WIRELESS TC35668IXBG SINGLE CHIP CONTROLLER WITH DSP FOR BLUETOOTH V4.0 HANDSFREE SYSTEMS The TC35668IXBG is a highly integrated RFCMOS Bluetooth device which supports Bluetooth Classic (3.0+EDR) and Bluetooth Low Energy (LE) 4.0 standard. The device also contains an application MCU core, plus a built-in high performance DSP (Digital Signal Processor) for acoustic improvements of a hands-free system, including background noise reduction and echo cancellation. The TC35668IXBG contains numerous built-in profiles that enable the device to access a mobile handset, allowing functions such as SIM/phone book access, audio streaming and hands-free speech. Toshiba has tested the Bluetooth interoperability extensively. All Toshiba Bluetooth devices and software are Bluetooth Qualification Body (BQB) qualified. TC35668IXBG FEATURES • • KEY BENEFITS • • • • • • • • High-level system integration by: • Dual Mode core for classic and new Bluetooth 4.0 standard • DSP (Digital Signal Processor) contains built in algorithms for echo and noise cancellation • Cortex ® -M3 application MCU UART to DSP for tuning of echo cancellation and noise reduction acoustic parameters Embedded Bluetooth stack and numerous profiles for easy Bluetooth system design BQB qualified hardware and software for easy Bluetooth EPL Ultra low bill of materials due to very few external components Multiple programmable IO and serial communication ports On-chip voltage controller and low power modes Consumer and automotive qualification (AEC-Q100) • • • • • • • • • • Three core elements integrated: • System core: Cortex ® -M3 • Bluetooth core: ARM7TDMI-S® • DSP core: TeakLite-III® (208 MHz) Bluetooth core spec 3.0 and 4.0, EDR and LE support BT Class 2 support RX Sensitivity –91dBm (typ.) On–chip ROM and RAM On–chip balun, antenna switch, LNA, LDO Interfaces: 2 UARTs, SPI, I2S/PCM, GPIO Package: 97ball PVFBGA, 6mm x 6mm x 1mm, 0.5mm ball pitch Operational voltage: 1.2V and 3.3V AEC-Q100 automotive qualification available Support for AAC, MP3 decoding Support for SBC and mSBC speech codec TC35668IXBG BLOCK DIAGRAM BT Core SYSTEM Core AUDIO Core ARM7 Cortex-M3 DSP Mask ROM SRAM SRAM SRAM Boot ROM Trace UART EDR/LE Modem I2S/PCM RF Copyright 2015 TOSHIBA Corporation. Product specifications are all subject to change without notice. Product design specifications and colours are subject to change without notice and may vary from those shown. Errors and omissions excepted. UART/ I2C/SPI www.toshiba.semicon-storage.com/eu/wireless TC35668IXBG SUPPORTED PROFILES/PROTOCOLS Application Software, BT Driver and Profiles for BLE Classic PAN BNEP GOEP AVDTP AVCTP H D S S U I P N M H I D GATT Connection update Sync ML GAVDP SPP HFPv1.6 × With AT cmd ×2ch 2ch Service Database mSBC EC/NR SRC SBC MP3 AAC P OM B A2DP AVRCP P A A v1.5 P P P BLE ATT SMP RFCOMM L2CAP DID SDAP SDP GAP HCI (Host Controller Interface) TC35668IXBG EVALUATION KIT The kit enables you to quickly and easily evaluate the TC35668IXBG. A headset, speaker and microphone can be connected to the board. The kit comes with software to enable connection to a mobile phone for hands-free dialling, SIM/phonebook access and audio streaming. TEE V1.1 ARM7TDMI-S and Cortex are registered trademarks of ARM Limited (or its subsidiaries) in the EU and/or elsewhere. All rights reserved. CEVA and TeakLite-III are registered trademarks of CEVA. The Bluetooth® word mark and logos are registered trademarks owned by Bluetooth SIG, Inc. Copyright 2015 TOSHIBA Corporation. Product specifications are all subject to change without notice. Product design specifications and colours are subject to change without notice and may vary from those shown. Errors and omissions excepted. www.toshiba.semicon-storage.com/eu/wireless
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