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LOCTITE ECCOBOND FP4531
CSP and Flip-Chip Underfill
KEY BENEFITS
The LOCTITE ECCOBOND FP4531 underfill
has high glass transition (Tg) and low
coefficient of thermal expansion (CTE)
Excellent thermal cycling improvement
Reliability
Improvement
along with fast-cure capabilities. This
High Tg and low CTE
combination of physical properties along
with excellent adhesion to a wide variety
of substrates, such as flex circuits, makes
Meets RoHS requirements
Environmentally
Responsible
Under 900 ppm total halogens
Compatible with no-clean solder flux
residues
LOCTITE ECCOBOND FP4531 the ideal
material for a variety of high-reliability
and flex-circuit applications.
Excellent adhesion to flex circuits
Rapid cure
Process Advantages
Non-contact dispensing capable
LOCTITE ECCOBOND FP4531 underfill is designed for improving thermal cycling performance on CSPs,
BGAs and other components in applications where the conditions extend up to 150°C.
LOCTITE ECCOBOND FP4531 also provides reliability enhancements on CSP and flip-chip components
where adhesion to flex circuits is critical.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Viscosity, Brookfield
- Cone & Plate, CP52, 25ºC, Speed 20 rpm
mPa•s (cP)
10,000
Filler Content
% Ignition
62
@ 25ºC, hours
24
@ -40°C
9 months
Pot Life
Shelf Life @ -40°C
TYPICAL PROPERTIES OF CURED MATERIAL
PRODUCT CHARACTERISTICS
Technology
Glass Transition Temperature (Tg) by TMA
Epoxy
Appearance
Black
Product
Features
Snap curable
Cure
Heat cure
Fast flow
Coefficient of Thermal Expansion, ppm/°C
Flexural Modulus
Extractable Ionic Content, ppm
°C
161
Below Tg
28
Above Tg
104
N/mm²
7,600
Chloride Cl—
20
Sodium Na+
5
Potassium K+
5
TYPICAL CURING PERFORMANCE
Gel Time @ 1210C
Minutes
6
Snap Cure Schedule @ 1600C
Minutes
7
The above cure profiles are guideline recommendations. Cure conditions (time and
temperature) may vary based on customers’ experience and their application requirements,
as well as customer curing equipment, oven loading and actual oven temperatures.
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