Download Report

Cree XLamp XP Family LEDs
®
CLD-AP25 Rev 12A
Soldering & handling
®
Introduction
Table of Contents
This application note applies to XLamp XP Family
Handling XLamp XP Family LEDs............................2
LEDs, which have order codes in the following fomat.
Circuit Board Preparation & Layouts.......................4
Case Temperature (Ts) Measurement Point..............4
XPxxxx-xx-xxxx-xxxxxx
Notes on Soldering XLamp XP Family LEDs..............5
Moisture Sensitivity.............................................6
This application note explains how XLamp XP Family
Low Temperature Operation..................................6
LEDs and assemblies containing these LEDs should be
XLamp XP Family LED Reflow Soldering
handled during manufacturing. Please read the entire
Characteristics....................................................7
document to understand how to properly handle
Chemicals & Conformal Coatings...........................8
XLamp XP Family LEDs.
Assembly Storage & Handling................................9
Tape and Reel................................................... 10
WWW.CREE.COM/XLMAP
Packaging & Labels............................................ 12
Copyright © 2008-2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®,
the Cree logo and XLamp® are registered trademarks of Cree, Inc. This document is provided for informational purposes only and is
not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com.
Cree, Inc.
4600 Silicon Drive
Durham, NC 27703
USA Tel: +1.919.313.5300
www.cree.com/xlamp
xlamp xp led soldering & handling
Handling XLamp XP Family LEDs
Manual Handling
Use tweezers to grab XLamp XP Family LEDs at the base. Do not touch the lens with the tweezers. Do not touch the lens
with fingers. Do not push on the lens.
Do not apply more than 1000 g of shear force directly onto the lens. Excessive force on the lens could damage the LED.
P
CORRECT
X
WRONG
Cree recommends the following at all times when handling XLamp XP Family LEDs or assemblies containing these LEDs:
•
Avoid putting mechanical stress on the LED lens.
•
Never touch the optical surface with fingers or sharp objects. The LED lens surface could be soiled or damaged,
which would affect the optical performance of the LED.
®
®
2008-2013
Cree,
All reserved.
rights reserved.
The information
in this document
is to
subject
to without
change notice.
withoutCree,
notice.
, logo
the Cree
logo and
aretrademarks
registered
Copyright © 2010
Cree, Inc.
AllInc.
rights
The information
in this document
is subject
change
theCree
Cree
and XLamp
areXLamp
registered
trademarks
of Cree, Inc.of Cree, Inc. This document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets
available at www.cree.com.
2
0.5
xlamp xp led soldering & handling
C5
6
4
3
2
NOTICE
ENTIAL. THIS PLOT AND THE INFORMATION
THIN ARE THE PROPRIETARY AND
INFORMATION OF CREE, INC. THIS PLOT
OPIED, REPRODUCED OR DISCLOSED TO ANY
D PERSON WITHOUTTHE WRITTEN CONSENT
REVIS
REV
DESCRIPTION
The following diagram shows an example of a pick & place tool to remove XLamp XP-C, XP-E and XP-G LEDs from the
factory tape & reel packaging.
All dimensions in mm
Tolerance: + 0.01
4
B
0.5
0.439
3.06
Top View
120°
Conical
A
SECTION A-A
Side View
THIRD ANGLE P
8
6
7
4
5
3
THE INFORMATION CONTAINED IN THIS DRAWING IS THE SOLE PROPERTY OF
COUNT ON TOOLS, INC. ANY REPRODUCTION IN PART OR WHOLE WITHOUT
THE WRITTEN PERMISSION OF COUNT ON TOOLS, INC. IS PROHIBITED.
Rev.
2
1
REVISIONS
DESCRIPTION
PRINT RELEASE
A
DATE
10/11/2011
The following diagram shows an example of a pick & place tool to remove XLamp XP-E2 and XP-G2
A LEDs from the factory
6
tape & reel packaging. The nozzle is implemented
in urethane.
5
4
D
A
All dimensions in mm
A
Tolerance: + 0.01
0.439
C
3.06
3.734
0.147
120°
Conical
SECTION BA-A
6
Top View
1.016
0.040THIRD ANGLE PROJECTION
Side View
SECTION A-A
5
FOR SHEET METAL PARTS ONLY
.X
±
.06
.XX ±
.03
.XXX ±
.010
X°
±
.5 °
SURFACE FINISH:
3ITEM
NO.
4
A
UNLESS OTHERWISE SPECIFIED
DIMENSIONS ARE IN INCHES
AND AFTER FINISH.
TOLERANCE UNLESS SPECIFIED:
.XX ±
.01
.XXX ±
.005
X°
±
.5 °
3.302
0.130
DATE
DRAWN BY
D. Seibel
10/15/09
CHECK
DATE
APPROVED
DATE
TITLE
MATERIAL
PEEK
SIZE
FINAL PROTECTIVE FINISH
SCALE
63
PART OR
IDENTIFYING NO.
NOMENCLATURE
OR DESCRIPTION
2
C
10.0
MATERIAL
SPECIFICATIO
PARTS LIST
UNLESS OTHERWISE SPECIFIED
DIMENSIONS ARE IN INCHES
TOLERANCES ARE:
DECIMALS
ANGLES
CAD GENERATED DRAWING,
DO NOT MANUALLY UPDATE
APPROVALS
XX = <MOD-PM>.002
<MOD-PM>DRAWN
1/2<MOD-DEG>
XXX = <MOD-PM>.001
CHECKED
XXXX = <MOD-PM>.0002
MATERIAL
FINISH
DATE
10/11/2011
RESP ENG
32
MFG ENG
QUAL ENG
HEW Led and Tip
SIZE
A
DWG. NO.
NOT ®SCALE DRAWING
®
2008-2013
Cree,
All reserved.
rights reserved.
The information
in this document
is to
subject
to without
change notice.
withoutCree,
notice.
Cree
, logo
the Cree
logo and
are
registered
CAD FILE:
SCALE
Copyright © 2010
Cree, Inc.
AllInc.
rights
The information
in this document
is subject
change
theDO
Cree
and XLamp
areXLamp
registered
trademarks
3
6
5
4 specifications, please
8
trademarks
purposes7 only and is not a warranty
or a specification.
For product
see the data2 sheets
of Cree, Inc.of Cree, Inc. This document is provided for informational
Tuesday, October 11, 2011
available at www.cree.com.
3
SH
1
1:16:44 PM
xlamp xp led soldering & handling
Circuit Board Preparation & Layouts
Printed circuit boards (PCBs) should be prepared and/or cleaned according to the manufacturer’s specifications before
placing or soldering XLamp XP Family LEDs onto the PCB.
The diagram below shows the recommended PCB solder pad layout for XLamp XP Family LEDs.
All dimensions in mm
Recommended PCB Solder Pad
Recommended Stencil Pattern
(hatched area is opening)
Case Temperature (Ts) Measurement Point
XLamp XP Family LED case temperature (Ts) should be measured on the PCB surface, as close to the LED’s thermal pad
as possible. This measurement point is shown in the picture below.
It is not required to use a solder footprint for the thermal pad that is larger than the XLamp XP Family LED itself. In
testing, Cree has found such a solder pad to have insignificant impact on the resulting Ts measurement.
®
®
2008-2013
Cree,
All reserved.
rights reserved.
The information
in this document
is to
subject
to without
change notice.
withoutCree,
notice.
, logo
the Cree
logo and
aretrademarks
registered
Copyright © 2010
Cree, Inc.
AllInc.
rights
The information
in this document
is subject
change
theCree
Cree
and XLamp
areXLamp
registered
trademarks
of Cree, Inc.of Cree, Inc. This document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets
available at www.cree.com.
4
xlamp xp led soldering & handling
Notes on Soldering XLamp XP Family LEDs
Notes on Soldering XLamp XP Family LEDs
XLamp XP Family LEDs are designed to be reflow soldered to a PCB. Reflow soldering may be done by a reflow oven or
by
placing
the PCBLEDs
on aare
hotplate
and to
following
thesoldered
reflow soldering
on the
previous
page.
XLamp
XP Family
designed
be reflow
to a PCB.profile
Reflowlisted
soldering
may
be done
by a reflow oven or
by
thesolder
PCB on
a hotplate
and following
soldering
profile
listed on
the previous page.
Do placing
not wave
XLamp
XP Family
LEDs. Do the
not reflow
hand solder
XLamp
XP Family
LEDs.
Do not wave solder XLamp XP Family LEDs. Do not hand solder XLamp XP Family LEDs.
P
P
CORRECT
CORRECT
X
WRONG
P
P
CORRECT
CORRECT
Solder Paste Type
Solder Paste Type
Cree strongly recommends using “no clean” solder paste with XLamp XP Family LEDs so that cleaning the PCB after
reflow
soldering
is not required.
CreeKester
uses the
solder
paste internally:
1
soldering
is not required.
Cree uses
r276following
solder paste
internally.
Indium Corporation of America® Part number 82676
•CreeSn62/Pb36/Ag2
composition
recommends the
following solder paste compositions: SnAgCu (tin/silver/copper) and SnAg (tin/silver).
• Flux: NC-SMQ92J
Solder
Paste Thickness
Cree recommends the following solder paste compositions: SnPbAg, SnAgCu and SnAg.
The choice of solder and the application method will dictate the specific amount of solder. For the most consistent
results, an automated dispensing system or a solder stencil printer is recommended. Cree has seen positive results
Solder Paste Thickness
using solder thickness that results in a 3-mil (75-μm) bond line, i.e., the solder joint thickness after reflow soldering.
The choice of solder and the application method will dictate the specific amount of solder. For the most consistent results,
an automated dispensing system or a solder stencil printer is recommended. Cree has seen positive results using solder
thickness that results in a 3-mil (75-μm) bond line.
P
P
CORRECT
CORRECT
X
X
WRONG
WRONG
1kester.com/Portals/0/documents/Electronic-Assembly-Materials.pdf
®
®
2008-2013
Cree,
Inc.
All reserved.
rightspurposes
reserved.
Theand
information
in this document
is to
subject
to without
change notice.
without
notice.
Cree
,see
thethe
Cree
logo and
aretrademarks
registered
Cree, Inc.
This
document
is provided
forAll
informational
only
is in
not
a warranty
orisasubject
specification.
For
product
specifications,
please
Copyright
© 2010
Cree, Inc.
rights
The information
this
document
change
Cree,
the
Cree
logo
and XLamp
areXLamp
registered
trademarks
Cree, Inc.
This document For
is provided
informational
purposes
only
and
is not
warranty or a specification. For product specifications, please see
theSilicon
data sheets
4600
Drive
data
sheets
available
at www.cree.com.
warrantyfor
information,
please
contact
Cree
Sales
atasales@cree.com.
of Cree,
Inc.of
available at
Durham, NC 27703
Copyright
©www.cree.com.
2008-2009 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo
USA Tel: +1.919.313.5300
and XLamp are registered trademarks of Cree, Inc. Other trademarks, product and company names are the property of their respective owners
5
www.cree.com/xlamp
and do not imply specific product and/or vendor endorsement, sponsorship or association.
4
CLD-AP25 Rev 3
xlamp xp led soldering & handling
Notes on Soldering XLamp XP Family LEDs (continued)
After Soldering
After soldering, allow XLamp XP Family LEDs to return to room temperature before subsequent handling. Premature
handling of the device, especially around the lens, could result in damage to the LED.
Cree recommends verifying the solder process by checking the consistency of the solder bond of several trial PCBs after
reflow. After shearing selected devices from the circuit board the solder should appear completely re-flowed (no solder
grains evident). The solder areas should show minimum evidence of voids on the backside of the package and the PCB.
Cleaning PCBs After Soldering
Cree recommends using “no clean” solder paste so that flux cleaning is not necessary after reflow soldering. If PCB
cleaning is necessary, Cree recommends the use of isopropyl alcohol (IPA).
Do not use ultrasonic cleaning.
Moisture Sensitivity
In testing, Cree has found XLamp XP Family LEDs to have unlimited floor life in conditions ≤30 ºC / 85% relative
humidity (RH). Moisture testing included a 168 -hour soak at 85 ºC / 85% RH followed by 3 reflow cycles, with visual
and electrical inspections at each stage.
Cree recommends keeping XLamp LEDs in their sealed moisture-barrier packaging until immediately prior to use. Cree
also recommends returning any unused LEDS to the resealable moisture-barrier bag and closing the bag immediately
after use.
Low Temperature Operation
The minimum operating temperature of these XLamp components is -40 °C. To maximize lifetime, Cree recommends
avoiding applications where the lamps are cycled on and off more than 10,000 cycles at temperatures below 0 °C.
®
®
2008-2013
Cree,
All reserved.
rights reserved.
The information
in this document
is to
subject
to without
change notice.
withoutCree,
notice.
, logo
the Cree
logo and
aretrademarks
registered
Copyright © 2010
Cree, Inc.
AllInc.
rights
The information
in this document
is subject
change
theCree
Cree
and XLamp
areXLamp
registered
trademarks
of Cree, Inc.of Cree, Inc. This document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets
available at www.cree.com.
6
xlamp xp led soldering & handling
XLamp XP Family LED Reflow Soldering Characteristics
In testing, Cree has found XLamp XP Family LEDs to be compatible with JEDEC J-STD-020C, using the parameters listed
below. As a general guideline, Cree recommends that users follow the recommended soldering profile provided by the
manufacturer of solder paste used.
Note that this general guideline may not apply to all PCB designs and configurations of reflow soldering equipment.
Profile Feature
Average Ramp-Up Rate (Tsmax to Tp)
Lead-Based Solder
Lead-Free Solder
3°C/second max.
3°C/second max.
Preheat: Temperature Min (Tsmin)
100 °C
150 °C
Preheat: Temperature Max (Tsmax)
150 °C
200 °C
60-120 seconds
60-180 seconds
183 °C
217 °C
60-150 seconds
60-150 seconds
215 °C
260 °C
10-30 seconds
20-40 seconds
6 °C/second max.
6 °C/second max
6 minutes max.
8 minutes max.
Preheat: Time (tsmin to tsmax)
Time Maintained Above: Temperature (TL)
Time Maintained Above: Time (tL)
Peak/Classification Temperature (Tp)
Time Within 5°C of Actual Peak Temperature (tp)
Ramp-Down Rate
Time 25 °C to Peak Temperature
Note: All temperatures refer to topside of the package, measured on the package body surface.
®
®
2008-2013
Cree,
All reserved.
rights reserved.
The information
in this document
is to
subject
to without
change notice.
withoutCree,
notice.
, logo
the Cree
logo and
aretrademarks
registered
Copyright © 2010
Cree, Inc.
AllInc.
rights
The information
in this document
is subject
change
theCree
Cree
and XLamp
areXLamp
registered
trademarks
of Cree, Inc.of Cree, Inc. This document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets
available at www.cree.com.
7
xlamp xp led soldering & handling
Chemicals & Conformal Coatings
Below are representative lists of chemicals and materials to be used or avoided in LED manufacturing activities. For a
complete and current list of recommended chemicals, conformal coatings and harmful chemicals consult Cree’s Chemical
Compatibility Application Note.2 The video at www.youtube.com/watch?v=t24bf9D_1SA illustrates the process Cree has
developed for testing the compatibility of chemicals and materials with LEDs. You should also consult your regional Cree
Field Applications Engineer.
Recommended Chemicals
In testing, Cree has found the following chemicals to be safe to use with XLamp XP family LEDS.
•
Water
•
Isopropyl alcohol (IPA)
Chemicals Tested as Harmful
In general, subject to the specifics in Cree’s Chemical Compatibility Application Note, Cree has found certain chemicals
to be harmful to XLamp XP family LEDs. Cree recommends not using these chemicals anywhere in an LED system
containing XLamp XP family LEDs. The fumes from even small amounts of the chemicals may damage the LEDs.
•
Chemicals that might outgas aromatic hydrocarbons (e.g., toluene, benzene, xylene)
•
Methyl acetate or ethyl acetate (i.e., nail polish remover)
•
Cyanoacrylates (i.e., “Superglue”)
•
Glycol ethers (including Radio Shack® Precision Electronics Cleaner - dipropylene glycol monomethyl ether)
•
Formaldehyde or butadiene (including Ashland PLIOBOND® adhesive)
2 Chemical Compatibility Application Note, AP63, www.cree.com/xlamp_app_notes/chemical_compatibility
®
®
2008-2013
Cree,
All reserved.
rights reserved.
The information
in this document
is to
subject
to without
change notice.
withoutCree,
notice.
, logo
the Cree
logo and
aretrademarks
registered
Copyright © 2010
Cree, Inc.
AllInc.
rights
The information
in this document
is subject
change
theCree
Cree
and XLamp
areXLamp
registered
trademarks
of Cree, Inc.of Cree, Inc. This document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets
available at www.cree.com.
8
xlamp xp led soldering & handling
Assembly Storage & Handling
Do not stack PCBs or assemblies containing XLamp XP Family LEDs so that anything rests on the LED lens. Force applied
to the LED lens may result in the lens being knocked off. PCBs or assemblies containing XLamp XP Family LEDs should
be stacked in a way to allow at least 2-cm clearance above the LED lens.
Do not use bubble wrap directly on top of XLamp XP Family LEDs. Force from the bubble wrap can potentially damage
the LED.
P
CORRECT
P
CORRECT
X
WRONG
®
®
2008-2013
Cree,
All reserved.
rights reserved.
The information
in this document
is to
subject
to without
change notice.
withoutCree,
notice.
, logo
the Cree
logo and
aretrademarks
registered
Copyright © 2010
Cree, Inc.
AllInc.
rights
The information
in this document
is subject
change
theCree
Cree
and XLamp
areXLamp
registered
trademarks
of Cree, Inc.of Cree, Inc. This document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets
available at www.cree.com.
9
Anode Side
(denoted by + and circle)
User Feed Direction
END
START
xlamp xp led soldering & handling
Tape and Reel
Loaded Pockets
Leader
Trailer
(1,000 Lamps)
400mm
160mm
(min)
of
All Cree carrier tapes conform to EIA-481D, Automated Component Handling Systems Standard. (min) of
empty pockets with
empty pockets
at least 100mm
with tape
All dimensionssealed
in mm.
sealed by tape
(20 pockets min.)
(50
empty
pockets min.)
XP-C, XP-E, XP-G
User Feed Direction
Cover Tape
Pocket Tape
6
NOTICE
CREE CONFIDENTIAL. THIS PLOT AND THE INFORMATION
CONTAINED WITHIN ARE THE PROPRIETARY AND
CONFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT
MAY NOT BE COPIED, REPRODUCED OR DISCLOSED TO ANY
UNAUTHORIZED PERSON WITHOUT THE WRITTEN CONSENT
OF CREE, INC.
5
4
3
2
ÓÉ Foxit PDF Editor ±à¼°æÈ¨ËùÓÐ (c) by Foxit Software Company, 2004
½öÓÃÓÚÆÀ¹À¡£
1
13mm
7"
D
D
XP-E2, XP-G2
6
NOTICE
CREE CONFIDENTIAL. THIS PLOT AND THE INFORMATION
CONTAINED WITHIN ARE THE PROPRIETARY AND
CONFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT
MAY NOT BE COPIED, REPRODUCED OR DISCLOSED TO ANY
UNAUTHORIZED
PERSON WITHOUT THE WRITTEN CONSENT
190
OF CREE, INC.
5
4
3
2
ÓÉ Foxit PDF Editor ±à¼°æÈ¨ËùÓÐ (c) by Foxit Software Company, 2004
½öÓÃÓÚÆÀ¹À¡£
1
16.40
D
C
D
C
16.40
190
61 +/-0.5
OD
7.5
C
+2.00
12.40
0
MEASURED AT HUB
''
C
B
B
13
61 +/-0.5
OD
12.40
7.5
''
MEASURED AT INSIDE EDGE
+2.00
12.40
0
MEASURED AT HUB
B
B
A
UNLESS OTHERWISE SPECIFIED
DIMENSIONS ARE IN
MILLIMETERS & BEFORE FINISH.
TOLERANCE UNLESS SPECIFIED:
.X ± 0.3
.XX ± .13
13
THIRD ANGLE PROJECTION
12.40
MEASURED AT INSIDE EDGE
X°
± 1°
FOR SHEET METAL PARTS ONLY
.X ± .25
.XX ± .10
X°
DRAWN BY
DATE
2012/5/25
LIUDEZHI
CHECK
DATE
APPROVED
DATE
4600 Silicon Drive
Durham, N.C 27703
Phone (919) 361-4770
A
TITLE
Reel,
MATERIAL
PS
SIZE
FINAL PROTECTIVE FINISH
± 2°
SCALE
C
7" x 12mm Wide
DRAWING NO.
2400-00005
REV.
B
SHEET 1 OF 1
1:2
6
4
3 to without
2Cree
1 registered
2008-2013
Cree,
All reserved.
rights 5reserved.
The information
in this document
is to
subject
change notice.
withoutCree,
notice.
the Cree
logo and
aretrademarks
registered
Copyright © 2010
Cree, Inc.
AllInc.
rights
The information
in this document
is subject
change
the
Cree, logo
and XLamp
areXLamp
trademarks
of Cree, Inc.of Cree, Inc. This document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets
available at www.cree.com.
A
UNLESS OTHERWISE SPECIFIED
DIMENSIONS ARE IN
MILLIMETERS & BEFORE FINISH.
TOLERANCE UNLESS SPECIFIED:
.X ± 0.3
.XX ± .13
®
DRAWN BY
LIUDEZHI
®
DATE
2012/5/25
CHECK
DATE
APPROVED
DATE
4600 Silicon Drive
Durham, N.C 27703
10
Phone (919) 361-4770
TITLE
A
6
6
5
5
NOTICE
6NOTICE
ONFIDENTIAL.
CREE
THISCONFIDENTIAL.
PLOT AND THE THIS
INFORMATION
PLOT AND THE INFORMATION
NED WITHIN CONTAINED
ARE THE PROPRIETARY
WITHIN
AREAND
THE PROPRIETARY AND
NOTICE
ENTIAL INFORMATION
CONFIDENTIAL
OF CREE,
INFORMATION
INC.PLOT
THIS AND
PLOT
OF CREE,
INC. THIS PLOT
CREE
CONFIDENTIAL.
THIS
THE INFORMATION
T BE COPIED,
MAY
REPRODUCED
NOT
BE COPIED,
OR DISCLOSED
REPRODUCED
TO ANY
OR DISCLOSED
TO ANY
CONTAINED
WITHIN
ARE
THE
PROPRIETARY
AND
ORIZEDCONFIDENTIAL
PERSON
UNAUTHORIZED
WITHOUT
THE
PERSON
WRITTEN
WITHOUT
CONSENT
INFORMATION
OF CONSENT
CREE,THE
INC.WRITTEN
THIS PLOT
E INC. MAYOF
CREE
INC.
NOT
BE COPIED,
REPRODUCED OR DISCLOSED TO ANY
4
4
5
3
3
4
2
2
1
REVISONS
3
REV
A
A
REV
1
REVISONS
2
REV
1
BY
DESCRIPTIONREVISONS
DESCRIPTION
Released
J.L.
Released
DESCRIPTION
DATE
APP'D
6/30/09
BY
DATE
J.L.
BY
6/30/09
DATE
DDS
DDS
C
Match
Match supplier
J.L.
AC supplier drawing
Released drawing
xlamp xp
led
soldering
&
handling
Zone A6, 2.15
tolerance
A6, 2.15
was was
± 2.1, tolerance
.10 .
was ±12/2/10 .10
Y.Gan
.
D
Dwas 2.1, Zone
10/21/10
Y.Gan
10/21/10
6/30/09
DDS
UNAUTHORIZED PERSON WITHOUTTHE WRITTEN CONSENT
OF CREE INC.
F
D
G
Tape and Reel - Continued
APP'D
Y.Gan
12/2/10
10/21/10 Y.Gan
Y.Gan
C Added pocketZone
Match
supplier
DDS
DDS
Zone C2,
dimensions.
C2, Added
pocketdrawing
dimensions.
Zone A6, 2.15 was 2.1, tolerance was ±
.10 .
12/2/10 Y.Gan
D
Zone
E A6, 2.10 was
Zone
2.15
A6, 2.10
was
2.15 1/3/11 J.M. DDS 1/3/11 J.M.
Zone
C2, Added
pocket
dimensions.
E
D
APP'D
DDS
DDS
E
Zone A6, 2.10 was 2.158/26/11
DDS
J.M.
ZoneFB5, Added tolerance
Zone B5, Added tolerance
DDS
DDS
D
to 4.39 and 3.75. to 4.39 and 3.75.
F
Zone B5, Added tolerance2/27/12
DDS
DC
DC
ADDED CATHODE
G
ADDED
AND ANODE
CATHODE
NOTE
AND ANODE
NOTE
to 4.39 and 3.75.
DC
G
ADDED CATHODE AND ANODE NOTE
1/3/11
8/26/11
J.M.
J.M.
8/26/11
2/27/12
J.M.
2/27/12
All Cree carrier tapes conform to EIA-481D, Automated Component Handling Systems Standard.
All dimensions in mm.
XP-C, XP-E, XP-G
1.50 +.10/-.00
C
1.50 +.10/-00
1.50 +.10/-.00
1.50 +.10/-00
1.50 +.10/-.00
C
B
B
C
1.50 +.10/-00
4.00 ±.10
4.00 ±.10
2.00 ±.10
2.00
±.10
4.00
±.10
1.75 ±.10
4.39 +.10/.00
4.39 +.10/.00
3.75 +.10/-.00
3.75 +.10/-.00
B1.75 ±.10
B
CATHODE SIDE
CATHODE SIDE
2.00 ±.10
B
4.39 +.10/.00
1.75 ±.10
3.75 +.10/-.00
B
CATHODE SIDE
12.00 Nominal
12.30 Max
12.00 Nominal
12.30 Max
12.00 Nominal
10.25 ±.10
12.30 Max
10.25 ±.10
10.25 ±.10
B
T 0.30 ±0.05
1.50 +.10/-.00Do
1.50 +.10/-.00
B
P2
2.0 ±0.05 (I)
8.00 ±.10
1.5
8.005 ±.10
±4.39
0.0 +.10/-.00
5
3.75 +.10/-.00
1.50 +.10/-.00
5.50 ±.10 Po
ANODE SIDE
5.50 ±.10
4.0 ±0.1 (II)
.30 ± .10
.30 ± .10
T 0.30 ±0.05
.30 ± 1.10
.55
±0.
0
Do
5.50 ±.10
4.39
Y +.10/-.00
B
P2
2.0 ±0.05 (I
E1
1.75 ±0.1
ANODE SIDE ANODE SIDE
8.00 ±.10
Y
5
3.75 +.10/-.00
4.39 +.10/-.00
3.75 +.10/-.00
8.7°
2.10 +.10/-.00
A
REF
8.7°
SECTION B-B
8.7°
2.10 +.10/-.00
REF
4.375
SECTION B-B
Bo
DRAWN BY
X
R0.2
REF
0.2mm
Do
1.5
5
4
P2
2.0 ±0.05 (I)
±0.
0
P1
Po
4.0 ±0.1 (II)
CATHODE SIDE
Y
5
SECTION X-X
REF
4.375
X
ANODE SIDE
P1
(II)
(III)
Ao
REF 0.59
4
P1
W
+/- 0.1
+0.0/-0.1
+/- 0.05
2.2
3.70
D1
2.40
1.5 MIN.
5.50
8.00
12.00
Y
R
Bo
Ko
F
(I)
+/- 0.1
REF
SECTION Y-Y
3.70
A
Fax (919) 313-5558
Y4600 Silicon Drive
Durham, N.C 27703
DRAWING NO.
SHEET
OF
DRAWING NO.
1
REV.
1 /1
SHEET
(IV)
SHEET
4.000
Ao
3.70
+/- 0.1
Bo
Ko
F
3.70
2.40
5.50
8.00
12.00
+/- 0.1
+0.0/-0.1
+/- 0.05
+/- 0.1
+0.3/-0.1
Measured from centerline of sprocket hole
to centerline of pocket.
Cumulative tolerance of 10 sprocket
holes is ± 0.20.
Measured from centerline of sprocket
hole to centerline of pocket.
Other material available.
SECTION X-X
Measured from centerline of sprocket hole
to centerline of pocket.
G
®
®
Ao 2010
3.70
+/0.1 All reserved.
2008-2013
Cree,
rights reserved.
The information
in this document
is to
subject
to without
change
without
notice.
, logo
the Cree
logo and
aretrademarks
registered
Copyright ©
Cree, Inc.
AllInc.
rights
The information
in this document
is subject
change
notice.
Cree,
theCree
Cree
and XLamp
areXLamp
registered
(II)
Cumulative tolerance
of 10 sprocket
trademarks
This document
is provided for informational purposes only and is not a warranty or
For product specifications, please see the data sheets
holesa
is ±specification.
0.20.
Boof Cree, Inc. 3.70
+/- 0.1
of Cree, Inc.
(III)
Measured from centerline of sprocket
available atKowww.cree.com.
2.40
+0.0/-0.1
hole to centerline of pocket.
F
5.50
+/- 0.05
11
(IV)
Other material available.
8.00
P1
+/- 0.1
W
12.00
+0.3/-0.1
1 /1
REV.
2402-00003
+/- 0.1
+0.3/-0.1
(I)
REV.
OF
1
1
P1
W
W
Ao
Phone (919) 313-5300
Fax (919) 313-5558
2
F(III)
Bo
X
R0.2
TYPICAL
Ko
SCALE
REF 0.59
4600 Silicon Drive
Durham, N.C 27703
Phone (919) 313-5300
1.5 MIN.
2402-00003
2402-00003
C Carrier
Tape,
G XPE
C
Ao
SURFACE FINISH: 1.6
3
4
T 0.30 ±0.05
4
2.2
Ko White,
5
5
XP-E High Efficiency
XP-E2,
XP-G2 4Y
D1
6
5
1.5
MIN.
SECTION Y-Y
6
4600 Silicon Drive
Durham, N.C 27703
Phone (919) 313-5300
D1 XPE
Carrier Tape, XPE
Carrier Tape,
Fax (919) 313-5558
C
R
6
SECTION Y-Y
0.2mm
Notes:
TYPICAL
1. 10 sprocket hole pitch cumulative
tolerance ±
R0.2
TYPICAL
Ko
E1
1.75 ±0.1
Notes:
Notes:
1. 10 sprocket hole1.pitch
10 sprocket
cumulative
holetolerance
pitch cumulative
±
tolerance ± 0.2mm
F(III)
Bo
DATE
DRAWN BY
UNLESS OTHERWISE SPECIFIED
UNLESS OTHERWISE SPECIFIED
D. Seibel
D. Seibel
6/30/09
DIMENSIONS ARE IN
DIMENSIONS
ARE IN 6/30/09
CHECK
DATE
CHECK
DATE
MILLIMETERS AND AFTER FINISH.
MILLIMETERS
AND AFTER FINISH.
TOLERANCE UNLESS SPECIFIED:
TOLERANCE UNLESS SPECIFIED: DRAWN BY
DATE
SPECIFIED
.XX ±
.25 UNLESS OTHERWISE
.XX
±
.25
APPROVED
APPROVED
DATE
DATE
D.TITLE
Seibel
6/30/09
DIMENSIONS
IN
TITLE
.XXX ±
.125
.XXX ±ARE .125
CHECK
DATE
X°
±
.5 °MILLIMETERSX°AND±AFTER
.5 FINISH.
°
THIRD ANGLE PROJECTION
THIRD ANGLE PROJECTION
MATERIAL
TOLERANCE
UNLESS
SPECIFIED:
FOR SHEET METAL PARTS
ONLY
FOR SHEET
METAL PARTS
ONLY MATERIAL
.XX
.25
APPROVED
DATE
.X
±
1.5
.X ±±
1.5
TITLE
DRAWING NO.SIZE
.XXX
.125
SIZE
.XX ±
.75
.XX ±±
.75
X°
± ± FINISH
.5.25
°
.XXX ±
.25
.XXX
FINAL
PROTECTIVE
FINAL PROTECTIVE FINISH
THIRD ANGLE PROJECTION
X°
±
.5 ° FOR SHEETX°METAL
± PARTS
.5 ° ONLY MATERIAL
SCALE
SCALE
1.6
1.6
.X FINISH:
±
1.5
SURFACE FINISH:
SURFACE
4.000
4.000
SIZE
.XX ±
.75
3
3
.XXX ± 2.25
FINAL PROTECTIVE 2
FINISH
X°
±
.5 °
X
A
DATE
4.375
R
2.10 +.10/-.00
SECTION B-B
G
OF
1 /1
xlamp xp led soldering & handling
Packaging & Labels
The diagrams below show the packaging and labels Cree uses to ship XLamp XP Family LEDs. XLamp XP Family LEDs are
shipped in tape loaded on a reel. Each box contains only one reel in a moisture barrier bag.
Unpackaged Reel
Vacuum-Sealed
Vacuum-Sealed
Moisture
Barrier Bag
Moisture Barrier Bag
Label
CREE
Binwith
Code Cree Bin
&
Barcode
LabelLot #
Code,
Qty,
Label with Cree Bin
Code, Qty, Reel ID
Label
with
Cree Bin
Label with
Customer
P/N, Qty,Qty,
Lot #, Lot
PO # #
Code,
Packaged Reel
Patent Label
Label with Customer Order
Label
with Cree Order Code,
Code, Qty, Reel ID, PO #
Qty, Reel ID, PO #
Label with Cree Bin
Code, Qty, Reel ID
Boxed Reel
Label with Cree Order Code,
Qty, Reel ID, PO #
Label with Cree Bin
Code, Qty, Reel ID
Patent Label
(on bottom of box)
®
®
2008-2013
Cree,
All reserved.
rights reserved.
The information
in this document
is to
subject
to without
change notice.
withoutCree,
notice.
, logo
the Cree
logo and
aretrademarks
registered
Copyright © 2010
Cree, Inc.
AllInc.
rights
The information
in this document
is subject
change
theCree
Cree
and XLamp
areXLamp
registered
trademarks
of Cree, Inc.of Cree, Inc. This document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets
available at www.cree.com.
12