable paint, carbon, plugged vias maximum dimensions 490 x 570 mm board thickness from 0.10 mm to 5.0 mm | Image: depth milling, surface plated with galvanised gold | | background image: stacker in the wet | © 2014 by G&W Leiterplatten Dresden GmbH & Co. KG Technological State 2014 Circuit board dimensions: Maximum dimensions: Multilayer: Structural width: Circuit board thickness: Drilling diameter: Drilling: 490 mm x 570 mm up to 30 layers, more upon request up to 70 µm between 0.1 mm and 5.0 mm; beyond that, dependent on the product from 0.1 mm – 6.2 mm; diameters greater than 6.2 will be cut non-plated drilling / plated drilling / blind via / buried via/ backdrilling Contours: milling / scratching / plated contours / partially plated contours / plated depressions partially / plated depressions / phases / partial depth milling Materials: FR4, medium TG and high TG, PI, IMS, high frequenz and other materials | background image: NC miniature circuit breaker | © 2014 by G&W Leiterplatten Dresden GmbH & Co. KG Technological State 2014 Varnishes and Paints: Soldermask: via caster other soldermask via silkscreen depending on customer requirements Screen printing: Colour depending on customer requirements Protective lacquer: SD 2955 / SD 2954 Carbon printing: XZ 302 (coats) via screenprinting Insulation printing: depending on customer requirements | Image: circuit boards with different soldermask colours | | background image: lacquer casting machine | © 2014 by G&W Leiterplatten Dresden GmbH & Co. KG Technological State 2014 Surfaces: Hot Air Levelling – lead-free Hot Air Levelling Chemical pewter Chemical silver Chemical nickel/ palladium/ gold Chemical nickel/ gold Galvanized nickel/ gold Galvanized nickel | Background image: circuit boards with different surfaces | © 2014 by G&W Leiterplatten Dresden GmbH & Co. KG Technological State 2014 Quality and procedure control: Certified according to ISO 9001 2008 Certified according to DIN EN ISO 14001 : 2005 Electrical test according to IPC 9252A Automated optical inspection (AOI) Impedance control Micro-section control | Background image: circuit board in a flying probe tester | © 2014 by G&W Leiterplatten Dresden GmbH & Co. KG Technological State 2014 “To wish to progress is the largest part of progress!” Lucius Annaeus Seneca (4 BC - 65 AD) Research project „Sensormanschette“ - Integration of Piezo construction form in flexible/ flexirigid boards „NanoCuNi “ - Development and use of nano-coated Cu and Ni bonding wires for microelectronic connection technology. This projects are in collaboration with the TU Dresden/ Fraunhofer, IWM Halle, as well as with other industry-related partners. © 2014 by G&W Leiterplatten Dresden GmbH & Co. KG Technological State 2014 Contact: G&W Leiterplatte Dresden GmbH & Co. KG Heidelberger Straße 16 01189 Dresden, Germany Telephone: +49 (0) 351 40023-0 Fax: +49 (0) 351 40023-36 sekretariat@lp-dd.de © 2014 by G&W Leiterplatten Dresden GmbH & Co. KG www.lp-dd.de