SPHAMTL3D3A0F6A0D3 D ata Sheet AH351B_A Part Number : SPHAMTL3D3A0F6A0D3 2013/02/25/Rev.00 - 1 - SPHAMTL3D3A0F6A0D3 Introduction Part Number : SPHAMTL3D3A0F6A0D3 Exterior automotive lighting, Traffic lighting etc. Features Package : Phosphor Converted Amber LED Package View Angle : 135 ˚ Optical Efficiency : 75 lm/W at 350 mA Precondition : JEDEC Level 2a Dimension : 3.5 x 3.5 mm Luminous Flux : Typ. 80 lm at 350 mA ESD withstand Voltage : up to ±8KV [HBM] Reliability Test : AEC Q-101 qualified (T.B.D) Applications Traffic lights Exterior automotive lighting ( turn signal indicator ) Signal and symbol luminaire Environmental Compliance Samsung ELECTRONICS is compliant to the restrictions of hazardous substances in electronic equipment, namely, the RoHS, ELV, ISO14001 and REACH directives. Samsung ELECTRONICS will not intentionally supplement the restricted materials to the LED product : Cd,Pb,Hg,PBBs,PBDEs and Cr6+ 2013/02/25/Rev.00 - 2 - SPHAMTL3D3A0F6A0D3 Table of Contents Part Number Description ----------------------- 4 Characteristic ----------------------- 5 Typical Characteristic ----------------------- 5 Luminous Flux Bin ----------------------- 5 Forward Voltage Bin ----------------------- 5 Color Bin Definition ----------------------- 6 Absolute Maximum Rating ----------------------- 7 Typical Characteristic Graph ----------------------- 8 Mechanical Dimension ----------------------- 12 Soldering Condition ---------------------- 13 Packing Information ----------------------- 14 Product Labeling Information ----------------------- 16 Reliability Test Condition ----------------------- 17 Precaution for Use ----------------------- 18 Hazardous Substance Analysis ----------------------- 20 Revision History ----------------------- 21 Company Information ----------------------- 21 2013/02/25/Rev.00 - 3 - SPHAMTL3D3A0F6A0D3 Part Number Description The Part number designation is explained as follows : SP H AM T L3 D 3 A 0 AB C DE F GH I J K L Where: AB - designates company name and Samsung LED PKG (SP for Samsung LED PKG) C - designates power variant (H for automotive High Power) DE - designates color variant (AM for automotive Amber color) F - designates LED PKG version (T for initial version) GH - designates product configuration and type (L3 for 3535 Ceramic type) I - designates lens configuration (D for lens) J - designates Max.power (3 for 3 +0.5W) K - designates specific property (A for Revision symbol) L - designates CRI variant (0 for Discrete Color Type) 2013/02/25/Rev.00 - 4 - SPHAMTL3D3A0F6A0D3 Characteristics Typical Characteristics [Ts = 25℃][1] Parameter Symbol Value Unit Luminous Flux (IF = 350 mA) ΦV Typ. 80 lm Forward Voltage (IF = 350 mA) Vf Typ. 3.1 V Reverse Voltage(IR = 5 mA) VR Typ. 0.9 V Viewing Angle φ Typ. 135 Deg. Rth_J-S Typ. 7 K/W Thermal Resistance (Junction to Solder Point) [Ts = 25℃][1] Luminous Flux Bin[2] Symbol ΦV Condition IF = 350 ㎃ Bin Code D3 Min. Typ Max. D1 70 - 80 E1 80 - 90 F1 90 - 100 Condition Vf IF = 350 mA 2013/02/25/Rev.00 lm [Ts = 25℃][1] Forward Voltage Bin[2] Symbol Unit Bin Code F6 Min. Typ. Max. F3 2.8 - 3.1 J3 3.1 - 3.4 - 5 - Unit V SPHAMTL3D3A0F6A0D3 Color Bin Definition [Ts = 25℃][1] [3] Bin Symbol Condition Code Cx,Cy IF=350 ㎃ A0 Cx Cy 0.5499 0.5566 0.5651 0.5594 0.4249 0.4204 0.4288 0.4344 *Notes [1] The measurement condition means that temperature dependence is excluded by applying pulse current for under 25 ms. [2] Luminous flux measuring equipment : CAS140CT Tolerance : VF : ±0.1V, ΦV : ±7 % [3] Chromaticity coordinates : Cx, Cy according to CIE 1931. Cx and Cy tolerances are ±0.01, respectively. 2013/02/25/Rev.00 - 6 - SPHAMTL3D3A0F6A0D3 Absolute Maximum Ratings Parameter Symbol Value Unit Operating temperature range Top -45 ~ +125 ℃ Storage temperature range Tstg -45 ~ +125 ℃ Junction temperature Tjmax +150 ℃ IF 700 mA IF 100 mA Maximum Forward current[4] (Ts : 25 ℃)[5] Minimum Forward current[4] (Ts : 25 ℃)[5] Do not apply for Maximum Reverse current reverse current Maximum Transient Peaked current[6] (Ts : 25 ℃)[5] ESD Sensitivity[7] mA 1000 mA for ≤ 10 ms - ± 8.0 KV HBM mA *Note [4] Unpredictable performance may be resulted by driving the product at below Min. IF or above Max. IF. But there will be no damage to the product. [5] The measurement condition means that temperature dependence is excluded by applying pulse current for under 25 ms. [6] Duty 1/10 pulse with 10 ms. [7] It is included the device to protect the product from ESD. 2013/02/25/Rev.00 - 7 - SPHAMTL3D3A0F6A0D3 Typical Characteristics Graph Typical Spectrum [ IF = 350 mA, Ts = 25 °C ][8] Typical Chromaticity Coordinate Shift vs Forward Current [ IF = 350 mA, Ts = 25 °C ][8] *Notes [8] The measurement condition means that temperature dependence is excluded by applying pulse current for under 25 ms. 2013/02/25/Rev.00 - 8 - SPHAMTL3D3A0F6A0D3 Typical Relative Luminous Flux & Forward Voltage vs Forward Current [ IF = 350 mA, Ts = 25 °C ][9] 2013/02/25/Rev.00 - 9 - SPHAMTL3D3A0F6A0D3 Typical Relative Luminous Flux & Forward Voltage vs Temperature[9] Solder Pad Temperature (℃) Solder Pad Temperature (℃) Typical Chromaticity Coordinate Shift vs Temperature [ IF = 350 mA, Ts = 25 °C ][9] Solder Pad Temperature (℃) * Notes [9] The measurement condition means that temperature dependence is excluded by applying pulse current for under 25 ms. 2013/02/25/Rev.00 - 10 - SPHAMTL3D3A0F6A0D3 Typical Radiant Pattern X Max. Permissible Forward Current[10] * Notes [10] The measurement condition means that temperature dependence is excluded by applying pulse current for under 25 ms. 2013/02/25/Rev.00 - 11 - SPHAMTL3D3A0F6A0D3 Mechanical Dimension Tolerance : ±0.1mm [Top View] [Side View] [Bottom View] [Front View] * Note : The thermal pad is electrically isolated from the anode and cathode contact pads. Pick and Place Do not place pressure on the resin lens ("A") It is recommended to use a pick&place nozzle with inside diameter at 3.1 mm Electric Schematic Diagram Cathode ESD Protection Diode [ Circuit ] Material Information LED Package = Silicon resin covered White GaN LED on Ceramic Sub. Electrode PAD = Au Plated PAD This LED has built-in ESD protection device(s) connected in parallel to LED Chip(s). 2013/02/25/Rev.00 - 12 - SPHAMTL3D3A0F6A0D3 Soldering Conditions Pad Configuration & Solder Pad Layout Tolerance : ±0.1mm Bare copper pattern Recommended Solder Pad Reflow Soldering Condition (Pb Free) Reflow Frequency : 2 times max. Manual Soldering Condition Not more than 5 seconds @MAX300℃, under soldering iron.(one time only) 2013/02/25/Rev.00 - 13 - SPHAMTL3D3A0F6A0D3 Packing Information Taping[8] User feed direction → Cathode * Note [8] Unit : mm, LED taping quantity : 800EA / Reel. Reel [Unit : mm] A 180.0 B -3.0 2013/02/25/Rev.00 60.0 W1 C +1.0 13.0 ±0.3 - 14 - 13.0 ±0.5 W2 15.4 ±1.0 SPHAMTL3D3A0F6A0D3 Packing Process Dimension of Transportation Box in mm Width Length Height Remark 245 220 182 8 inch 2013/02/25/Rev.00 - 15 - SPHAMTL3D3A0F6A0D3 Product Labeling Information ABCDEF F3A0D1 SPHAMTL3D3A0F6A0D3 F3A0D1 Bin code 01 IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII SLAT94001 / 1001 / 800 pcs IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII Lot Number N.B) Denoted rank is the only example. Bin Code Structure AB : Forward Voltage(VF) Bin (refer to page. 4) CD : Color bin (Cx,Cy) (refer to page. 5) EF : Luminous Intensity(IV) Bin (refer to page. 4) Lot Number Structure The Lot number is composed of the following characters 123456789 / 1abc / 800 PCS No. Information 1 Production Site : S:SAMSUNG LED, G:GOSIN CHINA 2 LED 3 Product State A :Normality, B :Bulk, C :First Production, R :Reproduction, S :Sample 4 Year : U:2010, V:2011, W:2012 ... 5 Month : 1 ~ 9, A, B 6 Day : 1 ~ 9, A, B ~ V 789 Product number : 1 ~ 999 abc Reel Number : 1 ~ 999 2013/02/25/Rev.00 - 16 - SPHAMTL3D3A0F6A0D3 Reliability Test Conditions For detailed information please contact your SAMSUNG sales partner 2013/02/25/Rev.00 - 17 - SPHAMTL3D3A0F6A0D3 Precaution for Use 1) For over-current-proof function, customers are recommended to apply resistors to prevent sudden change of the current caused by slight shift of the voltage. 과전류 방지를 위해 전압의 미세한 이동에 의해 야기되는 전류의 순간 변화를 방지하기 위해 저항 등의 설치를 권장함. 2) This device should not be used in any type of fluid such as water, oil, organic solvent, etc. When washing is required, IPA is recommended to use. 제품은 물, 오일, 유기물과 같은 액체 타입에서의 사용은 제한되며, 세정이 필요할 시에는 IPA 사용을 권장함. 3) When the LEDs illuminate, operating current should be decided after considering the ambient maximum temperature. LED의 발광 시, 동작 전류는 주변 최고온도를 고려하여 결정되어야 함. 4) LEDs must be stored in a clean environment. If the LEDs are to be stored for 3 months or more after being shipped from Samsung Electronics, they should be packed by a sealed container with nitrogen gas injected.(Shelf life of sealed bags: 12 months, temp. ~40 ℃, ~90 %RH) LED의 보관은 청정한 환경에서 보존되어져야 하며, 만약 삼성전자로부터 공급받는 후 3개월 또는 그 이상 보관이 필요하다면 질소 가스를 동봉한 보존용기에 보관되어야 함. (보존 bag의 수명 : 12 개월, 보존 온도 ~40 ℃, 습도 ~90 %RH) 5) After storage bag is open, device subjected to soldering, solder reflow, or other high temperature processes must be: 보존 Bag이 개봉된 후에, 납땜이나 reflow등의 높은 온도에 노출되는 제품은 다음의 사항에 부합되어야 함. a. Mounted within 672 hours (28 days) at an assembly line with a condition of no more than 30 ℃/60 %RH, a. 제품은 30 ℃/60 %RH보다 같거나 낮은 조립조건에서 672시간 (28일)이내에 조립해야 함. b. Stored at <10 %RH. b. 10 % 이하의 상대습도에서 보관되어야 함. 6) Repack unused Products with anti-moisture packing, fold to close any opening and then store in a dry place. 사용하지 않은 제품은 방습팩에 넣어 개봉 부위를 닫아서 다시 포장한 후, 건조한 장소에서 보관할 것을 권장함. 2013/02/25/Rev.00 - 18 - SPHAMTL3D3A0F6A0D3 7) Devices require baking before mounting, if humidity card reading is >60 % at 23±5 ℃. 만약 습도표시카드의 수치가 23±5 ℃에서 60 % 이상이라면, 제품 실장 전에 baking하여야 함. 8) Devices must be baked for 1 hour at 65±5 ℃, if baking is required. 만약 baking이 필요하다면, 제품은 65±5 ℃에서 1시간 정도 baking 되어야 함. 9) The LEDs are sensitive to the static electricity and surge. It is recommended to use a wrist band or anti-electrostatic glove when handling the LEDs. LED는 정전기 및 서지에 민감한 제품이므로, LED 제품을 다룰 시에는 정전기 방지장갑이나 손목밴드를 사용하기를 권장함. If voltage exceeding the absolute maximum rating is applied to LEDs, it may cause damage or even destruction to LED devices. 만약 절대 허용치를 초과하는 전압이 LED에 가해지면, LED 소자는 파괴되거나 손상될 수 있음. Damaged LEDs may show some unusual characteristics such as increase in leak current, lowered turn-on voltage, or abnormal lighting of LEDs at low current. 손상된 제품은 누설전류의 증가, Turn on 전압의 저하, 저 전류에서의 점등불량 등의 이상 거동을 보일 수 있음. 10) VOCs (volatile organic compounds) may be occurred by adhesives, flux, hardener or organic additives which is used in luminaires (fixture) and LED silicone bags are permeable to it. It may lead a discoloration when LED expose to heat or light. VOCs (휘발성 유기 화합물) 는 등기구에 사용되는 접착제, Flux, 경화제, 유기물 첨가제에서 발생하여 LED 실리콘 봉지제를 투과하고, 빛 또는 열에 노출되었을 때 변색이 발생 할 수 있음. This phenomenon can give a significant loss of light emitted (output) from the luminaires (fixtures). 이러한 현상은 등기구로부터 나오는 빛의 중대한 손실을 줄 수 있음. In order to prevent these problems, we recommend you to know the physical properties for the materials used in luminaires, It requires to select carefully. 이러한 문제 발생 방지를 위해서, 등기구에 사용되는 자재에 대한 물성을 알고 주의하여 선택 되어야함. 2013/02/25/Rev.00 - 19 - SPHAMTL3D3A0F6A0D3 Hazardous Substance Analysis Report 2013/02/25/Rev.00 - 20 - SPHAMTL3D3A0F6A0D3 Revision History Date Revision History 2013.02.25 Initial Edition Author Drawn Approved H.J Park Y.T Kim Company Information US Samsung Semiconductor Inc., 3655 N. First Street, San Jose CA 95134, USA TEL. +1-408-544-4000 Europe Samsung Electronics Germany GmbH, Samsung House, Am Kronberger Hang 6, Schwalbach/Ts,Germany TEL. +49-6196-66-0 Japan Copyright @1995-2012 All rights reserved Samsung Electronics LED BUSINESS San #24, Nongseo-Dong, Giheung-Gu, Yongin-City, Gyeongii-Do 446-711 Korea http://www.samsung.com/sec/business/# Sales Contact : em.yeon@samsung.com 2013/02/25/Rev.00 Samsung Japan Corporation SLED Team 10F, Shinagawa Grand Central Tower 2-16-4, Kounan, Minato-ku, Tokyo 108-8240, Japan TEL. +81-3-6369-6327 China (Tianjin Office in China) Tianjin Samsung LED Co., LTD. Weisi (6th) Rd., Micro-Electronics Industrial Park, Xiqing District, Tianjin 300385, China TEL. +86-755-8608-5550 - 21 -
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