TC35668IXBG - TOSHIBA Semiconductor & Storage Products

WIRELESS
TC35668IXBG
SINGLE CHIP CONTROLLER WITH DSP
FOR BLUETOOTH V4.0 HANDSFREE SYSTEMS
The TC35668IXBG is a highly integrated RFCMOS
Bluetooth device which supports Bluetooth Classic
(3.0+EDR) and Bluetooth Low Energy (LE) 4.0
standard. The device also contains an application
MCU core, plus a built-in high performance DSP
(Digital
Signal
Processor)
for
acoustic
improvements of a hands-free system, including
background noise reduction and echo cancellation.
The TC35668IXBG contains numerous built-in
profiles that enable the device to access a mobile
handset, allowing functions such as SIM/phone
book access, audio streaming and hands-free
speech.
Toshiba has tested the Bluetooth
interoperability extensively. All Toshiba Bluetooth
devices and software are Bluetooth Qualification
Body (BQB) qualified.
TC35668IXBG FEATURES
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KEY BENEFITS
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High-level system integration by:
• Dual Mode core for classic and new
Bluetooth 4.0 standard
• DSP (Digital Signal Processor) contains built
in algorithms for echo and noise cancellation
• Cortex ® -M3 application MCU
UART to DSP for tuning of echo cancellation and
noise reduction acoustic parameters
Embedded Bluetooth stack and numerous profiles for
easy Bluetooth system design
BQB qualified hardware and software for easy
Bluetooth EPL
Ultra low bill of materials due to very few external
components
Multiple programmable IO and serial communication
ports
On-chip voltage controller and low power modes
Consumer and automotive qualification (AEC-Q100)
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Three core elements integrated:
• System core: Cortex ® -M3
• Bluetooth core: ARM7TDMI-S®
• DSP core: TeakLite-III® (208 MHz)
Bluetooth core spec 3.0 and 4.0, EDR and LE
support
BT Class 2 support
RX Sensitivity –91dBm (typ.)
On–chip ROM and RAM
On–chip balun, antenna switch, LNA, LDO
Interfaces: 2 UARTs, SPI, I2S/PCM, GPIO
Package: 97ball PVFBGA, 6mm x 6mm x 1mm,
0.5mm ball pitch
Operational voltage: 1.2V and 3.3V
AEC-Q100 automotive qualification available
Support for AAC, MP3 decoding
Support for SBC and mSBC speech codec
TC35668IXBG BLOCK DIAGRAM
BT Core
SYSTEM Core
AUDIO Core
ARM7
Cortex-M3
DSP
Mask
ROM
SRAM
SRAM
SRAM
Boot
ROM
Trace
UART
EDR/LE
Modem
I2S/PCM
RF
Copyright 2015 TOSHIBA Corporation.
Product specifications are all subject to change without notice. Product design
specifications and colours are subject to change without notice and may vary from those
shown. Errors and omissions excepted.
UART/
I2C/SPI
www.toshiba.semicon-storage.com/eu/wireless
TC35668IXBG SUPPORTED PROFILES/PROTOCOLS
Application Software, BT Driver and Profiles for BLE
Classic
PAN
BNEP
GOEP
AVDTP AVCTP
H D S
S U I
P N M
H
I
D
GATT
Connection update
Sync ML
GAVDP
SPP HFPv1.6
× With AT cmd
×2ch
2ch
Service
Database
mSBC
EC/NR
SRC
SBC
MP3
AAC
P
OM
B
A2DP AVRCP
P A
A
v1.5
P P
P
BLE
ATT SMP
RFCOMM
L2CAP
DID
SDAP
SDP
GAP
HCI (Host Controller Interface)
TC35668IXBG EVALUATION KIT
The kit enables you to quickly and easily evaluate the TC35668IXBG. A headset, speaker and microphone can be
connected to the board. The kit comes with software to enable connection to a mobile phone for hands-free
dialling, SIM/phonebook access and audio streaming.
TEE V1.1
ARM7TDMI-S and Cortex are registered trademarks of ARM Limited (or its subsidiaries) in the EU and/or elsewhere. All rights reserved.
CEVA and TeakLite-III are registered trademarks of CEVA.
The Bluetooth® word mark and logos are registered trademarks owned by Bluetooth SIG, Inc.
Copyright 2015 TOSHIBA Corporation.
Product specifications are all subject to change without notice. Product design
specifications and colours are subject to change without notice and may vary from those
shown. Errors and omissions excepted.
www.toshiba.semicon-storage.com/eu/wireless