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EPIC Members Event Report
Technical Conference: 9-13 March 2014
Exposition: 11-13 March 2014
Moscone Center, San Francisco, California, USA
http://www.ofcconference.org
Prepared by
Katarzyna Ławniczuk
JePPIX
Eindhoven University of Technology, the Netherlands
coordinator@jeppix.eu
www.jeppix.eu
About the EPIC Members Event Reports
Initiated by the founder of EPIC Dr. Thomas Pearsall in 2003, these reports are prepared by
members of EPIC to the benefit of the wider community. If you did not have a chance to attend
the event but would like to know some key highlight, this report is for you. Emphasis is placed
on exploring technical and business opportunities for the members of EPIC. If you are an event
organizer and would like your event covered by EPIC, if you would like to volunteer for writing
a report, or if you have any comments to this report, please contact info@epic-assoc.com.
Contents
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Overview . . . . . . . . . . . . . . . . . . . . . .
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2
Exposition and the EPIC pavilion . . . . . . . .
2
3
Technical sessions and workshops . . . . . . .
4
4
OFC in 2015 . . . . . . . . . . . . . . . . . . . . .
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ogy, and the second one on data centers as a network.
The OFC conference provided more than 100 technical sessions and invited over 120 speakers, featured
three showfloor theaters at two exhibition halls, short
courses, workshops and product showcases. The OFC
2014 was held in Moscone Center, in San Francisco,
California, USA, and in numbers it can be presented as:
• 5 intensive days
• 12700 attendees
• 550 exhibitors
• 11 parallel technical sessions
• 14 focused topics
• 17 tutorial presentations
• 120+ invited speakers
• 800 presentations
• 2 poster sessions
• 50+ short courses
• 13 workshops
• 5 show-floor panels
• 2 special symposia
• 1 rump session
Moscone Center in San Francisco
welcomes attendees of the OFC 2014 conference
and exposition.
• 8+ product showcases
The plenary session highlighted the network evolution and virtualization, telecom infrastructure and limits of fiber communication. The OFC trends reached
advanced packaging aspects to meet the latest three
dimensional packaging options for optical systems,
cloud computing and new requirements for the optically interconnected data center, optimized packetoptical solution for Ethernet, traffic management in
optical transport networks. Software defined networking (SDN) together with photonic devices seemed to be
key enablers for next generation solutions with higher
capacity, bandwidth management and network control.
Hot topics this year at the OFC technical presentations
included: optical access networks and FTTx technologies, optical and optoelectronic devices, photonic ICs,
datacom, optical processing and analog systems. In addition, a set of technical presentations were selected for
recording. These can be accessed by visiting the OFC
website: www.ofcconference.org.
1 Overview
The OFC (Optical Fiber Communication) conference
is the premiere event and exposition on optical fiber
communication, converging breakthrough research
& innovation, and setting future industry trends in
telecommunications, optical networking, fiber optics,
datacom and computing. OFC gives a strong technical
programme and valuable overview of current products
and services on the today’s market, focusing this year
on space-division multiplexing (SDM), silicon photonics, 1 Tb/s optical networking on the technical side,
while data centers, photonic integration, 100G+ coherent transmission and software-defined networking
(SDN) on the exhibit side. This year the technical programme included two special symposia, one on advanced electro-optic packaging and assembly technol1
The exposition hall: EPIC pavilion and EPIC members.
2 Exposition and the EPIC pavilion
More than five hundred companies exhibited their
products and services in two expo-halls in the Moscone
Center in San Francisco. Over 100 announcements
were made with latest news about optical transceivers,
100G coherent modules and deployments, data center
architectures, photonic ICs, software-based solutions.
The service provider summit keynote speaker, Randy
Nicklas (president and CTO, Windstream, USA) gave
a talk about evolving roles of packet optical and OTN
technologies. The key players in optical communication were present at the OFC, and among them, the
following EPIC members: 3SPGroup, Bright Photonics,
CEA-LETI, ficonTEC, Fraunhofer HHI, Huawei, JePPIX,
Oclaro, PhoeniX Software, SMART Photonics, SUSS MicroOptics, VLC Photonics, and Yelo.
2.1 Show floor and Market Watch
• Networks: discussing the future of the metro core
network and 400GE standardization;
• Data center & SDN: solutions for cloud computing
and SDN-enabled optical transport;
• FTTX: toward 100G and 400G optics and network
components, passive optical LAN and plastic optical
fiber technologies;
• Product showcases: transport SDN, next generation
optical network developments, 400GE technology,
lithium niobate film and their applications, compact
photonic ICs for 100G, advances in NG-PON2 implementation.
The Market Watch was composed of five panels:
• State of the industry: and shaping the future of
the optical communication, defining virtualized networks by software, reaching 100G market.
• What is happening for 100G and beyond ecosystem? Various topics on recent advances and trends
for digital coherent 100 Gb/s and beyond technologies, transport SDN for easier management;
The show floor programme and market watch were
held in three expo theaters. A number of panel discussions related to the future market trends and dominant
technologies were addressed, where companies provided insights through their active participation. Organizers offered a panel workshop on photonic startups
and entrepreneurship, as it was during the last OFC, in
2013. The show floor programming covered the following topics:
• Business: optical communication market, noting
that telecom services are worth $3.34 trillion worldwide, with optical networking systems and optical
components in the $15 billion+ range;
The EPIC pavilion at the OFC expo.
• Data center architecture and content delivery
strategies. Related to market transitions for 100G
optics and cloud computing, data centers virtualization and interconnects, giving optical technology
trends in data centers, proposing new architectures
with collapsed layers;
• 100G/400G Pluggable Optics and its enabling technologies. Latest status on various high-speed pluggable optics, including InP coherent modules for
200G, optical integration and low power DSP for the
next generation optics, reaching cost-efficiency for
100G/400G client optical interface and DWDM applications;
• PIC vs. Si Photonics: Hype or reality? Trends in
photonic integration technologies on indium phosphide and silicon, and merging these with intelligence and programmability, to reach for higher density, low power, high-capacity and cost efficiencies.
Giving conclusion that PICs are in the market now,
and have further application potential.
Market Watch and panel on PIC vs. Si Photonics.
In summary, and according to the panel discussion
“Buzz – A Real-Time Look at the News and Trends Happening at OFC”, the companies began to deliver their
promises from the last few years. 100G products and
services are available. 200G is just happening, while
400G seems to be around the corner. “Everything that
was promised is here or on its way”, said one of the
panel moderators (Julie Kunstler, Ovum).
2.2 Rump session on traffic growth
During the OFC 2014, a rump session questioned if the
traffic growth will break the Internet - and can optical
Rump session facing fiber capacity limits.
communication help? The session was moderated by
Andrew Lord (BT Innovate and Design, United Kingdom) and Jörg-Peter Elbers (VP Advanced Technology,
ADVA Optical Networking, Germany), and formed by
a wide discussion with the audience, and built around
the following topics:
• Will we face a fundamental fiber capacity limit?
• How much time and capacity can we win by optimizing networks?
• If operational cost is the dominant factor, how much
of a problem is fiber capacity then?
• What is the next innovation and technology step to
provide × 10 capacity?
• Can we improve existing infrastructure or are there
new technologies to leverage?
• Which optics and electronics do we need, in particular in which mix and integration depth?
During the rump session 100+ people showed up, while
the discussion took around 2 hours. It was clear that
there is a maximum amount of data to be transmitted in the C band, and without innovation the bandwidth costs will keep increasing, as well as optical devices costs. An optimized systems and network architectures, new fibre types utilizing SDM are one of the
solutions.
2.3 Photonic integrated circuit workshop
The workshop on photonic integration was organized
by 7 Pennies Consulting together with Si2, supported
by EPIC, on the evening of March 12th , and brought
together all Multi-Project Wafer (MPW) brokering organizations along with design automation tools, photonic design kit tools, design services, and packaging.
The workshop provided the audience, of more than 200
attendees, with a good overall picture of the state-ofart in PICs as well as how one can take advantage of
the existing suppliers, focusing on providing practical
information regarding the design considerations, material choices, and manufacturing processes needed to
create photonic ICs. During the workshop, brokers of
InP, Si and TriPleX technology platforms gave their presentations.
•
•
•
Photonic integrated circuit workshop.
This workshop was represented by a number of EPIC
members (LioniX, JePPIX, PhoeniX Software, VLC Photonics, Bright Photonics, Huawei, Technobis), and enriched by the user case presentations of companies
that participated in MPW runs to develop photonic ICs,
and these were Huawei, Technobis Fibre Technologies,
Morton Photonics, TeraXion.
3 Technical sessions and workshops
The technical programme at OFC 2014 was composed
of more than 800 presentations, selected based on high
quality standards. Two poster sessions were organized
in the expo hall, where more than 120 OFC articles were
displayed. Plenary sessions were featured by David D.
Clark (senior research scientist from MIT, USA), Gary
Smith (president and CEO of Ciena, USA), and Robert
W. Tkach (director in Alcatel-Lucent Bell Labs, USA).
3.1 Hot topics
• Radio-over-Fiber links and technologies, giving insights to 50-Gbps wireless transmission - M2D.2,
•
•
wireless link operation at 71-85 GHz E-band - M2D.4,
or optical system based on antenna polarization diversity - M3D.7.
Photonic ICs: including RF photonic devices: reconfigurable RF arbitrary waveform synthesis - Tu2A.2,
high-power microwave photonic devices - Tu2A.4, a
tunable Hilbert transformer - Tu2A.6; InP photonic
devices: WDM transmitter - Tu3H.2, multi-frequency
wavelength converter - Tu3H.3, optoelectronic circuit for 100G Ethernet - Tu3H.6; Si photonic devices:
monolithic coherent receiver - W1I.5, a CMOS platform for TB/s optical interconnects - Th1C.2, WDM
modulator array - Th1C.5, hybrid silicon photonics
integration - Th4G4.
High speed transmitters and receivers: presenting
reliability of VCSELs - M3G.2, and including sessions
related to photodetectors, like: 50 GHz waveguide
photodiode module - M2G.1, 80 GHz balanced pindetector chip - M2G.3;
Cloud and virtualized networks: covering the topics
of network virtualization - M2B.5 and survivability M2H.3, resilience to data loos in optical cloud networks - M2H.4, heterogeneous bandwidth provisioning for virtual machine migration and SDN-enabled
optical network - M3H.2, and towards software defined optical solutions - M3H.5.
Network planning, multi-layer networks and NGPON2: and strategies for next-generation flexible optical networks - M2B.1, metro transport architectures
- M3B.3, optimization of the networks -M3B.6, optical
component technology for NG PON2 systems - M3I.1.
Specialty fibers and nonlinear effects in optical
fibers: including dispersion fluctuation invariant
fibers - Tu2K.2, specialty fibers for sensor applications - Tu3K.1, plastic optical fibers - Tu3K.2, photonic crystal fibers with large mode area - Tu3K.6; as
well as covering the fiber nonlinear mitigation and
compensation - M3C field.
3.2 Workshops
Thirteen workshops were offered in the OFC 2014 programme, and the events covered the following topics: quantum cryptography, optical amplifiers for SDM,
100G interfaces for metro access, software-defined optical access, packaging and reliability of Si photonics,
commercial application of single-fiber SDM, DSP for
short reach applications. Apart from the workshops,
the attendees could gain insights into one of the fifty
topics discussed during the short courses. Among others: high-speed semiconductor lasers and modulators,
new developments in optical transport networking,
data center cabling, fundamentals of super computing,
wireless backhaul, hands-on polarization-related measurements, highly integrated monolithic photonic integrated circuits, microwave photonics, quantum cryptography and quantum information.
Poster session in one of the expo halls of the OFC.
• Enabling the cloud: datacenter network infrastructure. The symposium focused on challenges
while building cloud scale data centers, introducing modern network architectures, targeting highperformance services via optical layer programmability and virtualization, and extending SDN beyond the
data center walls.
3.4 Post-deadline session
The post deadline paper session ended OFC 2014 conference and exposition. 25 high-tech achievements
were presented, filling 3 presentation rooms to their
limits. Some of the top research contributions were:
multi-layer SDN on a commercial network control
platform - ThA.1, 30 Gbps optical link utilizing heterogeneously integrated III-V/Si photonics and CMOS
circuits - Th5A.6, 30.6 Tb/s full-duplex bidirectional
transoceanic transmission - Th5B.5, PIC-to-PIC experiment at 130 Gb/s - Th5C.2, ultra-compact InP transmitter at 244 Gb/s PDM-2ASK-2PSK modulation - Th5C.3.
3.3 Special symposia
Two special symposia were organized during the OFC
2014. They covered the following field:
• Advanced packaging and assembly technologies.
The symposium addressed the importance and challenges of packaging of photonic components and optical systems, their performance, power dissipation
and related costs. Some examples of chip-to-chip
optical interconnects, board-mounted optical assemblies, and high-density photonic interconnects were
demonstrated.
Post-deadline session: rooms filled to their limits.
4 OFC in 2015
The next year’s event of OFC technical conference and exposition will take place March 22nd - 26th in Los Angeles:
Technical Conference 22-26 March 2015
Exposition 24-26 March 2015
Los Angeles Convention Center
Los Angeles, California, USA
JePPIX is a broker that provides access to advanced fabrication processes for Photonic Integrated Circuits.
JePPIX aims at low-cost development of Photonic ICs and rapid prototyping via full-scale industrial Multi-Project
Wafer runs. JePPIX closely collaborates with Europe’s key players in the field of photonic integration, including
manufacturing and packaging partners, photonic CAD software partners, R&D labs and photonic IC design
houses. With JePPIX you can get access to the Indium Phosphide (InP)-based monolithic integration platforms
of Oclaro, Fraunhofer HHI and SMART Photonics and to the low-loss dielectric TriPleX waveguide technology of
LioniX. Contact JePPIX and get your photonic ICs fabricated. www.jeppix.eu
Multi-project InP wafer with photonic ICs
Research Projects:
ACTPHAST (Access CenTre for PHotonics innovAtion Solutions and Technology support) www.actphast.eu
LightJumps (An efficient and effective platform for the cooperation of photonic clusters and the exploitation of
the European SME potential) www.lightjumps.eu
MEMPHIS II (Merging Electronics and Micro and nano-Photonics in Integrated Systems) http://www.smartmixmemphis.nl
PARADIGM (Photonic Advanced Research and Development for Integrated Generic Manufacturing)
www.paradigm.jeppix.eu
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About EPIC – European Photonics Industry Consortium
EPIC is a membership-led not-for-profit industry association that promotes the sustainable development
of organisations working in the field of photonics.
Our members encompass the entire value chain
from LED lighting, PV solar energy, Silicon photonics, Optical components, Lasers, Sensors, Displays,
Projectors, Optic fiber, and other photonic related technologies. We foster a vibrant photonics ecosystem
by maintaining a strong network and acting as a catalyst and facilitator for technological and commercial
advancement. www.epic-assoc.com
EPIC Members (1 March 2014)
3S Photonics Group, ACREO, Advanced Fibre Optic Engineering, Aifotec Fiberoptics, AIM Infrarot-Module,
Aixtron SE, ALSI, ALEDIA, ALPHA Route des Lasers, Alphanov, ALTER Technologies, AMO, Amplitude Systèmes, art
photonics, ASE Europe, ASE Optics Europe, Australian National University, Avantes, BBright SAS, Bright Photonics,
CEA-LETI, CAILabs, Caliopa, CD6, Centre for Nanophotonics FOM, Centre for Physical Sciences & Technology,
Chalmers University of Technology, CIP, COBOLT, CMC Microsystems, COBRA Research School, CSEM, DAS
Photonics, DELTA Optical Filters, DIAFIR, Dilas Diodenlaser, Dow Corning, Edmund Optics, Eolite Systems, ESP
KTN, Exalos, FiconTEC, FOTONIKA-LV University of Latvia, Fraunhofer Institute for Solar Energy Systems ISE,
Fraunhofer Institute for Applied Optics and Engineering, Fraunhofer Institute for Laser Technology, Fraunhofer
Institute for Material and Beam Technology, Fraunhofer Institute for Reliability and Microintegration, Fraunhofer
Institute for Telecommunications Heinrich Hertz Institute, Glyndwr University, Integrated Photonics, Hamamatsu
Photonics, Haute Ecole ARC Ingénierie, Heraeus Noblelight, Heriot-Watt University, Hisilicon Technologies,
Horiba Scientific, Huawei, ICFO - Institute of Photonic Sciences, IDIL Fibres Optiques, IHP Leibnitz-Institut
für innovative Mkroelektronik, IKO Science, Imagine Optic, IMT Masken und Teilungen, Innolume, Institut
d’Optique Graduate School, INTEC Department of Information Technology, International Laser Center, IPHT
Leibniz Institute of Phhotonic Technology, IQE, IREC - Catalonia Institute for Energy Research, IXFIBER, JePPIX,
Konica Minolta, Laser & Medical Devices Consulting, LayTec, Lionix BV, Lithuanian Laser Association, Luger
Research, Messe Munich Laser World of Photonics, Microelectronics Institute of Barcelona, CSIC, Modulight,
Multiphoton Optics, Multitel, MW Technologies, Nanoscribe, Nanovation, Next Scan Technology, nLIGHT, NOVAE
Laser, Oclaro, Onefive, OPI Photonics, OpTecBB, Optoelectronics Research Centre Finland, Optoelectronics
Research Centre Zepler Institute, Opticsvalley, PhoeniX Software, Photonics Bretagne, Pie Photonics, PNO
Consultants, PolyPhotonix, Optitec, Powerlase Photonics, Prima Electro, Quantel, Resolution Spectra Systems,
Robert Bosch, Rofin Sinar Laser, SAES Getters, SAFC Hitech, Scuola Superiore Sant’Anna, SensUp, SMART
Photonics, SOITEC, SPI Lasers, SQS Fiberoptics, STMicroelectronics, Süss MicroOptics, SWISSPHOTONICS,
Technobis Group, Technospark Nanocenter, TEMATYS, Thorn Lighting, Tridonic, Technical University of Berlin,
TNO (Netherlands Organisation for Applied Scientific Research), Time-Bandwidth Products, Tyndall National
Institute, Umicore OEM, University College London, University of Barcelona, University of Reggio Calabria
DIIES, University of Nottingham, University of Sheffield, University Paderborn, u2t Photonics, VI Systems, variooptics, Vertilas, VLC Photonics, VTT Technical Research Centre of Finland, WJA Electron, Wroclaw University of
Technology, XiO Photonics, Yenista Optics, YELO, YOLE Développement, Zumtobel.
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